Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY7C1512KV18-300BZC

Part No.:
CY7C1512KV18-300BZC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1512KV18-300BZC.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,477

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY7C1512KV18-300BZC from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 300 MHz QDR® II SRAM with separate read/write ports, DDR interfaces on both ports (600 Mbps per port), 1.8V core supply, and 1.4–1.8V I/O supply. It delivers concurrent read/write transactions with 1.5-cycle read latency (DOFF = HIGH) in high-bandwidth networking and packet buffering applications.

For engineers reviewing the CY7C1512KV18-300BZC datasheet, CY7C1512KV18-300BZC pinout, CY7C1512KV18-300BZC application, or CY7C1512KV18-300BZC equivalent, key selection criteria include burst depth (2-word), echo clock support (CQ/CQ), PLL-based timing alignment, HSTL-compatible outputs, and 165-ball FBGA (13 × 15 × 1.4 mm) package compatibility.

Technical Context

This QDR II SRAM implements fully independent synchronous read and write ports sharing a multiplexed address bus, with addresses latched on alternate rising edges of K/K clocks. Internal self-timed writes and programmable DOFF enable configurable read latency (1-cycle or 1.5-cycle).

The device integrates a Phase-Locked Loop (PLL) for precise data placement, echo clocks (CQ/CQ) to simplify high-speed capture, and variable-drive HSTL output buffers. It supports depth expansion via RPS/WPS and byte-level write masking using BWS[1:0] signals for 18-bit data width.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 4M × 18-bit (72 Mbit); supports 2-word burst transfers per access
Max Clock Frequency 300 MHz; enables 600 MT/s effective data rate per port via DDR
Read Latency 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW); determines pipeline depth in controller design
Supply Voltages VDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O); allows interoperability with 1.5V or 1.8V systems
Package 165-ball FBGA (13 × 15 × 1.4 mm); RoHS-compliant, 0.8 mm ball pitch
Interface Standard HSTL Class I compatible inputs/outputs; ensures signal integrity at 300 MHz operation
JTAG Support IEEE 1149.1 compliant TAP; enables boundary scan testing and debug in production

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous write data input 18-bit parallel data sampled on rising edge of K clock; defines memory word width
A[20:0] Multiplexed address input 21-bit address latched alternately for read/write; supports 4M-depth addressing
K / K Input clocks (read/write) Dual-phase clocks for DDR timing; only rising edges used for register sampling
C / C Output clocks (read/write) Source-synchronous clocks for Q[17:0] outputs; minimizes skew vs. data flight time
CQ / CQ Echo clocks Delayed copies of C/C; simplify latch timing in high-speed FPGA receivers
RPS / WPS Port select controls Active-low enables for independent read/write port activation; enables depth expansion
BWS[1:0] Byte write selects Two active-low signals controlling 9-bit byte segments within 18-bit D[17:0]; enables partial writes
DOFF Read latency mode control High = 1.5-cycle latency; Low = 1-cycle latency; configures internal pipeline staging
VDD / VDDQ / VSS Power and ground terminals Dedicated 1.8V core (VDD), 1.4–1.8V I/O (VDDQ), and multiple VSS balls for noise suppression
TCK/TMS/TDI/TDO JTAG test interface IEEE 1149.1 boundary scan access; supports production test and diagnostics

Key Features

Feature Design Value
Separate read/write data paths Eliminates bus turnaround overhead; enables true concurrent access without arbitration delay
2-word burst architecture Guarantees two sequential words per address access; reduces address strobe frequency by 2×
Integrated PLL with echo clocks Enables deterministic setup/hold margins at 300 MHz; removes need for external clock retiming
Programmable DOFF latency mode Allows runtime selection between 1-cycle (low-latency) and 1.5-cycle (higher throughput) read pipelines
HSTL Class I I/O with ZQ calibration Ensures impedance-matched signaling across process/voltage/temperature; supports >600 Mbps per pin
Byte-selectable write masking (BWS[1:0]) Permits partial 9-bit writes without read-modify-write; critical for packet header updates in buffer RAM

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing ingress/egress packet headers and payloads in 10G/40G Ethernet switches.

IC Role / Device Role / Timing Role: Dual-port SRAM serving as shared buffer between ingress parser and egress scheduler logic.

Use Value: Concurrent read/write eliminates arbitration stalls, enabling line-rate forwarding at 40 Gbps with sub-10 ns latency.

Use Scenario: Holding configuration tables and real-time statistics in carrier-grade DSLAMs and OLTs.

IC Role / Device Role / Timing Role: High-reliability memory for control-plane lookup tables accessed by ARM-based management CPU and DSP-based traffic engines.

Use Value: 1.8V core + 1.5V I/O compatibility reduces power delivery complexity while maintaining 300 MHz throughput.

Baseband Processing Buffer FPGA Co-Processor Cache

Use Scenario: Interfacing between multi-core DSPs and RF front-end FPGAs in LTE/5G base stations.

IC Role / Device Role / Timing Role: Synchronous pipelined buffer decoupling bursty MAC-layer processing from deterministic PHY-layer timing.

Use Value: Echo clocks (CQ/CQ) align with FPGA IDELAY/ODELAY primitives, achieving <±50 ps clock-to-data skew.

Use Scenario: Off-chip cache for Xilinx Ultrascale+ or Intel Stratix 10 FPGA-based accelerators in AI inference pipelines.

IC Role / Device Role / Timing Role: Low-latency, high-bandwidth scratchpad memory supplementing on-die BRAM for matrix tile buffering.

Use Value: 72-Mbit capacity and 2-word burst reduce external memory accesses by 40% versus single-word SRAMs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615L10BG 36-bit × 2M, 100 MHz max, LVDS I/O, no echo clocks or PLL Limited to lower bandwidth systems; requires external clock deskew circuitry Select when system clock ≤100 MHz and cost sensitivity outweighs timing margin needs
ISSI IS61WV102418BLL-10BLI 1M × 18-bit, 100 MHz, async SRAM, no DDR or burst capability Cannot support concurrent read/write; lacks QDR timing architecture Choose only for legacy designs requiring pin-compatible replacement without performance upgrade

Compared with IDT72T3615L10BG and IS61WV102418BLL-10BLI, CY7C1512KV18-300BZC uniquely delivers 300 MHz DDR bandwidth, echo-clock–assisted capture, and programmable latency-enabling next-generation packet processors where timing closure and throughput density are critical.

Availability

CY7C1512KV18-300BZC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing buffers, and FPGA co-processor caches requiring stable component supply across extended product lifecycles.

Supply support for CY7C1512KV18-300BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and mixed-signal ICs for communications, industrial, and automotive systems, with emphasis on signal integrity and timing precision.

CY7C1512KV18 belongs to the QDR® II SRAM product line, engineered specifically for high-throughput, low-latency data buffering in packet-switched infrastructure where deterministic DDR timing and concurrent access are mandatory.

FAQ

What is the function of the DOFF pin on CY7C1512KV18-300BZC?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle read latency for optimized throughput in burst-heavy workloads; when LOW, it selects 1-cycle latency for minimal access delay. This setting is sampled synchronously on the K clock and affects internal pipeline staging-not output drive strength or timing margins.

How does the CQ/CQ echo clock improve system timing margin?

CQ and CQ are delayed copies of the C and C output clocks, generated internally to match the flight time of Q[17:0] data signals. When captured by an FPGA's IDELAY/ODELAY or dedicated source-synchronous input registers, they eliminate board-level skew between clock and data, enabling reliable sampling at 300 MHz without manual PCB length matching.

Can CY7C1512KV18-300BZC operate with 1.5V VDDQ while using 1.8V VDD?

Yes. The device specifies VDDQ = 1.4 V to VDD, and VDD is fixed at 1.8 V ±0.1 V. Therefore, 1.5V VDDQ is fully supported and commonly used to interface with 1.5V logic families. All HSTL Class I I/O characteristics-including drive strength, termination, and AC timing-are guaranteed across this range.

What is the purpose of BWS[1:0] in a 18-bit configuration?

BWS[1:0] provides two independent active-low byte write enables for the 18-bit D[17:0] bus: BWS0 controls D[8:0] (9 LSBs) and BWS1 controls D[17:9] (9 MSBs). This allows selective updating of either 9-bit half-word without disturbing the other, essential for atomic header modifications in packet buffer applications.

CY7C1512KV18-300BZC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
300 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1512KV18-300BZC FAQ

1.How can I place an order for CY7C1512KV18-300BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1512KV18-300BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1512KV18-300BZC reliable?

The price and inventory of CY7C1512KV18-300BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512KV18-300BZC is usually 5 days.

3.What payment methods are accepted for CY7C1512KV18-300BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512KV18-300BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1512KV18-300BZC?

CY7C1512KV18-300BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1512KV18-300BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1512KV18-300BZC?

For technical support, including CY7C1512KV18-300BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512KV18-300BZC requirements.

6.How does Aetrix verify that CY7C1512KV18-300BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1512KV18-300BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512KV18-300BZC meets industry standards.

7.What is the process for return or replacement of CY7C1512KV18-300BZC?

All CY7C1512KV18-300BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512KV18-300BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1512KV18-300BZC part is unused and in its original packaging.

Return procedure for CY7C1512KV18-300BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1512KV18-300BZC Tags

  • CY7C1512KV18-300BZC
  • CY7C1512KV18-300BZC PDF
  • CY7C1512KV18-300BZC Datasheet
  • CY7C1512KV18-300BZC Specifications
  • CY7C1512KV18-300BZC Images
  • Infineon Technologies
  • Infineon Technologies CY7C1512KV18-300BZC
  • Buy CY7C1512KV18-300BZC
  • CY7C1512KV18-300BZC Price
  • CY7C1512KV18-300BZC Distributor
  • CY7C1512KV18-300BZC Supplier
  • CY7C1512KV18-300BZC Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER