Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY7C1512KV18-250BZIT

Part No.:
CY7C1512KV18-250BZIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1512KV18-250BZIT.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,311

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY7C1512KV18-250BZIT from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 1.8V QDR® II SRAM with dual independent DDR read/write ports, 250 MHz clock operation (500 MT/s per port), 1.5-cycle read latency when DOFF = HIGH, and HSTL-compatible I/O supporting 1.4–1.8V VDDQ. It delivers high-bandwidth buffering for network packet processing in telecom line cards.

For engineers reviewing the CY7C1512KV18-250BZIT datasheet, CY7C1512KV18-250BZIT pinout, CY7C1512KV18-250BZIT application, or CY7C1512KV18-250BZIT equivalent, key selection criteria include burst depth (2-word), synchronous self-timed write timing, echo clock (CQ) support for source-synchronous capture, and FBGA-165 package compatibility with high-speed PCB layout constraints.

Technical Context

This QDR II SRAM implements separate read and write address/data paths with fully pipelined, synchronous operation-no bus turnaround required. It uses two independent input clocks (K/K̄) for address/data latching and two output clocks (C/C̄) plus echo clocks (CQ/CQ̄) to align data capture at the receiver.

The device integrates a PLL for precise internal data placement, supports programmable drive strength via ZQ calibration, and provides full data coherency across concurrent read/write transactions. Depth expansion is enabled by RPS/WPS control signals, and byte write masking is implemented via BWS[1:0] inputs for 18-bit data width.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density4M × 18-bit (72 Mbit); enables compact, high-throughput buffer storage for 18-bit parallel data paths.
Max Clock Frequency250 MHz; supports 500 MT/s effective throughput per port with DDR interface.
Read Latency1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW); selectable timing mode for system-level synchronization trade-offs.
VDD / VDDQCore VDD = 1.8 V ±0.1 V; I/O VDDQ = 1.4–1.8 V; allows interoperability with both 1.5V and 1.8V logic domains.
Burst Length2-word fixed burst; guarantees deterministic access pattern and simplifies controller FIFO design.
Package165-ball FBGA (13 × 15 × 1.4 mm); RoHS-compliant, thermally optimized for high-power density applications.
Interface StandardHSTL Class I compatible; ensures signal integrity at 700 Mbps data rates with controlled impedance routing.

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, Pb-free termination.

Pin/TerminalCircuit RoleDesign Meaning
K / K̄Input clock pairRising edges latch all synchronous inputs (address, data, control); K used for read, K̄ for write addressing.
C / C̄Output clock pairDrive read data outputs; enable source-synchronous capture with minimal skew relative to Q[17:0].
CQ / CQ̄Echo clock outputsReplicate C/C̄ timing at receiver side; eliminate flight-time mismatch in high-speed trace routing.
D[17:0]Write data inputs18-bit wide DDR input bus sampled on K/K̄ rising edges; supports 2-word burst writes.
Q[17:0]Read data outputs18-bit wide DDR output bus registered on C/C̄ rising edges; aligned with CQ/CQ̄ for reliable sampling.
BWS[1:0]Byte write selectActive-low 2-bit mask controlling which 9-bit subwords (D[8:0], D[17:9]) are written during burst.
WPSWrite port selectActive-low enable for entire write port; deassertion blocks all write operations regardless of BWS state.
RPSRead port selectActive-low enable for read port; allows depth expansion by disabling reads on selected devices.
DOFFRead latency controlHigh = 1.5-cycle latency; Low = 1-cycle latency; configures timing margin for downstream logic setup.
ZQImpedance calibrationConnects to external 240 Ω resistor to ground; calibrates output driver strength for consistent HSTL signaling.

Key Features

FeatureDesign Value
Independent Read/Write PortsEliminates bus turnaround overhead, enabling true concurrent access-critical for full-duplex packet buffering.
2-Word DDR Burst ArchitectureGuarantees predictable 36-bit data transfer per access cycle, reducing controller arbitration complexity.
Synchronous Self-Timed WritesInternal write completion detection removes external write-enable timing constraints, simplifying timing closure.
Programmable HSTL Drive StrengthZQ calibration ensures consistent edge rates and signal integrity across voltage/temperature variations.
JTAG IEEE 1149.1 Test AccessEnables boundary scan testing of interconnects in dense high-speed layouts without physical probe access.

Applications

Telecom Line Card BufferingNetwork Processor Interface

Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet or SONET/SDH line cards.

IC Role / Device Role / Timing Role: High-speed dual-port SRAM acting as a non-blocking first-level packet buffer between SERDES and traffic manager ASICs.

Use Value: 250 MHz DDR operation delivers 9 Gbps aggregate bandwidth (4.5 Gbps per port), matching OC-192/STM-64 interface rates.

Use Scenario: Interfacing with multi-core network processors requiring low-latency, concurrent read/write access to flow-control tables.

IC Role / Device Role / Timing Role: Synchronous memory co-processor providing deterministic 1.5-cycle read response for lookup table updates and statistics collection.

Use Value: Independent RPS/WPS controls allow seamless depth expansion across multiple devices without performance penalty.

Baseband Processing in Wireless InfrastructureTest Equipment Data Capture

Use Scenario: Real-time buffering of IQ samples between ADC/DAC and FPGA-based digital pre-distortion engines in LTE/5G remote radio units.

IC Role / Device Role / Timing Role: High-reliability SRAM with full data coherency ensuring latest sample values are always available during concurrent acquisition and processing.

Use Value: DOFF-selectable latency allows tuning between minimum jitter (1-cycle) and maximum timing margin (1.5-cycle) for FPGA interface timing closure.

Use Scenario: Capturing high-speed serial data streams from DUTs in automated test systems with precise timestamp alignment.

IC Role / Device Role / Timing Role: Source-synchronous memory buffer using CQ/CQ̄ echoes to lock data capture clocks to incoming stream timing.

Use Value: Echo clock outputs reduce setup/hold uncertainty to <15 ps, enabling reliable capture at 700 Mbps DDR rates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AS7C36256P-250BIN256-Mbit (8M × 36) QDR II+ SRAM; higher density, 350 MHz max, no DOFF latency select.Supports wider data buses and higher throughput but lacks 1-cycle latency mode and requires different BWS mapping.Select when >72 Mbit capacity or >500 MT/s per port is required; verify controller compatibility with QDR II+ command set.
IS61WV102418BLL-250TQLI18-Mbit (512K × 36) synchronous SRAM; single clock domain, no DDR, no echo clocks, 250 MHz async interface.Lower bandwidth (250 MHz × 36-bit = 9 Gbps total), no concurrent read/write, simpler timing but no source-synchronous capture.Select for cost-sensitive, lower-throughput applications where QDR architecture complexity is unnecessary.

Compared with AS7C36256P-250BIN and IS61WV102418BLL-250TQLI, CY7C1512KV18-250BZIT uniquely balances 72-Mbit capacity, 250 MHz QDR II performance, selectable read latency, and echo-clock–enabled signal integrity-making it optimal for mid-bandwidth telecom and test equipment designs requiring proven reliability and mature ecosystem support.

Availability

CY7C1512KV18-250BZIT is available at Aetrix Electronics and suitable for telecom infrastructure, network processor interfacing, wireless baseband processing, and high-speed test equipment requiring stable component supply and long-term industrial availability.

Supply support for CY7C1512KV18-250BZIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for automotive, industrial, and communications markets, with headquarters in San Jose, CA.

The QDR® II SRAM product line targets high-speed packet buffering and real-time data streaming applications where deterministic latency, concurrent access, and signal integrity at multi-Gbps rates are critical.

FAQ

What is the function of the DOFF pin on CY7C1512KV18-250BZIT?

The DOFF (Data Output OFFset) pin selects read latency mode: when asserted HIGH, it configures 1.5-cycle read latency for improved timing margin; when LOW, it enables 1-cycle latency for minimum delay. This setting directly affects the number of K-clock cycles between address assertion and valid Q[17:0] output, and must be held stable during operation.

How does the ZQ pin enable impedance calibration?

The ZQ pin connects to an external 240 Ω resistor to ground, allowing the device to calibrate its HSTL output driver strength against process/voltage/temperature variation. Calibration occurs automatically at power-up and can be retriggered via JTAG instruction, ensuring consistent 25 Ω (±15%) output impedance for signal integrity across operating conditions.

Can CY7C1512KV18-250BZIT operate with only one clock domain?

Yes-it supports Single Clock Mode where K and C are tied together (and K̄ and C̄ tied together), eliminating need for separate read/write clocks. In this mode, the device behaves like a standard synchronous SRAM with shared clocking, though DDR bandwidth and echo clock benefits are forfeited. Refer to Functional Description section "Single Clock Mode" in datasheet for timing constraints.

What is the purpose of BWS[1:0] in the 18-bit configuration?

BWS[1:0] are active-low byte write select signals that control which 9-bit subword of the 18-bit D[17:0] bus is written during each 2-word burst: BWS0 enables D[8:0], BWS1 enables D[17:9]. Both must be asserted to write full 18-bit words; deasserting either masks the corresponding subword, preserving prior data-enabling partial-word updates without read-modify-write cycles.

CY7C1512KV18-250BZIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1512KV18-250BZIT FAQ

1.How can I place an order for CY7C1512KV18-250BZIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1512KV18-250BZIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1512KV18-250BZIT reliable?

The price and inventory of CY7C1512KV18-250BZIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512KV18-250BZIT is usually 5 days.

3.What payment methods are accepted for CY7C1512KV18-250BZIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512KV18-250BZIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1512KV18-250BZIT?

CY7C1512KV18-250BZIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1512KV18-250BZIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1512KV18-250BZIT?

For technical support, including CY7C1512KV18-250BZIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512KV18-250BZIT requirements.

6.How does Aetrix verify that CY7C1512KV18-250BZIT is sourced from the original manufacturer or authorized distributors?

All CY7C1512KV18-250BZIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512KV18-250BZIT meets industry standards.

7.What is the process for return or replacement of CY7C1512KV18-250BZIT?

All CY7C1512KV18-250BZIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512KV18-250BZIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1512KV18-250BZIT part is unused and in its original packaging.

Return procedure for CY7C1512KV18-250BZIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1512KV18-250BZIT Tags

  • CY7C1512KV18-250BZIT
  • CY7C1512KV18-250BZIT PDF
  • CY7C1512KV18-250BZIT Datasheet
  • CY7C1512KV18-250BZIT Specifications
  • CY7C1512KV18-250BZIT Images
  • Infineon Technologies
  • Infineon Technologies CY7C1512KV18-250BZIT
  • Buy CY7C1512KV18-250BZIT
  • CY7C1512KV18-250BZIT Price
  • CY7C1512KV18-250BZIT Distributor
  • CY7C1512KV18-250BZIT Supplier
  • CY7C1512KV18-250BZIT Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER