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Infineon Technologies CY7C1512KV18-250BZXIT

Part No.:
CY7C1512KV18-250BZXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1512KV18-250BZXIT.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,232

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Product details

Overview

CY7C1512KV18-250BZXIT from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 1.8V QDR® II SRAM with dual independent read/write ports, 250 MHz operation (40 ns clock period), DDR interfaces on both ports (500 Mbps per pin), and 1.5-cycle read latency when DOFF is HIGH. It delivers high-bandwidth buffering for network packet processing in telecom line cards.

For engineers reviewing the CY7C1512KV18-250BZXIT datasheet, CY7C1512KV18-250BZXIT pinout, CY7C1512KV18-250BZXIT application, or CY7C1512KV18-250BZXIT equivalent, key selection criteria include burst depth (2-word), I/O voltage compatibility (VDDQ = 1.4–1.8 V), echo clock support (CQ/CQ), PLL-based timing alignment, and FBGA-165 package thermal/mechanical constraints.

Technical Context

This QDR II SRAM implements fully synchronous, pipelined access with separate K/K clocks for write/read address latching and C/C clocks for output data registration. Its architecture eliminates bus turnaround by dedicating D[x:0] inputs to writes and Q[x:0] outputs to reads.

The device uses on-chip PLL for precise data-eye placement and supports two operational modes: 1.5-cycle read latency (DOFF = HIGH) for maximum throughput, or 1-cycle latency (DOFF = LOW) for QDR I compatibility. Byte write select (BWS[1:0]) enables partial-word updates without read-modify-write cycles.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density4M × 18-bit (72 Mbit); supports 18-bit parallel data path for high-throughput packet header storage
Max Clock Frequency250 MHz (40 ns period); defines maximum sustained transaction rate of 250 million read+write operations/sec
Data Rate500 Mbps per I/O (DDR at 250 MHz); enables 9 Gbps aggregate bandwidth across 18-bit data bus
Read Latency1.5 cycles (DOFF = HIGH); guarantees data valid 1.5 clocks after read address assertion, critical for pipeline synchronization
VDD / VDDQCore VDD = 1.8 V ±0.1 V; I/O VDDQ = 1.4–1.8 V; allows interoperability with 1.5 V or 1.8 V logic families
Package165-ball FBGA (13 × 15 × 1.4 mm); provides 0.8 mm ball pitch, suitable for high-density routing in telecom PCBs
Write EnableSynchronous WPS + BWS[1:0]; enables selective 9-bit byte writes without disturbing adjacent bytes in same 18-bit word

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant (Pb-free).

Pin/TerminalCircuit RoleDesign Meaning
D[17:0]Write Data Input Bus18-bit synchronous input sampled on rising edge of K clock; accepts full or partial (via BWS) word writes
Q[17:0]Read Data Output Bus18-bit registered output driven on rising edge of C clock; synchronized to echo clock CQ for timing margin
K / KWrite/Read Clock InputsDual-phase clocks latch write/read addresses independently; only rising edges used for all synchronous inputs
C / CRead Data Output ClocksSeparate clocks drive Q[17:0] and minimize skew between data and capture clock at receiver
CQ / CQEcho Clock OutputsPhase-matched copies of C/C clocks; simplify source-synchronous capture in FPGA/ASIC receivers
WPSWrite Port SelectActive-low signal enabling write transactions; deassertion blocks D[17:0] sampling and prevents unintended writes
BWS[1:0]Byte Write SelectTwo active-low signals controlling 9-bit byte segments; permits granular 9-bit updates within 18-bit word
DOFFRead Latency ModeHigh = 1.5-cycle latency (optimized throughput); Low = 1-cycle latency (QDR I compatibility)
RPSRead Port SelectActive-low signal enabling read transactions; required to assert before read address is latched
A[20:0]Address Input Bus21-bit multiplexed address latched alternately on K/K rising edges for read/write port addressing

Key Features

FeatureDesign Value
Independent Read/Write PortsEnables concurrent read and write to different addresses-no bus arbitration or turnaround delay required
2-Word Burst ArchitectureEvery access transfers two consecutive words, doubling effective bandwidth over single-word devices
PLL-Based Timing ControlOn-chip PLL aligns internal data strobes to external clocks, reducing setup/hold violations at 250 MHz
Variable Drive HSTL OutputsAdjustable output strength matches trace impedance, minimizing reflections on high-speed memory buses
JTAG 1149.1 Boundary ScanSupports IEEE-compliant testing and interconnect verification in assembled systems without physical probe access

Applications

Network Packet BufferingTelecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches.

IC Role / Device Role / Timing Role: High-speed dual-port buffer providing simultaneous ingress packet write and egress packet read with zero turnaround latency.

Use Value: Sustains 9 Gbps bidirectional throughput at 250 MHz, eliminating bottlenecks in 10G/40G line card data paths.

Use Scenario: Holding control-plane metadata and forwarding tables in carrier-grade optical transport equipment.

IC Role / Device Role / Timing Role: Deterministic-latency SRAM supporting real-time lookup table updates while servicing live traffic reads.

Use Value: 1.5-cycle read latency ensures sub-6 ns response time for critical control operations under full load.

Baseband Processing CacheFPGA Co-Processor Memory

Use Scenario: Serving as low-latency scratchpad for LTE/5G baseband DSPs performing channel estimation and modulation.

IC Role / Device Role / Timing Role: Pipelined memory interfacing directly to multi-core DSP fabric via dedicated read/write data paths.

Use Value: Dual-port isolation prevents read stalls during bursty write-heavy FFT/IFFT workloads.

Use Scenario: Offloading memory-intensive tasks from Xilinx/Intel FPGAs in radar and software-defined radio systems.

IC Role / Device Role / Timing Role: Externally synchronized SRAM acting as high-bandwidth frame buffer between FPGA logic and ADC/DAC interfaces.

Use Value: Echo clocks (CQ/CQ) enable reliable source-synchronous capture in FPGA I/O banks without custom timing closure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AS7C3256A-25JCINAsynchronous 32K × 8 SRAM; no DDR, no echo clocks, no PLL; 25 ns access, single-portLimited to low-speed control storage; cannot support concurrent read/write or 500 Mbps signalingSelect only for cost-sensitive, non-pipelined designs where bandwidth < 200 Mbps suffices
IS61WV102418BLL-25BLISynchronous 1M × 18 ZBT SRAM; single clock domain; 25 ns cycle time; no echo clocks or DOFF latency controlRequires external clock management; lacks QDR II's 1.5-cycle mode and burst efficiencyChoose when system already uses ZBT protocol and does not require echo-clock–based timing simplification

Compared with AS7C3256A-25JCIN and IS61WV102418BLL-25BLI, CY7C1512KV18-250BZXIT uniquely delivers true concurrent dual-port operation, DDR signaling, and echo-clock–assisted capture-enabling deterministic 9 Gbps throughput unattainable with asynchronous or ZBT alternatives.

Availability

CY7C1512KV18-250BZXIT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing cache, and FPGA co-processor memory requiring stable component supply and long-term industrial availability.

Supply support for CY7C1512KV18-250BZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems.

This device belongs to the QDR® II SRAM product line, engineered specifically for ultra-low-latency, high-bandwidth buffering in packet-switched infrastructure where deterministic timing and concurrent access are mandatory.

FAQ

What is the function of the DOFF pin on CY7C1512KV18-250BZXIT?

The DOFF (Data Out Fast) pin selects read latency mode: when asserted HIGH, it configures the device for 1.5-cycle read latency (optimal for QDR II throughput); when LOW, it reverts to 1-cycle latency for backward compatibility with QDR I systems. This setting is sampled synchronously on the K clock and affects all subsequent read operations until changed.

Does CY7C1512KV18-250BZXIT support partial writes without read-modify-write cycles?

Yes. The device supports true partial writes using BWS[1:0] (Byte Write Select) inputs. Each BWS signal controls a 9-bit segment of the 18-bit D[17:0] bus, allowing independent update of either half-word without affecting the other. No internal read-modify-write sequence is required-writes are atomic and synchronous to the K clock.

How do the CQ and CQ echo clocks improve system timing margin?

CQ and CQ are phase-aligned, low-skew copies of the C and C output clocks, routed alongside Q[17:0]. They provide a local, source-synchronous capture reference at the receiver, eliminating flight-time mismatch between clock and data. This reduces timing uncertainty by up to 150 ps compared to using system-generated clocks, enabling reliable 500 Mbps DDR operation on FR4 PCBs.

Can CY7C1512KV18-250BZXIT operate with VDDQ = 1.5 V while VDD = 1.8 V?

Yes. The datasheet explicitly specifies VDDQ = 1.4 V to VDD, and VDD is fixed at 1.8 V ±0.1 V. Therefore, VDDQ = 1.5 V is within specification and commonly used to interface with 1.5 V FPGA I/O banks. All AC parameters-including setup/hold times and output swing-are guaranteed across this VDDQ range when VDD is 1.8 V.

CY7C1512KV18-250BZXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1512KV18-250BZXIT FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1512KV18-250BZXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CY7C1512KV18-250BZXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512KV18-250BZXIT is usually 5 days.

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Once your CY7C1512KV18-250BZXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1512KV18-250BZXIT?

For technical support, including CY7C1512KV18-250BZXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512KV18-250BZXIT requirements.

6.How does Aetrix verify that CY7C1512KV18-250BZXIT is sourced from the original manufacturer or authorized distributors?

All CY7C1512KV18-250BZXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512KV18-250BZXIT meets industry standards.

7.What is the process for return or replacement of CY7C1512KV18-250BZXIT?

All CY7C1512KV18-250BZXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512KV18-250BZXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1512KV18-250BZXIT part is unused and in its original packaging.

Return procedure for CY7C1512KV18-250BZXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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