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Infineon Technologies CY7C1512AV18-200BZI

Part No.:
CY7C1512AV18-200BZI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1512AV18-200BZI.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,980

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Product details

Overview

CY7C1512AV18-200BZI from Cypress Semiconductor is a 4M × 18 (72-Mbit), 1.8V QDR® II SRAM with dual independent read/write ports, 200 MHz clock operation (500 MT/s DDR interface), 1.5-cycle read latency with DLL enabled, and HSTL I/O compatible with VDDQ = 1.4–1.8V. It delivers concurrent high-bandwidth memory access for network packet buffering in switch fabric controllers.

For engineers reviewing the CY7C1512AV18-200BZI datasheet, CY7C1512AV18-200BZI pinout, CY7C1512AV18-200BZI application, or CY7C1512AV18-200BZI equivalent, key selection criteria include burst depth (2-word), DLL-enabled timing mode, FBGA-165 package footprint, and QDR II-specific echo clock (CQ/CQ) support for source-synchronous data capture.

Technical Context

The CY7C1512AV18-200BZI implements a synchronous pipelined QDR II architecture with physically separate read and write data paths, eliminating bus turnaround overhead. Its dual-clock domain uses K/K for address/data input registration and C/C for output registration - enabling precise deskewing via complementary echo clocks CQ/CQ referenced to C/C.

Internally organized as two 2M × 18 arrays, it supports depth expansion via RPS/WPS port selects and byte-level write masking via BWS[1:0]. The DLL, controlled by DOFF, shifts read latency from 1 cycle (DLL off, QDR I mode) to 1.5 cycles (DLL on, QDR II mode) while maintaining full data coherency across concurrent accesses.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density72 Mbit (4M × 18 configuration)
Operating Clock200 MHz - defines maximum sustained transaction rate of 200 million operations per second
Data Rate500 MT/s - double-data-rate transfer on both read and write ports enables 9 Gbps aggregate bandwidth
Read Latency1.5 cycles (DLL enabled) - determines minimum time between RPS assertion and first valid Q[17:0] word
Supply VoltagesVDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O) - mandates separate power domains for logic and interface
Package165-ball FBGA (15 × 17 × 1.4 mm) - standard footprint for high-pin-count, high-speed memory placement
Interface StandardHSTL Class I - requires VREF = 0.75×VDDQ and ZQ calibration for impedance-matched signal integrity

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, RoHS-compliant, 0.8 mm ball pitch.

Pin/TerminalCircuit RoleDesign Meaning
D[17:0]Synchronous write data inputsLatched on rising edges of K/K; 18-bit parallel path for burst write transfers
Q[17:0]Synchronous read data outputsDriven on rising edges of C/C; tristated automatically when RPS is deasserted
RPS / WPSActive-low port select controlsEnable independent read/write initiation without shared control arbitration
BWS[1:0]Byte write select inputsMask D[8:0] (BWS0) and D[17:9] (BWS1); enable partial-word writes without read-modify-write
C / C, CQ / CQOutput clock and echo clock pairsC/C drive Q[17:0]; CQ/CQ track C/C phase for controller-side source-synchronous capture
ZQImpedance calibration referenceConnects to external resistor to ground to tune output driver strength to 0.2×RQ
DOFFDLL disable controlPull LOW to force QDR I mode (1-cycle latency, ≤167 MHz); pull HIGH for QDR II timing
TCK/TMS/TDI/TDOJTAG boundary-scan interfaceIEEE 1149.1 compliant test access port for production verification and debug

Key Features

FeatureDesign Value
Separate read/write data portsEnables true concurrent access - no bus turnaround delay or contention during full-bandwidth operation
2-word burst architectureGuarantees two sequential 18-bit words per access, simplifying burst-length alignment in packet engines
Echo clocks CQ/CQEliminates flight-time skew between clock and data at the controller, enabling reliable >400 MHz sampling
Variable-drive HSTL outputsAllows ZQ calibration to match PCB trace impedance, reducing reflections and timing jitter
On-chip DLL with DOFF controlProvides deterministic 1.5-cycle latency at 200 MHz while retaining backward compatibility with QDR I systems

Applications

Network Switch Fabric BufferingHigh-Speed Test Equipment Memory

Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet switches.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as a non-blocking, low-latency buffer between line cards and switching matrix ASICs.

Use Value: Concurrent read/write eliminates arbitration stalls, sustaining 9 Gbps throughput with sub-8 ns read-to-write turnaround.

Use Scenario: Capturing real-time waveform samples in automated test equipment with >200 MS/s sampling rates.

IC Role / Device Role / Timing Role: High-bandwidth acquisition memory interfacing directly to ADC output and FPGA processing logic.

Use Value: Echo clocks CQ/CQ allow FPGA to latch Q[17:0] with <±50 ps jitter margin at 200 MHz clock frequency.

Telecom Baseband ProcessingAvionics Data Recorder Buffer

Use Scenario: Temporary storage of OFDM symbol buffers in LTE/5G baseband units prior to FFT processing.

IC Role / Device Role / Timing Role: Burst-access memory staging IQ data between RF front-end and DSP cores using deterministic 1.5-cycle latency.

Use Value: DLL-enabled timing ensures consistent pipeline depth across temperature (-40°C to +85°C) and voltage (1.7–1.9V).

Use Scenario: Buffered logging of flight sensor telemetry in DO-254-certified avionics recorders.

IC Role / Device Role / Timing Role: Radiation-tolerant (industrial-grade) SRAM providing fault-isolated write buffering before flash archiving.

Use Value: Byte-write select (BWS[1:0]) enables selective update of timestamp fields without disturbing payload integrity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72T3615L10BG36-bit bus width, 10 ns access time, LVDS interface, no echo clocksRequires external clock forwarding; limited to ≤166 MHz effective rate due to single-ended timing marginSelect only if system uses LVDS signaling and does not require source-synchronous echo clock capture
ISSI IS61WV102418BAsynchronous interface, 10 ns access, 3.3V core/I/O, no DLL or burst capabilityCannot sustain concurrent read/write; lacks QDR timing model and echo clock supportOnly suitable for legacy designs where QDR II features are unused and bandwidth <1 Gbps suffices

Compared with IDT72T3615L10BG and IS61WV102418B, the CY7C1512AV18-200BZI uniquely delivers 500 MT/s DDR throughput with integrated echo clocks and DLL-controlled latency - essential for deterministic, high-throughput packet buffering where timing closure is critical.

Availability

CY7C1512AV18-200BZI is available at Aetrix Electronics and suitable for network switch fabric buffering, high-speed test equipment memory, telecom baseband processing, and avionics data recorder buffer applications requiring stable component supply and long-term industrial lifecycle support.

Supply support for CY7C1512AV18-200BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable solutions for industrial, automotive, and communications markets.

The CY7C1512AV18 belongs to Cypress's QDR II SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in networking and test instrumentation where bus turnaround overhead must be eliminated.

FAQ

What is the function of the DOFF pin on CY7C1512AV18-200BZI?

The DOFF (DLL Turn Off) pin is an active-low control that disables the internal Delay Lock Loop. When pulled LOW, the device operates in QDR I mode with 1-cycle read latency and reduced maximum frequency (≤167 MHz). For full QDR II performance at 200 MHz, DOFF must be pulled HIGH via ≤10 kΩ resistor to VDDQ.

How does the ZQ pin affect output driver strength?

The ZQ pin connects to an external resistor (RQ) tied to ground, enabling on-die calibration of output driver impedance. The device sets CQ, CQ, and Q[17:0] output impedance to 0.2 × RQ. If RQ = 50 Ω, output impedance becomes 10 Ω - matching typical 50 Ω transmission lines. Direct connection to VDDQ enables minimum impedance mode.

Can CY7C1512AV18-200BZI operate with a single clock domain?

Yes - the device supports single-clock mode using only K/K for both input registration and output timing. In this mode, Q[17:0] is clocked by K/K instead of C/C, and CQ/CQ are generated relative to K/K. This simplifies clock routing but sacrifices the deskew advantage of dedicated output clocks.

What is the purpose of BWS[1:0] in CY7C1512AV18-200BZI?

BWS[1:0] are active-low byte write select signals that gate D[8:0] (BWS0) and D[17:9] (BWS1) during write operations. When asserted, they enable writing to their respective 9-bit byte lanes; when deasserted, those bytes retain prior contents. This allows partial-word updates without read-modify-write cycles, critical for metadata field edits in packet buffers.

CY7C1512AV18-200BZI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1512AV18-200BZI FAQ

1.How can I place an order for CY7C1512AV18-200BZI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1512AV18-200BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1512AV18-200BZI reliable?

The price and inventory of CY7C1512AV18-200BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512AV18-200BZI is usually 5 days.

3.What payment methods are accepted for CY7C1512AV18-200BZI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512AV18-200BZI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1512AV18-200BZI?

CY7C1512AV18-200BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1512AV18-200BZI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1512AV18-200BZI?

For technical support, including CY7C1512AV18-200BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512AV18-200BZI requirements.

6.How does Aetrix verify that CY7C1512AV18-200BZI is sourced from the original manufacturer or authorized distributors?

All CY7C1512AV18-200BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512AV18-200BZI meets industry standards.

7.What is the process for return or replacement of CY7C1512AV18-200BZI?

All CY7C1512AV18-200BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512AV18-200BZI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1512AV18-200BZI part is unused and in its original packaging.

Return procedure for CY7C1512AV18-200BZI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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