Infineon Technologies CY7C1512AV18-200BZC
- Part No.:
- CY7C1512AV18-200BZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1512AV18-200BZC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,540
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Product details
Overview
CY7C1512AV18-200BZC from Cypress Semiconductor is a 4M × 18 (72-Mbit), 1.8V QDR® II SRAM with dual independent read/write ports, 200 MHz clock operation (400 MT/s DDR), 1.5-cycle read latency with DLL enabled, and HSTL I/O compatible with VDDQ = 1.4–1.8V. It delivers concurrent high-bandwidth memory access for network packet buffering in telecom line cards.
For engineers reviewing the CY7C1512AV18-200BZC datasheet, CY7C1512AV18-200BZC pinout, CY7C1512AV18-200BZC application, or CY7C1512AV18-200BZC equivalent, key selection criteria include burst depth (2-word), echo clock support (CQ/CQ), byte write select (BWS[1:0]), DLL-controlled latency mode, and 165-ball FBGA (15 × 17 mm) mechanical compatibility.
Technical Context
The CY7C1512AV18-200BZC implements a synchronous pipelined QDR II architecture with physically separate read and write data paths, eliminating bus turnaround overhead. Its dual-clock domain uses K/K for address/data capture and C/C for output timing, enabling precise skew management via echo clocks CQ/CQ referenced to C/C.
Internally organized as two 2M × 18 arrays, it supports depth expansion via RPS/WPS port selects and byte-level writes using BWS[1:0] to control D[8:0] and D[17:9]. The DLL enables 1.5-cycle read latency at 200 MHz; when disabled via DOFF, it reverts to QDR I timing with 1-cycle latency up to 167 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (4M × 18 configuration) |
| Operating Frequency | 200 MHz clock → 400 MT/s DDR data rate |
| Read Latency | 1.5 cycles with DLL enabled; 1 cycle with DOFF = LOW |
| I/O Voltage | VDDQ = 1.4 V to 1.8 V; supports HSTL Class I |
| Burst Length | Fixed 2-word burst per access on both ports |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm; ball pitch 1.0 mm) |
| Core Supply | VDD = 1.8 V ± 0.1 V |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm footprint, 1.4 mm height, 1.0 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | Latched on rising edges of K/K; supports byte-write via BWS[1:0] |
| Q[17:0] | Synchronous read data output | Driven on rising edges of C/C; tristated automatically after burst |
| RPS / WPS | Port enable controls | Active-LOW synchronous selects for independent read/write initiation |
| BWS[1:0] | Byte write select | Active-LOW signals controlling D[8:0] (BWS0) and D[17:9] (BWS1) |
| K / K | Input clock pair | Rising edges latch all synchronous inputs (address, data, control) |
| C / C | Output clock pair | Rising edges drive Q[17:0]; used with CQ/CQ for flight-time deskew |
| CQ / CQ | Echo clocks | Free-running outputs synchronized to C/C; simplify high-speed data capture |
| ZQ | Impedance calibration input | Connects to external resistor to ground to tune Q/D output impedance to 0.2×RQ |
| DOFF | DLL disable control | Active-LOW pin forcing QDR I mode (1-cycle latency, ≤167 MHz) |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | IEEE 1149.1 compliant for test and debug |
Key Features
| Feature | Design Value |
|---|---|
| Independent read/write ports | Eliminates bus turnaround delay; enables true concurrent access without arbitration |
| 2-word DDR burst architecture | Delivers 36 bits per clock cycle (18-bit × 2) on each port at 200 MHz |
| Programmable DLL latency mode | Configurable 1.5-cycle (DLL ON) or 1-cycle (DOFF = LOW) read latency |
| HSTL Class I I/O with ZQ calibration | Ensures signal integrity across 400 MT/s interfaces; supports impedance matching to 50 Ω traces |
| Depth expansion support | RPS/WPS allows stacking multiple devices with independent port control |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in 10G/40G Ethernet switch ASIC interfaces. IC Role / Device Role / Timing Role: High-throughput, low-latency shared memory buffer between MAC and traffic manager blocks. Use Value: Concurrent 400 MT/s read/write eliminates serialization bottlenecks, enabling full line-rate forwarding. | Use Scenario: Frame buffering in OC-192 SONET/SDH framer modules requiring deterministic access timing. IC Role / Device Role / Timing Role: Dual-port SRAM acting as elastic store for jitter compensation and rate adaptation. Use Value: 1.5-cycle DLL latency ensures sub-8 ns read response time aligned to system clock domain. |
| Baseband Processing Cache | Test Equipment Pattern Memory |
Use Scenario: Temporary storage of FFT coefficients and channel estimation data in LTE eNodeB baseband processors. IC Role / Device Role / Timing Role: Low-power, high-bandwidth scratchpad memory interfaced to multi-core DSP subsystems. Use Value: 1.8V core + 1.4V I/O reduces dynamic power vs. 2.5V QDR I parts while maintaining 400 MT/s throughput. | Use Scenario: Storing stimulus/response vectors in high-speed ATE systems performing parallel device testing. IC Role / Device Role / Timing Role: Deterministic-access pattern memory synchronized to tester clock and strobe signals. Use Value: Echo clocks CQ/CQ enable precise capture alignment across 16+ parallel DUT channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-bit bus width (2M × 36); same 200 MHz/400 MT/s, but no DOFF pin or DLL disable mode | Requires redesign for x18-to-x36 bus mapping; lacks QDR I fallback mode | Select only when 36-bit interface and guaranteed DLL-on operation are required |
| ISSI IS61WV102418B | Asynchronous 1M × 18 SRAM; 15 ns access, no DDR, no echo clocks, no DLL | Lower bandwidth (≤67 MHz effective), no concurrent read/write, unsuitable for >1 Gbps interfaces | Consider only for cost-sensitive, non-real-time control-plane buffers where latency tolerance >20 ns |
Compared with IDT72T3615L10BG and IS61WV102418B, the CY7C1512AV18-200BZC uniquely combines x18 DDR concurrency, programmable DLL latency, echo-clock–assisted capture, and 165-ball FBGA compatibility-making it optimal for upgrade paths from QDR I or migration from legacy asynchronous SRAM in high-speed networking.
Availability
CY7C1512AV18-200BZC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and baseband processing cache requiring stable component supply and long-term industrial availability.
Supply support for CY7C1512AV18-200BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, automotive, and industrial systems.
The QDR® II SRAM product line targets high-speed deterministic memory interfaces in networking infrastructure, specifically addressing bandwidth-constrained applications requiring zero-turnaround concurrent access.
FAQ
What is the function of the DOFF pin on CY7C1512AV18-200BZC?
The DOFF (DLL Turn Off) pin is an active-LOW control that disables the internal Delay Lock Loop. When pulled LOW, the device operates in QDR I mode with 1-cycle read latency and maximum frequency reduced to 167 MHz. For standard QDR II operation at 200 MHz with 1.5-cycle latency, DOFF must be held HIGH via a ≤10 kΩ pull-up to VDDQ.
How does the ZQ pin affect signal integrity in high-speed designs?
The ZQ pin calibrates the output driver impedance of Q[17:0], CQ, and CQ to match the PCB trace impedance. Connecting ZQ to a precision resistor (e.g., 50 Ω) to ground sets output impedance to 10 Ω (0.2 × RQ). This minimizes reflections and improves eye diagram margins at 400 MT/s, especially critical in multi-drop or fly-by routing topologies.
Can CY7C1512AV18-200BZC operate in single-clock mode?
Yes - by connecting C and C to K and K respectively, the device enters single-clock mode. In this configuration, K/K clocks both input registers (D[17:0], A[20:0], RPS, WPS) and output registers (Q[17:0]). All timing references shift to K/K, and echo clocks CQ/CQ track K/K instead of C/C. This simplifies clock tree design but forfeits C/C deskew capability.
What is the purpose of BWS[1:0] in write operations?
BWS[1:0] are active-LOW byte write select signals that gate which 9-bit segments of D[17:0] are written: BWS0 controls D[8:0], BWS1 controls D[17:9]. When either is deasserted, the corresponding byte remains unaltered in memory. This enables efficient read-modify-write sequences without full-word reads, reducing bus traffic in partial-update scenarios like header editing in packet buffers.
CY7C1512AV18-200BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1512AV18-200BZC FAQ
1.How can I place an order for CY7C1512AV18-200BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1512AV18-200BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1512AV18-200BZC reliable?
The price and inventory of CY7C1512AV18-200BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512AV18-200BZC is usually 5 days.
3.What payment methods are accepted for CY7C1512AV18-200BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512AV18-200BZC transactions.
Note: Certain payment methods may incur a processing fee.
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CY7C1512AV18-200BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1512AV18-200BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1512AV18-200BZC?
For technical support, including CY7C1512AV18-200BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512AV18-200BZC requirements.
6.How does Aetrix verify that CY7C1512AV18-200BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1512AV18-200BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512AV18-200BZC meets industry standards.
7.What is the process for return or replacement of CY7C1512AV18-200BZC?
All CY7C1512AV18-200BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512AV18-200BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1512AV18-200BZC part is unused and in its original packaging.
Return procedure for CY7C1512AV18-200BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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