Infineon Technologies CY7C1512KV18-300BZXC
- Part No.:
- CY7C1512KV18-300BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1512KV18-300BZXC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,653
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Product details
Overview
CY7C1512KV18-300BZXC from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 300 MHz QDR® II SRAM with separate read/write ports, DDR interfaces on both ports (600 Mbps per port), 1.8V core supply, and 1.4–1.8V I/O supply. It delivers concurrent read/write transactions with 1-cycle (DOFF = LOW) or 1.5-cycle (DOFF = HIGH) read latency in high-bandwidth networking line cards.
For engineers reviewing the CY7C1512KV18-300BZXC datasheet, CY7C1512KV18-300BZXC pinout, CY7C1512KV18-300BZXC application, or CY7C1512KV18-300BZXC equivalent, key selection criteria include burst depth (2-word), echo clock support (CQ/CQ), PLL-based data placement, JTAG 1149.1 testability, and FBGA-165 package compatibility with high-speed PCB layout constraints.
Technical Context
This QDR II SRAM uses dual independent clock domains: K/K for address/data input timing and C/C for output timing, enabling precise DDR edge alignment without bus turnaround. Its internal synchronous self-timed write circuitry eliminates external write pulse control, while the DOFF pin selects between 1-cycle and 1.5-cycle read latency modes.
The device implements full data coherency across ports and supports depth expansion via RPS/WPS signals. Byte write select (BWS[1:0]) enables partial writes to 9-bit subwords within the 18-bit data path, and the integrated PLL ensures accurate data-eye positioning at 300 MHz operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4M × 18-bit (72 Mbit); supports 2-word burst transfers per access |
| Max Clock Frequency | 300 MHz; enables 600 MT/s effective data rate on each port |
| Read Latency | Selectable: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) |
| Supply Voltages | VDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O); decoupling critical for signal integrity |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm); RoHS-compliant, 0.8 mm ball pitch |
| Interface Standard | HSTL Class I compatible inputs/outputs; variable drive strength configurable via ZQ calibration |
| JTAG Support | IEEE 1149.1 compliant TAP controller with IDCODE, EXTEST, SAMPLE/PRELOAD instructions |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | 18-bit parallel data sampled on rising edge of K clock; latched internally for self-timed write |
| Q[17:0] | Synchronous read data output | 18-bit parallel DDR output registered to C/C clocks; CQ echoes C for capture timing |
| K, K | Input clocks for address/data capture | Dual-phase clocks for read/write address and D[17:0]; rising-edge triggered only |
| C, C | Output clocks for data launch | Separate domain from K/K to minimize skew; drives Q[17:0] and CQ |
| CQ, CQ | Output echo clocks | Source-synchronous copies of C/C; simplify high-speed FPGA/ASIC data capture |
| RPS, WPS | Port select controls | Active-low enables for independent read/write port activation; enables depth expansion |
| BWS[1:0] | Byte write select | Two active-low signals controlling 9-bit subword writes (D[8:0], D[17:9]) within 18-bit word |
| DOFF | Read latency mode select | High = 1.5-cycle latency; Low = 1-cycle latency; sets internal pipeline depth |
| ZQ | Impedance calibration reference | Connects to 240 Ω ±1% external resistor to ground for HSTL output drive tuning |
Key Features
| Feature | Design Value |
|---|---|
| Independent Read/Write Ports | Eliminates bus turnaround overhead; enables true concurrent memory access in packet buffering |
| 2-Word Burst Architecture | Fixed burst length reduces address bus toggling; improves sustained bandwidth in streaming applications |
| PLL-Based Data Placement | Compensates for PVT variation to maintain setup/hold margins at 300 MHz clock frequency |
| Full Data Coherency | Ensures read operations return most recently written data, even during overlapping R/W sequences |
| HSTL Class I I/O with ZQ Calibration | Supports impedance-matched 1.5V/1.8V signaling; ZQ pin enables dynamic output driver tuning |
Applications
| Network Packet Buffering | High-Speed Test Equipment Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in 10G/40G Ethernet line cards with real-time traffic shaping. IC Role / Device Role / Timing Role: Dual-port SRAM acting as a zero-latency, non-blocking buffer between MAC and switch fabric interfaces. Use Value: Concurrent R/W allows simultaneous header lookup (read) and payload write without arbitration delay, sustaining >9 Gbps aggregate throughput. | Use Scenario: Capturing high-resolution waveform samples in automated test equipment with deterministic timing capture windows. IC Role / Device Role / Timing Role: High-speed acquisition memory synchronized to precision clock generators and echo-clock-captured ADC outputs. Use Value: CQ/CQ echo clocks align captured data edges to FPGA sampling logic, achieving <100 ps jitter margin at 300 MHz operation. |
| Baseband Signal Processing | FPGA Co-Processing Buffer |
Use Scenario: Interfacing between multi-core DSPs and FPGA accelerators in LTE/5G baseband units requiring low-latency shared memory. IC Role / Device Role / Timing Role: Shared memory resource with independent port access for parallel FFT and channel estimation tasks. Use Value: 1-cycle read latency (DOFF = LOW) minimizes pipeline stalls in iterative algorithms, reducing overall processing latency by up to 35%. | Use Scenario: Offloading compute-intensive tasks from host CPU to FPGA using tightly coupled memory for intermediate result exchange. IC Role / Device Role / Timing Role: Low-latency scratchpad memory mapped into AXI4 or Avalon-MM interconnects with burst-aligned addressing. Use Value: 2-word burst and BWS[1:0] enable efficient partial updates of 18-bit status registers without full-word overwrites. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1512KV18-250BZXC | 250 MHz max frequency; lower power (650 mA typical vs. 750 mA at 300 MHz) | Suitable for cost-sensitive systems where 600 MT/s bandwidth is not required | Select when system clock budget permits relaxed timing and thermal envelope is constrained |
| AS7C32560A-300BIN | Single-port SSRAM (not QDR); 300 MHz, 256K × 18-bit; no echo clocks or DOFF latency control | Limited to non-concurrent R/W use cases; requires external arbitration logic | Choose only if dual-port functionality is unnecessary and board space favors smaller 100-pin TQFP package |
Compared with CY7C1512KV18-250BZXC, the -300BZXC delivers 20% higher bandwidth at identical voltage and pinout; versus AS7C32560A-300BIN, it provides true concurrent access and source-synchronous timing-critical for packet-forwarding and real-time signal processing.
Availability
CY7C1512KV18-300BZXC is available at Aetrix Electronics and suitable for high-speed networking infrastructure, semiconductor test equipment, and wireless baseband subsystems requiring stable component supply across extended production lifecycles.
Supply support for CY7C1512KV18-300BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications applications.
The QDR® II SRAM product line targets high-throughput, low-latency memory interfacing in networking, test, and signal processing systems where concurrent access and precise timing control are essential.
FAQ
What is the function of the DOFF pin on CY7C1512KV18-300BZXC?
The DOFF (Data Output OFFset) pin selects read latency mode: when asserted HIGH, it configures 1.5-cycle latency for improved timing margin in high-PVT-variation environments; when LOW, it enables 1-cycle latency for minimal pipeline delay. This setting directly affects internal register staging and must be held stable during initialization.
Can CY7C1512KV18-300BZXC operate with only one clock domain (K = C)?
Yes, the device supports single-clock-domain operation where K and C are tied together, but this forfeits skew-reduction benefits. In that mode, CQ still echoes C, and all timing parameters shift to reflect combined clock path delays; AC specifications require recalculation per Table 11 in the datasheet.
How does ZQ calibration affect output drive strength?
ZQ calibration adjusts HSTL output driver impedance to match a 240 Ω external reference resistor, ensuring consistent signal rise/fall times and reduced reflections. The calibration occurs automatically at power-up and can be retriggered via JTAG instruction; improper ZQ connection causes excessive overshoot or slow edges.
Is BWS[1:0] functional in single-word (non-burst) access mode?
No-BWS[1:0] operates only during valid write cycles and applies exclusively to the 18-bit data path regardless of burst configuration. Each BWS bit enables one 9-bit subword (BWS0 → D[8:0], BWS1 → D[17:9]); both must be asserted for full-word writes. It has no effect on read operations or address decoding.
CY7C1512KV18-300BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 300 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1512KV18-300BZXC FAQ
1.How can I place an order for CY7C1512KV18-300BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1512KV18-300BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1512KV18-300BZXC reliable?
The price and inventory of CY7C1512KV18-300BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512KV18-300BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1512KV18-300BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512KV18-300BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1512KV18-300BZXC?
CY7C1512KV18-300BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1512KV18-300BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1512KV18-300BZXC?
For technical support, including CY7C1512KV18-300BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512KV18-300BZXC requirements.
6.How does Aetrix verify that CY7C1512KV18-300BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1512KV18-300BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512KV18-300BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1512KV18-300BZXC?
All CY7C1512KV18-300BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512KV18-300BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1512KV18-300BZXC part is unused and in its original packaging.
Return procedure for CY7C1512KV18-300BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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