Infineon Technologies CY7C1512KV18-250BZC

Overview

CY7C1512KV18 from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 1.8V QDR® II SRAM with dual independent DDR read/write ports, 350 MHz clock support (700 MT/s effective data rate), 1.5-cycle read latency (DOFF = HIGH), and 165-ball FBGA (13 × 15 × 1.4 mm) packaging. It delivers concurrent high-bandwidth memory access for network packet buffering in telecom line cards.

For engineers reviewing the CY7C1512KV18 datasheet, CY7C1512KV18 pinout, CY7C1512KV18 application, or CY7C1512KV18 equivalent, key selection criteria include burst-2 DDR timing compliance, HSTL-15 I/O compatibility, PLL-based echo clock synchronization, and depth expansion via RPS/WPS port selects.

Technical Context

This QDR II SRAM implements fully synchronous pipelined operation with separate K/K clocks for write address/data capture and C/C clocks for read data output registration - eliminating bus turnaround and enabling true concurrent read/write at 350 MHz. The internal PLL aligns CQ/CQ echo clocks to output data edges for reliable capture at 700 MT/s.

It supports two distinct latency modes: 1.5-cycle read latency with DOFF asserted HIGH (for maximum bandwidth), or 1-cycle latency with DOFF LOW (backward compatibility with QDR I systems). Address latching uses a single multiplexed A[20:0] bus sampled on alternating K-clock edges for read/write address separation.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with IDT72T3615L10BG and IS61WV102418BLL-10BLI, CY7C1512KV18 uniquely delivers concurrent 700 MT/s DDR read/write with echo-clock–assisted timing closure - essential for modern packet-processing and RF signal chain designs.

Availability

CY7C1512KV18 is available at Aetrix Electronics and suitable for telecom infrastructure, network processor interfacing, baseband digital front-end, and high-speed ATE requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1512KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems.

CY7C1512KV18 belongs to the QDR II SRAM product line, engineered specifically for deterministic, high-bandwidth packet buffering and real-time signal processing in networking and wireless infrastructure.

FAQ

What is the function of the DOFF pin on CY7C1512KV18?

The DOFF (Data Output OFF) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle read latency for optimal QDR II performance; when LOW, it reverts to 1-cycle latency for QDR I compatibility. This setting directly affects timing budget allocation in the memory controller and must be held stable during operation.

How does the CY7C1512KV18 handle partial writes?

Partial writes are controlled by BWS[1:0] (Byte Write Select) pins: BWS0 enables writing to D[8:0], and BWS1 enables D[17:9]. Both must be deasserted to inhibit all writes. Unlike nibble-select SRAMs, this device performs true byte masking without read-modify-write cycles - preserving unselected data bits atomically.

Can CY7C1512KV18 operate with only one clock domain (K = C)?

Yes - the device supports single-clock-domain operation where K and C are tied together. In this mode, the internal PLL is bypassed, and CQ/CQ become delayed versions of C. However, maximum frequency drops to 250 MHz due to reduced timing margin, and echo-clock benefits for FPGA capture are diminished.

What is the purpose of NC/144M and NC/288M balls on the FBGA package?

NC/144M and NC/288M are no-connect balls not bonded to the die; they may be left floating or tied to ground/VSS per PCB layout requirements. These positions accommodate pin-compatible variants (e.g., CY7C1510KV18) within the same package footprint - enabling design reuse across density options without board redesign.