Infineon Technologies CY7C1512KV18-300BZC
- Part No.:
- CY7C1512KV18-300BZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1512KV18-300BZC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1512KV18-300BZC from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 300 MHz QDR® II SRAM with separate read/write ports, DDR interfaces on both ports (600 Mbps per port), 1.8V core supply, and 1.4–1.8V I/O supply. It delivers concurrent read/write transactions with 1.5-cycle read latency (DOFF = HIGH) in high-bandwidth networking and packet buffering applications.
For engineers reviewing the CY7C1512KV18-300BZC datasheet, CY7C1512KV18-300BZC pinout, CY7C1512KV18-300BZC application, or CY7C1512KV18-300BZC equivalent, key selection criteria include burst depth (2-word), echo clock support (CQ/CQ), PLL-based timing alignment, HSTL-compatible outputs, and 165-ball FBGA (13 × 15 × 1.4 mm) package compatibility.
Technical Context
This QDR II SRAM implements fully independent synchronous read and write ports sharing a multiplexed address bus, with addresses latched on alternate rising edges of K/K clocks. Internal self-timed writes and programmable DOFF enable configurable read latency (1-cycle or 1.5-cycle).
The device integrates a Phase-Locked Loop (PLL) for precise data placement, echo clocks (CQ/CQ) to simplify high-speed capture, and variable-drive HSTL output buffers. It supports depth expansion via RPS/WPS and byte-level write masking using BWS[1:0] signals for 18-bit data width.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4M × 18-bit (72 Mbit); supports 2-word burst transfers per access |
| Max Clock Frequency | 300 MHz; enables 600 MT/s effective data rate per port via DDR |
| Read Latency | 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW); determines pipeline depth in controller design |
| Supply Voltages | VDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O); allows interoperability with 1.5V or 1.8V systems |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm); RoHS-compliant, 0.8 mm ball pitch |
| Interface Standard | HSTL Class I compatible inputs/outputs; ensures signal integrity at 300 MHz operation |
| JTAG Support | IEEE 1149.1 compliant TAP; enables boundary scan testing and debug in production |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | 18-bit parallel data sampled on rising edge of K clock; defines memory word width |
| A[20:0] | Multiplexed address input | 21-bit address latched alternately for read/write; supports 4M-depth addressing |
| K / K | Input clocks (read/write) | Dual-phase clocks for DDR timing; only rising edges used for register sampling |
| C / C | Output clocks (read/write) | Source-synchronous clocks for Q[17:0] outputs; minimizes skew vs. data flight time |
| CQ / CQ | Echo clocks | Delayed copies of C/C; simplify latch timing in high-speed FPGA receivers |
| RPS / WPS | Port select controls | Active-low enables for independent read/write port activation; enables depth expansion |
| BWS[1:0] | Byte write selects | Two active-low signals controlling 9-bit byte segments within 18-bit D[17:0]; enables partial writes |
| DOFF | Read latency mode control | High = 1.5-cycle latency; Low = 1-cycle latency; configures internal pipeline staging |
| VDD / VDDQ / VSS | Power and ground terminals | Dedicated 1.8V core (VDD), 1.4–1.8V I/O (VDDQ), and multiple VSS balls for noise suppression |
| TCK/TMS/TDI/TDO | JTAG test interface | IEEE 1149.1 boundary scan access; supports production test and diagnostics |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data paths | Eliminates bus turnaround overhead; enables true concurrent access without arbitration delay |
| 2-word burst architecture | Guarantees two sequential words per address access; reduces address strobe frequency by 2× |
| Integrated PLL with echo clocks | Enables deterministic setup/hold margins at 300 MHz; removes need for external clock retiming |
| Programmable DOFF latency mode | Allows runtime selection between 1-cycle (low-latency) and 1.5-cycle (higher throughput) read pipelines |
| HSTL Class I I/O with ZQ calibration | Ensures impedance-matched signaling across process/voltage/temperature; supports >600 Mbps per pin |
| Byte-selectable write masking (BWS[1:0]) | Permits partial 9-bit writes without read-modify-write; critical for packet header updates in buffer RAM |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payloads in 10G/40G Ethernet switches. IC Role / Device Role / Timing Role: Dual-port SRAM serving as shared buffer between ingress parser and egress scheduler logic. Use Value: Concurrent read/write eliminates arbitration stalls, enabling line-rate forwarding at 40 Gbps with sub-10 ns latency. |
Use Scenario: Holding configuration tables and real-time statistics in carrier-grade DSLAMs and OLTs. IC Role / Device Role / Timing Role: High-reliability memory for control-plane lookup tables accessed by ARM-based management CPU and DSP-based traffic engines. Use Value: 1.8V core + 1.5V I/O compatibility reduces power delivery complexity while maintaining 300 MHz throughput. |
| Baseband Processing Buffer | FPGA Co-Processor Cache |
|
Use Scenario: Interfacing between multi-core DSPs and RF front-end FPGAs in LTE/5G base stations. IC Role / Device Role / Timing Role: Synchronous pipelined buffer decoupling bursty MAC-layer processing from deterministic PHY-layer timing. Use Value: Echo clocks (CQ/CQ) align with FPGA IDELAY/ODELAY primitives, achieving <±50 ps clock-to-data skew. |
Use Scenario: Off-chip cache for Xilinx Ultrascale+ or Intel Stratix 10 FPGA-based accelerators in AI inference pipelines. IC Role / Device Role / Timing Role: Low-latency, high-bandwidth scratchpad memory supplementing on-die BRAM for matrix tile buffering. Use Value: 72-Mbit capacity and 2-word burst reduce external memory accesses by 40% versus single-word SRAMs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-bit × 2M, 100 MHz max, LVDS I/O, no echo clocks or PLL | Limited to lower bandwidth systems; requires external clock deskew circuitry | Select when system clock ≤100 MHz and cost sensitivity outweighs timing margin needs |
| ISSI IS61WV102418BLL-10BLI | 1M × 18-bit, 100 MHz, async SRAM, no DDR or burst capability | Cannot support concurrent read/write; lacks QDR timing architecture | Choose only for legacy designs requiring pin-compatible replacement without performance upgrade |
Compared with IDT72T3615L10BG and IS61WV102418BLL-10BLI, CY7C1512KV18-300BZC uniquely delivers 300 MHz DDR bandwidth, echo-clock–assisted capture, and programmable latency-enabling next-generation packet processors where timing closure and throughput density are critical.
Availability
CY7C1512KV18-300BZC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing buffers, and FPGA co-processor caches requiring stable component supply across extended product lifecycles.
Supply support for CY7C1512KV18-300BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and mixed-signal ICs for communications, industrial, and automotive systems, with emphasis on signal integrity and timing precision.
CY7C1512KV18 belongs to the QDR® II SRAM product line, engineered specifically for high-throughput, low-latency data buffering in packet-switched infrastructure where deterministic DDR timing and concurrent access are mandatory.
FAQ
What is the function of the DOFF pin on CY7C1512KV18-300BZC?
The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle read latency for optimized throughput in burst-heavy workloads; when LOW, it selects 1-cycle latency for minimal access delay. This setting is sampled synchronously on the K clock and affects internal pipeline staging-not output drive strength or timing margins.
How does the CQ/CQ echo clock improve system timing margin?
CQ and CQ are delayed copies of the C and C output clocks, generated internally to match the flight time of Q[17:0] data signals. When captured by an FPGA's IDELAY/ODELAY or dedicated source-synchronous input registers, they eliminate board-level skew between clock and data, enabling reliable sampling at 300 MHz without manual PCB length matching.
Can CY7C1512KV18-300BZC operate with 1.5V VDDQ while using 1.8V VDD?
Yes. The device specifies VDDQ = 1.4 V to VDD, and VDD is fixed at 1.8 V ±0.1 V. Therefore, 1.5V VDDQ is fully supported and commonly used to interface with 1.5V logic families. All HSTL Class I I/O characteristics-including drive strength, termination, and AC timing-are guaranteed across this range.
What is the purpose of BWS[1:0] in a 18-bit configuration?
BWS[1:0] provides two independent active-low byte write enables for the 18-bit D[17:0] bus: BWS0 controls D[8:0] (9 LSBs) and BWS1 controls D[17:9] (9 MSBs). This allows selective updating of either 9-bit half-word without disturbing the other, essential for atomic header modifications in packet buffer applications.
CY7C1512KV18-300BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 300 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1512KV18-300BZC FAQ
1.How can I place an order for CY7C1512KV18-300BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1512KV18-300BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1512KV18-300BZC reliable?
The price and inventory of CY7C1512KV18-300BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512KV18-300BZC is usually 5 days.
3.What payment methods are accepted for CY7C1512KV18-300BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512KV18-300BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1512KV18-300BZC?
CY7C1512KV18-300BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1512KV18-300BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1512KV18-300BZC?
For technical support, including CY7C1512KV18-300BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512KV18-300BZC requirements.
6.How does Aetrix verify that CY7C1512KV18-300BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1512KV18-300BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512KV18-300BZC meets industry standards.
7.What is the process for return or replacement of CY7C1512KV18-300BZC?
All CY7C1512KV18-300BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512KV18-300BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1512KV18-300BZC part is unused and in its original packaging.
Return procedure for CY7C1512KV18-300BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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