Infineon Technologies CY7C1512KV18-250BZCT

Overview

CY7C1512KV18-250BZCT from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 250 MHz QDR® II SRAM with separate read/write ports, DDR interfaces on both ports (500 Mbps per pin), and 1.8V core / 1.4–1.8V I/O supply. It delivers concurrent read-write transactions with 1.5-cycle read latency (DOFF = HIGH) for high-throughput packet buffering in network line cards.

For engineers reviewing the CY7C1512KV18-250BZCT datasheet, CY7C1512KV18-250BZCT pinout, CY7C1512KV18-250BZCT application, or CY7C1512KV18-250BZCT equivalent, key selection criteria include burst depth (2-word), echo clock support (CQ/CQ), JTAG 1149.1 testability, PLL-based data alignment, and FBGA-165 package compatibility with high-speed PCB layout constraints.

Technical Context

This QDR II SRAM implements fully independent synchronous read and write pipelines with dual clock domains: K/K for address/data input timing and C/C for output timing-enabling precise skew control. Its internal self-timed write circuitry eliminates external write pulse width constraints.

The device uses a single multiplexed address bus latched on alternating rising edges of K/K, supports depth expansion via RPS/WPS signals, and maintains full data coherency across concurrent accesses. DOFF pin selects between 1-cycle (LOW) and 1.5-cycle (HIGH) read latency modes.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Compared with AS7C36256P-250BIN and IS61WV102418BLL-250BLI, CY7C1512KV18-250BZCT uniquely delivers 72-Mbit density with true concurrent access, echo-clock–assisted timing closure, and QDR II–specific burst protocol-making it irreplaceable in new high-throughput packet processing architectures.

Availability

CY7C1512KV18-250BZCT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing memory, and test equipment pattern memory requiring stable component supply across multi-year production cycles.

Supply support for CY7C1512KV18-250BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems, with headquarters in San Jose, CA.

CY7C1512KV18 belongs to the QDR® II SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth buffering in packet-switched infrastructure where concurrent read/write throughput is critical.

FAQ

What is the function of the DOFF pin on CY7C1512KV18-250BZCT?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle latency synchronized to C/C clocks for optimal timing margin in high-speed systems; when LOW, it reverts to 1-cycle latency for QDR I compatibility. This setting directly affects setup/hold timing margins at the receiving device and must be fixed during power-up configuration.

How does the CY7C1512KV18-250BZCT handle byte-level write masking?

It uses two active-low Byte Write Select signals-BWS0 and BWS1-each controlling a 9-bit segment of the 18-bit D[17:0] bus. BWS0 enables writes to D[8:0], and BWS1 enables writes to D[17:9]. When either signal is deasserted, the corresponding byte remains unaltered, preserving prior data without requiring a read-modify-write sequence.

Can CY7C1512KV18-250BZCT operate with only one clock domain (K and C tied together)?

Yes-the device supports single-clock-domain operation by tying K to C and K to C, though this sacrifices skew optimization. In this mode, output data is still double-data-rate but aligned to the same clock edges as inputs, reducing timing margin compared to dual-clock operation with dedicated C/C for outputs and K/K for inputs.

What is the purpose of the NC/144M and NC/288M balls on the FBGA package?

These are no-connect balls not bonded to the die; they may be left floating or tied to ground/VSS per board layout requirements. Their presence accommodates pinout scalability across the QDR II family (e.g., CY7C1510KV18 uses NC/144M for 8M×8 configuration). They carry no electrical function and require no termination.