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Infineon Technologies CY7C1512AV18-250BZXC

Part No.:
CY7C1512AV18-250BZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1512AV18-250BZXC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,269

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Product details

Overview

CY7C1512AV18-250BZXC from Cypress Semiconductor is a 4M × 18 (72-Mbit), 1.8V QDR® II SRAM with dual independent read/write ports, 250 MHz clock operation, 1.5-cycle read latency (DLL enabled), DDR interfaces on both ports, and 165-ball FBGA (15 × 17 × 1.4 mm) packaging - deployed in high-bandwidth packet buffering for network line cards.

For engineers reviewing the CY7C1512AV18-250BZXC datasheet, CY7C1512AV18-250BZXC pinout, CY7C1512AV18-250BZXC application, or CY7C1512AV18-250BZXC equivalent, key selection considerations include burst depth (2-word), HSTL-18 I/O compatibility, DLL-controlled timing accuracy, and port-select–based depth expansion capability.

Technical Context

The device implements true dual-port synchronous pipelined architecture: separate K/K clocks latch write addresses and data, while C/C clocks drive read outputs with echo clocks (CQ/CQ) for source-synchronous capture. Internal organization comprises two 2M × 18 arrays enabling concurrent access without bus turnaround.

All control signals (RPS, WPS, BWS[1:0]) are registered on K/K edges; data outputs (Q[17:0]) are registered on C/C edges. DLL alignment enables precise 500 Mbps DDR data placement; DOFF pin disables DLL to revert to QDR I mode (1-cycle latency, ≤167 MHz).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (4M × 18 configuration)
Max Clock Frequency 250 MHz - supports 500 MT/s effective data rate per port
Read Latency 1.5 cycles (DLL enabled); 1 cycle (DLL disabled via DOFF = LOW)
Core / I/O Voltage VDD = 1.8 V ±0.1 V; VDDQ = 1.4 V to VDD - enables HSTL-18 compatible signaling
Burst Length 2-word burst per access - delivers 36 bits per K-cycle on read/write ports
Package 165-ball FBGA (15 × 17 × 1.4 mm) - RoHS-compliant, thermal performance optimized for telecom PCBs
Interface Standard HSTL Class I inputs/outputs - ensures signal integrity at 500 MHz DDR with controlled impedance matching via ZQ

Pinout & Package

165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, Pb-free termination. Pinout validated per Cypress Document #001-06984 Rev. *E (Pages 4–5).

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous write data input Latched on rising edges of K/K; supports byte-write via BWS[1:0] for partial-word updates
Q[17:0] Synchronous read data output Driven on rising edges of C/C; tristated automatically when RPS deasserted
RPS / WPS Active-low port select controls Enable independent read/write initiation; allow depth expansion without external logic
K / K, C / C Differential clock inputs K/K capture all inputs; C/C clock outputs - eliminate skew via matched flight time
CQ / CQ Source-synchronous echo clocks Phase-aligned with C/C outputs; simplify high-speed FPGA capture without routing delay compensation
ZQ Output impedance calibration input Connect to resistor-to-ground (RQ) to tune Q[17:0]/CQ/CQ output impedance to 0.2×RQ
DOFF DLL disable control Pull LOW to disable DLL and operate in QDR I mode (1-cycle latency, ≤167 MHz)

Key Features

Feature Design Value
Independent Read/Write Ports Eliminates bus turnaround overhead - enables full-duplex memory access for real-time packet processing
DDR Interfaces on Both Ports Delivers 500 MT/s effective bandwidth per port using 250 MHz clocks - doubles throughput vs. SDR
Delay Lock Loop (DLL) Enables 1.5-cycle read latency with sub-100 ps data-eye centering - critical for >400 Mbps system timing closure
HSTL-18 I/O with ZQ Calibration Ensures consistent 18 Ω output impedance across voltage/temperature - maintains signal integrity on dense backplanes
JTAG 1149.1 Test Access Port Supports boundary-scan testing and in-system debug without additional test fixtures

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in 10G/40G switch fabric ASIC interfaces.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as ingress/egress FIFO buffer with zero-wait-state concurrent read/write.

Use Value: 2-word burst + DDR interface sustains 10 Gbps sustained throughput; RPS/WPS isolation prevents head-of-line blocking.

Use Scenario: Frame assembly/disassembly in OC-192 SONET/SDH line cards requiring deterministic latency.

IC Role / Device Role / Timing Role: QDR II SRAM serving as descriptor table and payload cache with DLL-aligned read timing.

Use Value: 1.5-cycle latency with DLL enables precise 1.5 ns timing margin for 622 MHz SerDes interfaces.

Baseband Processing Buffer High-Speed Test Equipment Memory

Use Scenario: Real-time buffering of IQ samples between ADC/DAC and FPGA-based digital up/down converters in 5G NR radios.

IC Role / Device Role / Timing Role: Low-latency memory co-processor interfacing with Xilinx Ultrascale+ GTY transceivers.

Use Value: CQ/CQ echo clocks align with FPGA IDELAYCTRL for sub-UI capture - eliminates dynamic phase calibration.

Use Scenario: Pattern storage and comparison in automated test equipment (ATE) for SoC functional validation.

IC Role / Device Role / Timing Role: High-reliability SRAM holding stimulus vectors and expected response tables with JTAG-accessible diagnostics.

Use Value: JTAG 1149.1 support enables in-system verification of memory contents without halting test execution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615L10BG 36-bit bus, 10 ns access, 3.3V core - no DLL, no echo clocks, parallel single-ended interface Lower bandwidth (≤200 MHz), higher power, requires external clock deskew circuitry Choose only if legacy 3.3V system integration or non-DDR timing constraints apply
ISSI IS61WV102418BLL-15BLI 1M × 18, 15 ns async SRAM - no burst, no DDR, no dual-port concurrency Not suitable for packet buffering; limited to low-throughput control-plane storage Select only for cost-sensitive, non-real-time applications where latency and bandwidth are secondary

Compared with IDT72T3615L10BG and IS61WV102418BLL-15BLI, CY7C1512AV18-250BZXC uniquely delivers concurrent DDR read/write at 500 MT/s with DLL-aligned timing and echo-clock–assisted capture - essential for modern packet-processing pipelines.

Availability

CY7C1512AV18-250BZXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing buffers, and high-speed test equipment requiring stable component supply across extended production lifecycles.

Supply support for CY7C1512AV18-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, automotive, and industrial systems.

CY7C1512AV18 belongs to the QDR II SRAM product line engineered specifically for deterministic, low-latency, high-throughput memory subsystems in networking and telecom infrastructure.

FAQ

What is the function of the DOFF pin?

The DOFF pin disables the internal Delay Lock Loop when pulled LOW. In this state, the device operates in QDR I mode with 1-cycle read latency and maximum frequency reduced to 167 MHz. For standard QDR II operation at 250 MHz with 1.5-cycle latency, DOFF must be pulled HIGH via ≤10 kΩ resistor to VDDQ.

How does ZQ pin calibration affect signal integrity?

ZQ connects to an external resistor to ground (RQ) to calibrate output driver impedance for Q[17:0], CQ, and CQ pins to 0.2 × RQ. With RQ = 60 Ω, outputs match 12 Ω transmission lines - critical for maintaining HSTL-18 signal integrity at 500 Mbps. Leaving ZQ unconnected or tied to GND violates specification and causes timing violations.

Can CY7C1512AV18-250BZXC operate in single-clock mode?

Yes - by tying K to C and K to C, the device uses K/K for both input registration and output timing. In this mode, Q[17:0] is clocked by K/K instead of C/C, eliminating need for separate output clocks but forfeiting CQ/CQ deskew benefits and reducing maximum reliable frequency due to clock path asymmetry.

What is the role of BWS[1:0] during write operations?

BWS0 and BWS1 are active-low byte write selects sampled on K/K edges. BWS0 controls D[8:0], BWS1 controls D[17:9]. When either is deasserted, corresponding byte group remains unaltered - enabling efficient read-modify-write without full-word reads, essential for descriptor table updates in packet processors.

CY7C1512AV18-250BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1512AV18-250BZXC FAQ

1.How can I place an order for CY7C1512AV18-250BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1512AV18-250BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1512AV18-250BZXC reliable?

The price and inventory of CY7C1512AV18-250BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512AV18-250BZXC is usually 5 days.

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CY7C1512AV18-250BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1512AV18-250BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1512AV18-250BZXC?

For technical support, including CY7C1512AV18-250BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512AV18-250BZXC requirements.

6.How does Aetrix verify that CY7C1512AV18-250BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1512AV18-250BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512AV18-250BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1512AV18-250BZXC?

All CY7C1512AV18-250BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512AV18-250BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1512AV18-250BZXC part is unused and in its original packaging.

Return procedure for CY7C1512AV18-250BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1512AV18-250BZXC Tags

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