Infineon Technologies CY7C1512AV18-250BZI
- Part No.:
- CY7C1512AV18-250BZI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1512AV18-250BZI.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,000
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Product details
Overview
CY7C1512AV18-250BZI from Cypress Semiconductor is a 4M × 18 (72-Mbit), 1.8V QDR® II SRAM with dual independent read/write ports, 250 MHz clock operation (500 MT/s DDR), 1.5-cycle read latency (DLL enabled), and 165-ball FBGA (15 × 17 × 1.4 mm) packaging. It delivers full data coherency and supports depth expansion via RPS/WPS for high-bandwidth networking buffer applications.
For engineers reviewing the CY7C1512AV18-250BZI datasheet, CY7C1512AV18-250BZI pinout, CY7C1512AV18-250BZI application, or CY7C1512AV18-250BZI equivalent, key selection criteria include its 2-word burst architecture, echo clock (CQ/CQ) support for timing deskew, HSTL-18 I/O compliance, DLL-controlled latency mode, and dual-clock domain (K/K, C/C) synchronization for concurrent access.
Technical Context
The CY7C1512AV18-250BZI implements a synchronous pipelined QDR II architecture with physically separate read and write data paths, eliminating bus turnaround overhead. Its internal 4M × 18 memory array is accessed via multiplexed address inputs latched on alternating edges of K/K clocks, enabling concurrent read and write initiation.
It uses two independent clock domains: K/K controls all synchronous inputs (address, data, control), while C/C governs output timing and echo clock generation. The integrated Delay Lock Loop (DLL) aligns CQ/CQ to C/C with sub-nanosecond phase accuracy, ensuring reliable data capture at 500 MT/s in high-speed systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (4M × 18 organization) |
| Operating Frequency | 250 MHz clock → 500 MT/s effective throughput per port |
| Read Latency | 1.5 cycles (DLL enabled); 1 cycle (DLL disabled via DOFF = LOW) |
| Supply Voltages | VDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O) |
| Burst Length | Fixed 2-word burst per access (36-bit total per cycle) |
| Output Interface | HSTL Class I compliant outputs with programmable drive strength |
| Timing Reference | Dual echo clocks (CQ, CQ) synchronized to C/C for receiver deskew |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | Latched on rising edges of K/K; supports byte-write via BWS[1:0] |
| Q[17:0] | Synchronous read data output | Driven on rising edges of C/C; tristated automatically when RPS deasserted |
| RPS / WPS | Port enable control | Active-low synchronous selects for independent read/write port activation |
| K / K | Input clock pair | Rising edges latch all synchronous inputs (address, data, control) |
| C / C | Output clock pair | Rising edges gate read data and echo clocks; used for flight-time deskew |
| CQ / CQ | Echo clock outputs | Free-running, phase-aligned copies of C/C for source-synchronous capture |
| DOFF | DLL control input | LOW disables DLL → reverts to QDR I timing (1-cycle latency, ≤167 MHz) |
| ZQ | Impedance calibration input | Connects to external resistor to ground to tune Q[17:0]/CQ/CQ output impedance |
Key Features
| Feature | Design Value |
|---|---|
| Independent Read/Write Ports | Enables true concurrent access without bus turnaround, critical for packet buffering in switch fabric |
| 2-Word Burst + DDR I/O | Delivers 9 Gbps aggregate bandwidth (500 MT/s × 18-bit × 2 words) per port |
| Integrated DLL with Echo Clocks | Eliminates board-level timing margining for >400 MHz data capture using CQ/CQ as strobes |
| Byte Write Select (BWS[1:0]) | Allows partial-word writes without read-modify-write cycles-reduces latency in header update operations |
| JTAG 1149.1 Test Access Port | Supports boundary scan testing and in-system debug of memory interconnect integrity |
Applications
| High-Speed Network Switch Buffer | Telecom Line Card Packet Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payload fragments in multi-gigabit Ethernet switches. IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between ingress parser and egress scheduler, synchronized by K/K and C/C clocks. Use Value: Concurrent read/write eliminates arbitration stalls, enabling line-rate forwarding at 10G/40G speeds with deterministic latency. | Use Scenario: Temporary storage of ATM cells or IP packets in carrier-grade DSLAM or OLT line cards. IC Role / Device Role / Timing Role: QDR II memory serving as traffic shaper buffer between framer and traffic manager ASICs. Use Value: 1.5-cycle latency and echo clock alignment ensure jitter-tolerant data capture across temperature and voltage variation. |
| Baseband Processing Memory | Test Equipment Pattern Generator |
Use Scenario: Holding channel estimation coefficients and FFT output buffers in LTE/5G baseband subsystems. IC Role / Device Role / Timing Role: High-throughput memory interfacing with FPGA-based DSP engines via dedicated read/write data paths. Use Value: Full data coherency guarantees most recent coefficient updates are always available for next processing cycle. | Use Scenario: Storing high-speed digital stimulus patterns in automated test equipment (ATE) pattern memory. IC Role / Device Role / Timing Role: Burst-access SRAM providing deterministic 500 MT/s pattern delivery to pin electronics (PE). Use Value: DLL-enabled timing precision ensures <±50 ps setup/hold margin at 500 MHz, meeting ATE signal integrity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-bit bus width (2M × 36), same 250 MHz speed, but uses SSTL_18 I/O, no echo clocks | Requires external deskew circuitry; less suitable for ultra-high-speed point-to-point links | Select when wider data path is needed and system-level timing budget allows added skew compensation. |
| ISSI IS61WV102418B | Asynchronous 1M × 18 SRAM, 15 ns access, no DDR, no DLL, single VDD = 3.3 V | Lacks concurrency and bandwidth; only viable for low-speed control-plane buffering | Choose only for cost-sensitive, non-real-time applications where 500 MT/s throughput is unnecessary. |
Compared with IDT72T3615L10BG and IS61WV102418B, the CY7C1512AV18-250BZI uniquely combines 72-Mbit density, true dual-port concurrency, echo-clock–assisted timing closure, and DLL-adjustable latency-making it the sole fit for deterministic, high-throughput packet buffer designs requiring sub-cycle timing predictability.
Availability
CY7C1512AV18-250BZI is available at Aetrix Electronics and suitable for high-speed network switch buffers, telecom line card packet memory, and baseband processing memory requiring stable component supply across extended product lifecycles.
Supply support for CY7C1512AV18-250BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
The QDR II SRAM product line-including CY7C1512AV18-was engineered specifically for deterministic, low-latency, high-bandwidth buffering in packet-switched infrastructure, where concurrent access and precise timing closure are mandatory.
FAQ
What is the function of the DOFF pin, and how does it affect timing?
The DOFF (DLL Turn Off) pin is an active-low control that disables the internal Delay Lock Loop. When pulled LOW, the device operates in QDR I mode with 1-cycle read latency and maximum frequency reduced to 167 MHz. When HIGH (via 10 kΩ pull-up), DLL is enabled, delivering 1.5-cycle latency at full 250 MHz operation and precise echo clock alignment.
Can CY7C1512AV18-250BZI operate with only one clock pair instead of two?
Yes-it supports single-clock mode using only K/K to drive both input registers and output registers (replacing C/C). In this configuration, data is clocked out on K/K edges, eliminating need for separate output clocks but forfeiting echo clock deskew capability and reducing maximum reliable data rate due to increased timing uncertainty.
How does the ZQ pin calibrate output impedance, and what is the required external component?
ZQ connects to an external precision resistor (RQ) tied to ground; typical value is 50 Ω. The device measures RQ and adjusts driver strength so that Q[17:0], CQ, and CQ output impedances equal 0.2 × RQ (i.e., 10 Ω for 50 Ω reference). Leaving ZQ unconnected or tying to VSS violates specification and causes undefined output drive behavior.
What is the role of BWS[1:0] in write operations, and how are they mapped to data bits?
BWS0 controls D[8:0] and BWS1 controls D[17:9]. Both are sampled synchronously with data on K/K edges. Asserting either BWS pin enables writing its associated 9-bit byte; deasserting it preserves existing memory contents in that byte. This enables efficient partial-word updates without full-word read-modify-write sequences.
CY7C1512AV18-250BZI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1512AV18-250BZI FAQ
1.How can I place an order for CY7C1512AV18-250BZI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1512AV18-250BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1512AV18-250BZI reliable?
The price and inventory of CY7C1512AV18-250BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512AV18-250BZI is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512AV18-250BZI transactions.
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Once your CY7C1512AV18-250BZI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1512AV18-250BZI?
For technical support, including CY7C1512AV18-250BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512AV18-250BZI requirements.
6.How does Aetrix verify that CY7C1512AV18-250BZI is sourced from the original manufacturer or authorized distributors?
All CY7C1512AV18-250BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512AV18-250BZI meets industry standards.
7.What is the process for return or replacement of CY7C1512AV18-250BZI?
All CY7C1512AV18-250BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512AV18-250BZI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1512AV18-250BZI part is unused and in its original packaging.
Return procedure for CY7C1512AV18-250BZI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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