Infineon Technologies CY7C1512KV18-200BZXC
- Part No.:
- CY7C1512KV18-200BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1512KV18-200BZXC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,408
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1512KV18-200BZXC from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 1.8V QDR® II SRAM with dual independent read/write ports, 200 MHz maximum operating frequency, DDR interfaces on both ports (400 Mbps per pin), and 165-ball FBGA (13 × 15 × 1.4 mm) packaging. It delivers concurrent high-bandwidth memory access for network packet buffering in telecom line cards.
For engineers reviewing the CY7C1512KV18-200BZXC datasheet, CY7C1512KV18-200BZXC pinout, CY7C1512KV18-200BZXC application, or CY7C1512KV18-200BZXC equivalent, key selection criteria include burst depth (2-word), read latency (1 or 1.5 cycles depending on DOFF), VDDQ compatibility (1.4–1.8 V), echo clock support (CQ/CQ), and JTAG 1149.1 testability.
Technical Context
The CY7C1512KV18 implements QDR II architecture with physically separate read and write data paths-eliminating bus turnaround delays. Its synchronous pipelined operation uses two input clocks (K/K) for address/data latching and two output clocks (C/C) plus echo clocks (CQ/CQ) to align data capture timing at the receiver.
Internally, it features a 2M × 18 memory array, self-timed writes, programmable impedance (ZQ), and HSTL-compatible I/Os. Read latency is configurable via DOFF: 1 cycle when LOW (QDR I mode), 1.5 cycles when HIGH (QDR II mode), enabling trade-offs between timing margin and throughput.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4M × 18-bit (72 Mbit); supports 18-bit parallel data path without external multiplexing |
| Max Clock Frequency | 200 MHz; defines maximum sustained transaction rate (400 MT/s effective due to DDR) |
| Read Latency | 1 or 1.5 cycles (DOFF-controlled); determines minimum clock-to-data delay for first valid read word |
| VDD / VDDQ | Core VDD = 1.8 V ±0.1 V; I/O VDDQ = 1.4–1.8 V; enables interoperability with 1.5 V or 1.8 V logic systems |
| Burst Length | 2-word fixed burst; guarantees predictable, low-jitter data delivery per access |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm); provides thermal and signal integrity advantages over TSOP for high-speed SRAM |
| JTAG Support | IEEE 1149.1 compliant; enables boundary-scan testing of PCB interconnects without physical probe access |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, 0.8 mm ball pitch, RoHS-compliant Pb-free finish (BZXC suffix).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data inputs | 18-bit parallel data sampled on rising edge of K clock; full-width interface eliminates byte-lane stitching |
| Q[17:0] | Synchronous read data outputs | 18-bit DDR outputs aligned to C/C clocks and echoed via CQ/CQ for source-synchronous capture |
| K / K | Input clocks for address & write data | Dual-phase clock pair (differential or single-ended) used for all synchronous write and address latching |
| C / C | Output clocks for read data | Separate clock domain for read outputs; minimizes skew between Q[17:0] and timing reference |
| CQ / CQ | Echo clocks | Delayed copies of C/C clocks output with same flight time as Q[17:0]; enable precise FPGA/ASIC data capture |
| WPS | Write port select | Active-low control sampled on K rising edge; gates write transactions without affecting read port operation |
| BWS[1:0] | Byte write selects | Two active-low signals controlling 9-bit byte lanes (D[8:0], D[17:9]); enables partial-word updates without read-modify-write |
| DOFF | Read latency mode select | High = 1.5-cycle latency (QDR II), Low = 1-cycle latency (QDR I); configures internal pipeline depth |
| TMS/TCK/TDI/TDO | JTAG test access port | Supports IEEE 1149.1 boundary scan for production test and debug of memory subsystem interconnects |
Key Features
| Feature | Design Value |
|---|---|
| Independent read/write ports | Enables simultaneous 200 MHz read and write operations-no arbitration or contention overhead |
| Source-synchronous echo clocks (CQ/CQ) | Eliminates need for board-level trace length matching between clock and data nets in high-speed designs |
| Programmable output drive impedance (ZQ) | Allows dynamic calibration to match PCB trace impedance-reducing reflections and improving signal integrity |
| Configurable 1- or 1.5-cycle read latency | Permits system-level timing closure optimization: lower latency for tight cycles, higher margin for longer traces |
| HSTL-compatible I/O with 1.4–1.8 V VDDQ | Interoperates with FPGAs and ASICs using either 1.5 V or 1.8 V I/O standards without level shifters |
Applications
| Telecom Line Card Buffering | Network Processor Interface |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in OC-192/STM-64 line cards. IC Role / Device Role / Timing Role: Dual-port SRAM acts as a non-blocking packet buffer-reads ingress traffic while writing egress traffic on same clock cycle. Use Value: 200 MHz DDR bandwidth (7.2 GB/s aggregate) sustains full-duplex 10 Gbps line rates without backpressure. | Use Scenario: Interfacing multi-core network processors requiring low-latency, high-throughput shared memory for flow classification tables. IC Role / Device Role / Timing Role: Provides deterministic 1-cycle read access to lookup tables under DOFF = LOW configuration. Use Value: Eliminates bus turnaround delay-enabling concurrent table reads and updates across processor cores. |
| High-Speed Test Equipment Memory | Avionics Data Acquisition Buffer |
Use Scenario: Capturing real-time analog-to-digital samples at 200 MS/s for protocol analysis and jitter measurement. IC Role / Device Role / Timing Role: Acts as a deep, pipelined FIFO-writing ADC samples on one port while reading out processed frames on the other. Use Value: 72-Mbit capacity holds >360k 16-bit samples; echo clocks ensure reliable capture in FPGA-based acquisition logic. | Use Scenario: Buffering sensor telemetry (ARINC 429, MIL-STD-1553) in flight control computers with strict DO-254 timing compliance. IC Role / Device Role / Timing Role: Serves as a radiation-tolerant, deterministic memory stage between sensor interface ASICs and safety-critical microcontrollers. Use Value: Neutron soft error immunity and 1.8 V core reduce single-event upset risk; JTAG enables in-system verification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-bit × 2M, 10 ns access, 3.3 V core/I/O, no echo clocks or ZQ calibration | Lacks source-synchronous timing aids; requires tighter PCB layout control for >150 MHz operation | Select if legacy 3.3 V system integration is required and timing margin allows manual skew compensation |
| ISSI IS61WV102418BLL-10BLI | 1M × 18, 10 ns async SRAM, 3.3 V only, single-port, no DDR or JTAG | No concurrent read/write; bandwidth limited to ~180 MB/s; no built-in test infrastructure | Choose only for cost-sensitive, non-real-time buffering where QDR performance and testability are unnecessary |
Compared with IDT72T3615L10BG and IS61WV102418BLL-10BLI, CY7C1512KV18-200BZXC uniquely combines DDR bandwidth, echo-clock timing aid, and JTAG testability in a 1.8 V package-making it optimal for new high-speed embedded designs requiring verified signal integrity and production test coverage.
Availability
CY7C1512KV18-200BZXC is available at Aetrix Electronics and suitable for telecom infrastructure, network processor interfacing, high-speed test equipment, and avionics data acquisition requiring stable component supply across extended product lifecycles.
Supply support for CY7C1512KV18-200BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.
The QDR II SRAM product line targets systems demanding deterministic, low-latency, concurrent memory access-especially in packet processing, baseband, and instrumentation where DDR SDRAM latency and arbitration overhead are unacceptable.
FAQ
What is the function of the DOFF pin on CY7C1512KV18-200BZXC?
The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables QDR II mode with 1.5-cycle read latency for improved timing margin; when LOW, it selects QDR I mode with 1-cycle latency for minimal delay. This setting is sampled synchronously on the K clock and affects all subsequent read operations until changed.
Does CY7C1512KV18-200BZXC require external termination resistors?
No-CY7C1512KV18-200BZXC integrates programmable output drive impedance (ZQ) calibration. When enabled, it automatically adjusts output driver strength to match a 50 Ω reference resistor (connected to ZQ pin), eliminating need for discrete series or parallel terminations on data or clock lines.
Can CY7C1512KV18-200BZXC operate with a single clock domain instead of separate K/K and C/C pairs?
Yes-the device supports single-clock-domain operation by tying K to C and K to C. In this mode, read data is registered on the same clock edges as address and write data, simplifying clock distribution at the cost of reduced timing flexibility and potential skew sensitivity compared to dual-domain use.
How does the BWS[1:0] signal differ from NWS in CY7C1512KV18-200BZXC?
CY7C1512KV18-200BZXC uses BWS[1:0] (Byte Write Select) to control two 9-bit lanes (D[8:0], D[17:9]) during writes. Unlike NWS (nibble write select, used only in x8 devices), BWS enables partial 18-bit word updates-e.g., writing only upper or lower byte lane without disturbing the other-preserving data coherency in multi-threaded memory access scenarios.
CY7C1512KV18-200BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1512KV18-200BZXC FAQ
1.How can I place an order for CY7C1512KV18-200BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1512KV18-200BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1512KV18-200BZXC reliable?
The price and inventory of CY7C1512KV18-200BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512KV18-200BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1512KV18-200BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512KV18-200BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1512KV18-200BZXC?
CY7C1512KV18-200BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1512KV18-200BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1512KV18-200BZXC?
For technical support, including CY7C1512KV18-200BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512KV18-200BZXC requirements.
6.How does Aetrix verify that CY7C1512KV18-200BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1512KV18-200BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512KV18-200BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1512KV18-200BZXC?
All CY7C1512KV18-200BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512KV18-200BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1512KV18-200BZXC part is unused and in its original packaging.
Return procedure for CY7C1512KV18-200BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1512KV18-200BZXC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

