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Infineon Technologies CY7C1512KV18-300BZIT

Part No.:
CY7C1512KV18-300BZIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1512KV18-300BZIT.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,128

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Product details

Overview

CY7C1512KV18-300BZIT from Cypress Semiconductor is a 4M × 18-bit (72-Mbit) QDR® II synchronous SRAM with dual independent read/write ports, 300 MHz clock operation, DDR interfaces on both ports (600 Mbps per port), and 1.8V core / 1.4–1.8V I/O supply. It delivers 1.5-cycle read latency when DOFF = HIGH and supports concurrent transactions in high-bandwidth networking buffers.

For engineers reviewing the CY7C1512KV18-300BZIT datasheet, CY7C1512KV18-300BZIT pinout, CY7C1512KV18-300BZIT application, or CY7C1512KV18-300BZIT equivalent, key selection criteria include burst depth (2-word), echo clock support (CQ/CQ), PLL-based timing accuracy, and x18 data width for packet buffering in telecom line cards.

Technical Context

The CY7C1512KV18-300BZIT implements QDR II architecture with physically separate read and write data paths, eliminating bus turnaround overhead. It uses two independent input clocks (K/K) for address/data capture and two output clocks (C/C) plus echo clocks (CQ/CQ) to manage flight time skew in >300 MHz systems.

Internally, it features synchronous self-timed writes, programmable impedance (ZQ), JTAG 1149.1 boundary scan, and a phase-locked loop (PLL) for precise data placement. Read latency is configurable between 1-cycle (DOFF = LOW) and 1.5-cycle (DOFF = HIGH), enabling trade-offs between timing margin and throughput in FPGA-attached memory subsystems.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density4M × 18-bit (72 Mbit); supports 18-bit parallel data path for packet header + payload alignment
Max Clock Frequency300 MHz; enables 600 MT/s effective data rate via DDR on both read and write ports
Read Latency1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW); directly impacts pipeline depth in switch fabric controllers
Supply VoltagesVDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O); allows interoperability with 1.5V or 1.8V FPGA I/O banks
Burst Length2-word fixed burst; reduces address strobe overhead and simplifies controller logic vs. variable-length bursts
Package165-ball FBGA (13 × 15 × 1.4 mm); RoHS-compliant footprint compatible with high-density PCB routing
Interface StandardHSTL Class I inputs / outputs; ensures signal integrity at 600 Mbps with controlled drive strength

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
D[17:0]Synchronous write data input18-bit parallel data sampled on rising edge of K clock; supports full-width or byte-selectable writes via BWS[1:0]
Q[17:0]Synchronous read data output18-bit parallel data driven on rising edge of C clock; echoed by CQ for source-synchronous capture
K / KInput clock pairRising edges latch all synchronous inputs (address, data, control); K used for read, K for write addressing
C / COutput clock pairRising edges gate read data outputs; minimizes skew between data and clock across PCB traces
CQ / CQEcho clock outputsReplica of C/C clocks, routed alongside Q[17:0] to enable precise timing closure in high-speed receivers
DOFFRead latency mode selectActive-HIGH selects 1.5-cycle latency; Active-LOW selects 1-cycle latency - affects FIFO depth in controller design
BWS[1:0]Byte write selectActive-LOW signals controlling D[8:0] (BWS0) and D[17:9] (BWS1); enables partial-word updates without read-modify-write
RPS / WPSPort selectActive-LOW enables read or write port independently; supports depth expansion across multiple devices

Key Features

FeatureDesign Value
Separate read/write data portsEnables true concurrent read+write operations - no bus contention or turnaround delay in full-duplex traffic buffers
2-word burst architectureReduces address bus activity by 50% per transaction versus single-word access; lowers controller logic complexity
Integrated PLL with echo clocksEliminates external clock retiming ICs; CQ/CQ provide trace-matched timing references for reliable >600 Mbps capture
JTAG 1149.1 boundary scanSupports automated PCB test and interconnect validation without physical probe access - critical for dense telecom modules
Programmable HSTL drive strength (ZQ)Allows dynamic impedance calibration to match PCB trace characteristics, reducing signal reflections at 300 MHz

Applications

Packet Buffer in 10G Ethernet Line CardsCell-Based ATM Switch Fabric Memory

Use Scenario: Storing ingress/egress packet headers and payloads in multi-port line cards handling 10 Gbps line rates.

IC Role / Device Role / Timing Role: Dual-port SRAM serving as shared buffer between ingress parser and egress scheduler, with concurrent read/write enabled by QDR II architecture.

Use Value: 72-Mbit x18 width aligns with 128-bit+ bus widths in Xilinx Virtex-5/6 FPGAs; 300 MHz DDR interface sustains >10 GB/s aggregate bandwidth.

Use Scenario: Holding fixed-length 53-byte ATM cells in switching matrices requiring deterministic latency and zero bus turnaround.

IC Role / Device Role / Timing Role: High-speed memory node in crossbar switch ASIC interface, using RPS/WPS for port arbitration and BWS for cell header updates.

Use Value: 1-cycle read latency (DOFF = LOW) guarantees sub-4 ns access time; 2-word burst matches cell payload segmentation.

Backplane Interposer Memory for Baseband UnitsReal-Time Video Frame Buffer in Broadcast Encoders

Use Scenario: Bridging high-speed serial links (e.g., CPRI/OBSAI) to baseband processing FPGAs in LTE/5G radio units.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as elastic buffer between framer and DSP engine, absorbing jitter via independent read/write clocks.

Use Value: K/K and C/C clock separation isolates timing domains; echo clocks (CQ/CQ) simplify capture in multi-FPGA backplane topologies.

Use Scenario: Storing uncompressed 1080p60 YUV422 frames during real-time encoding in broadcast infrastructure.

IC Role / Device Role / Timing Role: Frame buffer memory interfaced to video processor's 18-bit parallel bus, leveraging burst reads for line-based pixel streaming.

Use Value: 4M × 18-bit capacity holds ~1.2 full HD frames; 300 MHz DDR supports 2.16 Gbps sustained write/read for 60 fps streaming.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72T3615L10PA36-bit width, 10 ns async access, no DDR or echo clocks; TTL-compatible I/OTargeted at legacy telecom control planes with simpler timing; lacks QDR II concurrencySelect only if system requires asynchronous interface or wider data bus without DDR timing constraints
ISSI IS61WV102418BLL-10TLI1M × 18-bit, 10 ns async access, 3.3V core/I/O, no burst or echo clocksUsed in cost-sensitive industrial controllers where bandwidth < 1 Gbps sufficesChoose only for low-speed, non-concurrent applications where QDR II features add unnecessary complexity

Compared with IDT72T3615L10PA and IS61WV102418BLL-10TLI, the CY7C1512KV18-300BZIT uniquely delivers concurrent DDR read/write at 300 MHz with echo-clock–assisted timing closure - essential for modern FPGA-based packet processing where bandwidth and determinism are co-constrained.

Availability

CY7C1512KV18-300BZIT is available at Aetrix Electronics and suitable for 10G Ethernet line cards, ATM switch fabrics, LTE/5G baseband interposers, and broadcast video encoders requiring stable component supply across multi-year production cycles.

Supply support for CY7C1512KV18-300BZIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and timing precision.

The QDR® II SRAM product line targets high-speed packet buffering and switching systems requiring deterministic latency, concurrent access, and DDR bandwidth - optimized for FPGA- and ASIC-based infrastructure equipment.

FAQ

What is the function of the DOFF pin on CY7C1512KV18-300BZIT?

The DOFF (Data Output OFFset) pin configures read latency: when asserted HIGH, it enables 1.5-cycle latency for improved timing margin in high-skew layouts; when LOW, it selects 1-cycle latency for minimal access delay. This setting directly determines the number of clock cycles between address assertion and valid Q[17:0] output, and must be set before initialization.

How does the CY7C1512KV18-300BZIT handle partial-word writes?

It uses two active-LOW Byte Write Select signals (BWS[1:0]) to enable selective updating of D[8:0] (BWS0) and D[17:9] (BWS1). When a BWS signal is deasserted, the corresponding 9-bit byte remains unaltered - eliminating need for read-modify-write cycles and preserving data coherency during burst-oriented packet edits.

Can CY7C1512KV18-300BZIT operate with only one clock domain?

Yes - it supports single-clock mode where K and C are tied together (and K and C likewise), simplifying board layout at the cost of reduced timing flexibility. In this mode, the device behaves like a standard QDR I part with 1-cycle latency, but loses the skew-reduction benefit of independent output clocks and echo clock synchronization.

What is the role of the ZQ pin in CY7C1512KV18-300BZIT?

ZQ connects to an external 240 Ω ±1% reference resistor to ground, enabling on-chip impedance calibration of HSTL output drivers. This adjusts drive strength dynamically to match PCB trace impedance, minimizing signal reflections and ensuring clean eye diagrams at 600 Mbps DDR rates - critical for reliable operation in dense backplane environments.

CY7C1512KV18-300BZIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
300 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1512KV18-300BZIT FAQ

1.How can I place an order for CY7C1512KV18-300BZIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1512KV18-300BZIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1512KV18-300BZIT reliable?

The price and inventory of CY7C1512KV18-300BZIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512KV18-300BZIT is usually 5 days.

3.What payment methods are accepted for CY7C1512KV18-300BZIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512KV18-300BZIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1512KV18-300BZIT?

CY7C1512KV18-300BZIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1512KV18-300BZIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1512KV18-300BZIT?

For technical support, including CY7C1512KV18-300BZIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512KV18-300BZIT requirements.

6.How does Aetrix verify that CY7C1512KV18-300BZIT is sourced from the original manufacturer or authorized distributors?

All CY7C1512KV18-300BZIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512KV18-300BZIT meets industry standards.

7.What is the process for return or replacement of CY7C1512KV18-300BZIT?

All CY7C1512KV18-300BZIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512KV18-300BZIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1512KV18-300BZIT part is unused and in its original packaging.

Return procedure for CY7C1512KV18-300BZIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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