Infineon Technologies CY7C1512KV18-250BZXIT
- Part No.:
- CY7C1512KV18-250BZXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1512KV18-250BZXIT.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,232
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1512KV18-250BZXIT from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 1.8V QDR® II SRAM with dual independent read/write ports, 250 MHz operation (40 ns clock period), DDR interfaces on both ports (500 Mbps per pin), and 1.5-cycle read latency when DOFF is HIGH. It delivers high-bandwidth buffering for network packet processing in telecom line cards.
For engineers reviewing the CY7C1512KV18-250BZXIT datasheet, CY7C1512KV18-250BZXIT pinout, CY7C1512KV18-250BZXIT application, or CY7C1512KV18-250BZXIT equivalent, key selection criteria include burst depth (2-word), I/O voltage compatibility (VDDQ = 1.4–1.8 V), echo clock support (CQ/CQ), PLL-based timing alignment, and FBGA-165 package thermal/mechanical constraints.
Technical Context
This QDR II SRAM implements fully synchronous, pipelined access with separate K/K clocks for write/read address latching and C/C clocks for output data registration. Its architecture eliminates bus turnaround by dedicating D[x:0] inputs to writes and Q[x:0] outputs to reads.
The device uses on-chip PLL for precise data-eye placement and supports two operational modes: 1.5-cycle read latency (DOFF = HIGH) for maximum throughput, or 1-cycle latency (DOFF = LOW) for QDR I compatibility. Byte write select (BWS[1:0]) enables partial-word updates without read-modify-write cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4M × 18-bit (72 Mbit); supports 18-bit parallel data path for high-throughput packet header storage |
| Max Clock Frequency | 250 MHz (40 ns period); defines maximum sustained transaction rate of 250 million read+write operations/sec |
| Data Rate | 500 Mbps per I/O (DDR at 250 MHz); enables 9 Gbps aggregate bandwidth across 18-bit data bus |
| Read Latency | 1.5 cycles (DOFF = HIGH); guarantees data valid 1.5 clocks after read address assertion, critical for pipeline synchronization |
| VDD / VDDQ | Core VDD = 1.8 V ±0.1 V; I/O VDDQ = 1.4–1.8 V; allows interoperability with 1.5 V or 1.8 V logic families |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm); provides 0.8 mm ball pitch, suitable for high-density routing in telecom PCBs |
| Write Enable | Synchronous WPS + BWS[1:0]; enables selective 9-bit byte writes without disturbing adjacent bytes in same 18-bit word |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant (Pb-free).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Write Data Input Bus | 18-bit synchronous input sampled on rising edge of K clock; accepts full or partial (via BWS) word writes |
| Q[17:0] | Read Data Output Bus | 18-bit registered output driven on rising edge of C clock; synchronized to echo clock CQ for timing margin |
| K / K | Write/Read Clock Inputs | Dual-phase clocks latch write/read addresses independently; only rising edges used for all synchronous inputs |
| C / C | Read Data Output Clocks | Separate clocks drive Q[17:0] and minimize skew between data and capture clock at receiver |
| CQ / CQ | Echo Clock Outputs | Phase-matched copies of C/C clocks; simplify source-synchronous capture in FPGA/ASIC receivers |
| WPS | Write Port Select | Active-low signal enabling write transactions; deassertion blocks D[17:0] sampling and prevents unintended writes |
| BWS[1:0] | Byte Write Select | Two active-low signals controlling 9-bit byte segments; permits granular 9-bit updates within 18-bit word |
| DOFF | Read Latency Mode | High = 1.5-cycle latency (optimized throughput); Low = 1-cycle latency (QDR I compatibility) |
| RPS | Read Port Select | Active-low signal enabling read transactions; required to assert before read address is latched |
| A[20:0] | Address Input Bus | 21-bit multiplexed address latched alternately on K/K rising edges for read/write port addressing |
Key Features
| Feature | Design Value |
|---|---|
| Independent Read/Write Ports | Enables concurrent read and write to different addresses-no bus arbitration or turnaround delay required |
| 2-Word Burst Architecture | Every access transfers two consecutive words, doubling effective bandwidth over single-word devices |
| PLL-Based Timing Control | On-chip PLL aligns internal data strobes to external clocks, reducing setup/hold violations at 250 MHz |
| Variable Drive HSTL Outputs | Adjustable output strength matches trace impedance, minimizing reflections on high-speed memory buses |
| JTAG 1149.1 Boundary Scan | Supports IEEE-compliant testing and interconnect verification in assembled systems without physical probe access |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches. IC Role / Device Role / Timing Role: High-speed dual-port buffer providing simultaneous ingress packet write and egress packet read with zero turnaround latency. Use Value: Sustains 9 Gbps bidirectional throughput at 250 MHz, eliminating bottlenecks in 10G/40G line card data paths. | Use Scenario: Holding control-plane metadata and forwarding tables in carrier-grade optical transport equipment. IC Role / Device Role / Timing Role: Deterministic-latency SRAM supporting real-time lookup table updates while servicing live traffic reads. Use Value: 1.5-cycle read latency ensures sub-6 ns response time for critical control operations under full load. |
| Baseband Processing Cache | FPGA Co-Processor Memory |
Use Scenario: Serving as low-latency scratchpad for LTE/5G baseband DSPs performing channel estimation and modulation. IC Role / Device Role / Timing Role: Pipelined memory interfacing directly to multi-core DSP fabric via dedicated read/write data paths. Use Value: Dual-port isolation prevents read stalls during bursty write-heavy FFT/IFFT workloads. | Use Scenario: Offloading memory-intensive tasks from Xilinx/Intel FPGAs in radar and software-defined radio systems. IC Role / Device Role / Timing Role: Externally synchronized SRAM acting as high-bandwidth frame buffer between FPGA logic and ADC/DAC interfaces. Use Value: Echo clocks (CQ/CQ) enable reliable source-synchronous capture in FPGA I/O banks without custom timing closure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C3256A-25JCIN | Asynchronous 32K × 8 SRAM; no DDR, no echo clocks, no PLL; 25 ns access, single-port | Limited to low-speed control storage; cannot support concurrent read/write or 500 Mbps signaling | Select only for cost-sensitive, non-pipelined designs where bandwidth < 200 Mbps suffices |
| IS61WV102418BLL-25BLI | Synchronous 1M × 18 ZBT SRAM; single clock domain; 25 ns cycle time; no echo clocks or DOFF latency control | Requires external clock management; lacks QDR II's 1.5-cycle mode and burst efficiency | Choose when system already uses ZBT protocol and does not require echo-clock–based timing simplification |
Compared with AS7C3256A-25JCIN and IS61WV102418BLL-25BLI, CY7C1512KV18-250BZXIT uniquely delivers true concurrent dual-port operation, DDR signaling, and echo-clock–assisted capture-enabling deterministic 9 Gbps throughput unattainable with asynchronous or ZBT alternatives.
Availability
CY7C1512KV18-250BZXIT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing cache, and FPGA co-processor memory requiring stable component supply and long-term industrial availability.
Supply support for CY7C1512KV18-250BZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems.
This device belongs to the QDR® II SRAM product line, engineered specifically for ultra-low-latency, high-bandwidth buffering in packet-switched infrastructure where deterministic timing and concurrent access are mandatory.
FAQ
What is the function of the DOFF pin on CY7C1512KV18-250BZXIT?
The DOFF (Data Out Fast) pin selects read latency mode: when asserted HIGH, it configures the device for 1.5-cycle read latency (optimal for QDR II throughput); when LOW, it reverts to 1-cycle latency for backward compatibility with QDR I systems. This setting is sampled synchronously on the K clock and affects all subsequent read operations until changed.
Does CY7C1512KV18-250BZXIT support partial writes without read-modify-write cycles?
Yes. The device supports true partial writes using BWS[1:0] (Byte Write Select) inputs. Each BWS signal controls a 9-bit segment of the 18-bit D[17:0] bus, allowing independent update of either half-word without affecting the other. No internal read-modify-write sequence is required-writes are atomic and synchronous to the K clock.
How do the CQ and CQ echo clocks improve system timing margin?
CQ and CQ are phase-aligned, low-skew copies of the C and C output clocks, routed alongside Q[17:0]. They provide a local, source-synchronous capture reference at the receiver, eliminating flight-time mismatch between clock and data. This reduces timing uncertainty by up to 150 ps compared to using system-generated clocks, enabling reliable 500 Mbps DDR operation on FR4 PCBs.
Can CY7C1512KV18-250BZXIT operate with VDDQ = 1.5 V while VDD = 1.8 V?
Yes. The datasheet explicitly specifies VDDQ = 1.4 V to VDD, and VDD is fixed at 1.8 V ±0.1 V. Therefore, VDDQ = 1.5 V is within specification and commonly used to interface with 1.5 V FPGA I/O banks. All AC parameters-including setup/hold times and output swing-are guaranteed across this VDDQ range when VDD is 1.8 V.
CY7C1512KV18-250BZXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1512KV18-250BZXIT FAQ
1.How can I place an order for CY7C1512KV18-250BZXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1512KV18-250BZXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1512KV18-250BZXIT reliable?
The price and inventory of CY7C1512KV18-250BZXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512KV18-250BZXIT is usually 5 days.
3.What payment methods are accepted for CY7C1512KV18-250BZXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512KV18-250BZXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1512KV18-250BZXIT?
CY7C1512KV18-250BZXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1512KV18-250BZXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1512KV18-250BZXIT?
For technical support, including CY7C1512KV18-250BZXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512KV18-250BZXIT requirements.
6.How does Aetrix verify that CY7C1512KV18-250BZXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1512KV18-250BZXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512KV18-250BZXIT meets industry standards.
7.What is the process for return or replacement of CY7C1512KV18-250BZXIT?
All CY7C1512KV18-250BZXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512KV18-250BZXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1512KV18-250BZXIT part is unused and in its original packaging.
Return procedure for CY7C1512KV18-250BZXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1512KV18-250BZXIT Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

