Infineon Technologies CY7C1512KV18-300BZIT
- Part No.:
- CY7C1512KV18-300BZIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1512KV18-300BZIT.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1512KV18-300BZIT from Cypress Semiconductor is a 4M × 18-bit (72-Mbit) QDR® II synchronous SRAM with dual independent read/write ports, 300 MHz clock operation, DDR interfaces on both ports (600 Mbps per port), and 1.8V core / 1.4–1.8V I/O supply. It delivers 1.5-cycle read latency when DOFF = HIGH and supports concurrent transactions in high-bandwidth networking buffers.
For engineers reviewing the CY7C1512KV18-300BZIT datasheet, CY7C1512KV18-300BZIT pinout, CY7C1512KV18-300BZIT application, or CY7C1512KV18-300BZIT equivalent, key selection criteria include burst depth (2-word), echo clock support (CQ/CQ), PLL-based timing accuracy, and x18 data width for packet buffering in telecom line cards.
Technical Context
The CY7C1512KV18-300BZIT implements QDR II architecture with physically separate read and write data paths, eliminating bus turnaround overhead. It uses two independent input clocks (K/K) for address/data capture and two output clocks (C/C) plus echo clocks (CQ/CQ) to manage flight time skew in >300 MHz systems.
Internally, it features synchronous self-timed writes, programmable impedance (ZQ), JTAG 1149.1 boundary scan, and a phase-locked loop (PLL) for precise data placement. Read latency is configurable between 1-cycle (DOFF = LOW) and 1.5-cycle (DOFF = HIGH), enabling trade-offs between timing margin and throughput in FPGA-attached memory subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4M × 18-bit (72 Mbit); supports 18-bit parallel data path for packet header + payload alignment |
| Max Clock Frequency | 300 MHz; enables 600 MT/s effective data rate via DDR on both read and write ports |
| Read Latency | 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW); directly impacts pipeline depth in switch fabric controllers |
| Supply Voltages | VDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O); allows interoperability with 1.5V or 1.8V FPGA I/O banks |
| Burst Length | 2-word fixed burst; reduces address strobe overhead and simplifies controller logic vs. variable-length bursts |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm); RoHS-compliant footprint compatible with high-density PCB routing |
| Interface Standard | HSTL Class I inputs / outputs; ensures signal integrity at 600 Mbps with controlled drive strength |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | 18-bit parallel data sampled on rising edge of K clock; supports full-width or byte-selectable writes via BWS[1:0] |
| Q[17:0] | Synchronous read data output | 18-bit parallel data driven on rising edge of C clock; echoed by CQ for source-synchronous capture |
| K / K | Input clock pair | Rising edges latch all synchronous inputs (address, data, control); K used for read, K for write addressing |
| C / C | Output clock pair | Rising edges gate read data outputs; minimizes skew between data and clock across PCB traces |
| CQ / CQ | Echo clock outputs | Replica of C/C clocks, routed alongside Q[17:0] to enable precise timing closure in high-speed receivers |
| DOFF | Read latency mode select | Active-HIGH selects 1.5-cycle latency; Active-LOW selects 1-cycle latency - affects FIFO depth in controller design |
| BWS[1:0] | Byte write select | Active-LOW signals controlling D[8:0] (BWS0) and D[17:9] (BWS1); enables partial-word updates without read-modify-write |
| RPS / WPS | Port select | Active-LOW enables read or write port independently; supports depth expansion across multiple devices |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data ports | Enables true concurrent read+write operations - no bus contention or turnaround delay in full-duplex traffic buffers |
| 2-word burst architecture | Reduces address bus activity by 50% per transaction versus single-word access; lowers controller logic complexity |
| Integrated PLL with echo clocks | Eliminates external clock retiming ICs; CQ/CQ provide trace-matched timing references for reliable >600 Mbps capture |
| JTAG 1149.1 boundary scan | Supports automated PCB test and interconnect validation without physical probe access - critical for dense telecom modules |
| Programmable HSTL drive strength (ZQ) | Allows dynamic impedance calibration to match PCB trace characteristics, reducing signal reflections at 300 MHz |
Applications
| Packet Buffer in 10G Ethernet Line Cards | Cell-Based ATM Switch Fabric Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in multi-port line cards handling 10 Gbps line rates. IC Role / Device Role / Timing Role: Dual-port SRAM serving as shared buffer between ingress parser and egress scheduler, with concurrent read/write enabled by QDR II architecture. Use Value: 72-Mbit x18 width aligns with 128-bit+ bus widths in Xilinx Virtex-5/6 FPGAs; 300 MHz DDR interface sustains >10 GB/s aggregate bandwidth. | Use Scenario: Holding fixed-length 53-byte ATM cells in switching matrices requiring deterministic latency and zero bus turnaround. IC Role / Device Role / Timing Role: High-speed memory node in crossbar switch ASIC interface, using RPS/WPS for port arbitration and BWS for cell header updates. Use Value: 1-cycle read latency (DOFF = LOW) guarantees sub-4 ns access time; 2-word burst matches cell payload segmentation. |
| Backplane Interposer Memory for Baseband Units | Real-Time Video Frame Buffer in Broadcast Encoders |
Use Scenario: Bridging high-speed serial links (e.g., CPRI/OBSAI) to baseband processing FPGAs in LTE/5G radio units. IC Role / Device Role / Timing Role: Synchronous SRAM acting as elastic buffer between framer and DSP engine, absorbing jitter via independent read/write clocks. Use Value: K/K and C/C clock separation isolates timing domains; echo clocks (CQ/CQ) simplify capture in multi-FPGA backplane topologies. | Use Scenario: Storing uncompressed 1080p60 YUV422 frames during real-time encoding in broadcast infrastructure. IC Role / Device Role / Timing Role: Frame buffer memory interfaced to video processor's 18-bit parallel bus, leveraging burst reads for line-based pixel streaming. Use Value: 4M × 18-bit capacity holds ~1.2 full HD frames; 300 MHz DDR supports 2.16 Gbps sustained write/read for 60 fps streaming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10PA | 36-bit width, 10 ns async access, no DDR or echo clocks; TTL-compatible I/O | Targeted at legacy telecom control planes with simpler timing; lacks QDR II concurrency | Select only if system requires asynchronous interface or wider data bus without DDR timing constraints |
| ISSI IS61WV102418BLL-10TLI | 1M × 18-bit, 10 ns async access, 3.3V core/I/O, no burst or echo clocks | Used in cost-sensitive industrial controllers where bandwidth < 1 Gbps suffices | Choose only for low-speed, non-concurrent applications where QDR II features add unnecessary complexity |
Compared with IDT72T3615L10PA and IS61WV102418BLL-10TLI, the CY7C1512KV18-300BZIT uniquely delivers concurrent DDR read/write at 300 MHz with echo-clock–assisted timing closure - essential for modern FPGA-based packet processing where bandwidth and determinism are co-constrained.
Availability
CY7C1512KV18-300BZIT is available at Aetrix Electronics and suitable for 10G Ethernet line cards, ATM switch fabrics, LTE/5G baseband interposers, and broadcast video encoders requiring stable component supply across multi-year production cycles.
Supply support for CY7C1512KV18-300BZIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and timing precision.
The QDR® II SRAM product line targets high-speed packet buffering and switching systems requiring deterministic latency, concurrent access, and DDR bandwidth - optimized for FPGA- and ASIC-based infrastructure equipment.
FAQ
What is the function of the DOFF pin on CY7C1512KV18-300BZIT?
The DOFF (Data Output OFFset) pin configures read latency: when asserted HIGH, it enables 1.5-cycle latency for improved timing margin in high-skew layouts; when LOW, it selects 1-cycle latency for minimal access delay. This setting directly determines the number of clock cycles between address assertion and valid Q[17:0] output, and must be set before initialization.
How does the CY7C1512KV18-300BZIT handle partial-word writes?
It uses two active-LOW Byte Write Select signals (BWS[1:0]) to enable selective updating of D[8:0] (BWS0) and D[17:9] (BWS1). When a BWS signal is deasserted, the corresponding 9-bit byte remains unaltered - eliminating need for read-modify-write cycles and preserving data coherency during burst-oriented packet edits.
Can CY7C1512KV18-300BZIT operate with only one clock domain?
Yes - it supports single-clock mode where K and C are tied together (and K and C likewise), simplifying board layout at the cost of reduced timing flexibility. In this mode, the device behaves like a standard QDR I part with 1-cycle latency, but loses the skew-reduction benefit of independent output clocks and echo clock synchronization.
What is the role of the ZQ pin in CY7C1512KV18-300BZIT?
ZQ connects to an external 240 Ω ±1% reference resistor to ground, enabling on-chip impedance calibration of HSTL output drivers. This adjusts drive strength dynamically to match PCB trace impedance, minimizing signal reflections and ensuring clean eye diagrams at 600 Mbps DDR rates - critical for reliable operation in dense backplane environments.
CY7C1512KV18-300BZIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 300 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1512KV18-300BZIT FAQ
1.How can I place an order for CY7C1512KV18-300BZIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1512KV18-300BZIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1512KV18-300BZIT reliable?
The price and inventory of CY7C1512KV18-300BZIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512KV18-300BZIT is usually 5 days.
3.What payment methods are accepted for CY7C1512KV18-300BZIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512KV18-300BZIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1512KV18-300BZIT?
CY7C1512KV18-300BZIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1512KV18-300BZIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1512KV18-300BZIT?
For technical support, including CY7C1512KV18-300BZIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512KV18-300BZIT requirements.
6.How does Aetrix verify that CY7C1512KV18-300BZIT is sourced from the original manufacturer or authorized distributors?
All CY7C1512KV18-300BZIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512KV18-300BZIT meets industry standards.
7.What is the process for return or replacement of CY7C1512KV18-300BZIT?
All CY7C1512KV18-300BZIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512KV18-300BZIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1512KV18-300BZIT part is unused and in its original packaging.
Return procedure for CY7C1512KV18-300BZIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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