Infineon Technologies CY7C1512KV18-300BZXI
- Part No.:
- CY7C1512KV18-300BZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1512KV18-300BZXI.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1512KV18-300BZXI from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 300 MHz QDR® II SRAM with separate read/write ports, DDR interfaces on both ports (600 Mbps per pin), 1.8V core supply, and 1.4–1.8V I/O supply. It delivers concurrent read/write transactions with 1.5-cycle read latency (DOFF = HIGH) and is used in high-bandwidth packet buffering for network switches and routers.
For engineers reviewing the CY7C1512KV18-300BZXI datasheet, CY7C1512KV18-300BZXI pinout, CY7C1512KV18-300BZXI application, or CY7C1512KV18-300BZXI equivalent, key selection criteria include burst depth (2-word), echo clock support (CQ/CQ), PLL-based timing alignment, HSTL-compatible output drive, and FBGA-165 package compatibility with high-speed PCB layout constraints.
Technical Context
This QDR II SRAM implements fully synchronous, pipelined architecture with independent K/K clocks for address/data capture and C/C clocks for output timing-enabling precise DDR edge placement without bus turnaround. Its internal PLL locks to input clocks to minimize jitter and ensure stable data-eye positioning at 300 MHz operation.
The device supports byte-write select (BWS[1:0]) for partial-word writes into its 18-bit-wide data path and uses DOFF to toggle between 1-cycle (QDR I mode) and 1.5-cycle (QDR II mode) read latency. All control signals-including RPS, WPS, and BWS-are registered on rising edges of K/K, ensuring deterministic setup/hold timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4M × 18-bit (72 Mbit); enables compact, high-throughput buffer storage for 10G+ line cards. |
| Max Clock Frequency | 300 MHz; defines maximum sustained transaction rate of 300 million read/write operations per second per port. |
| Data Rate (DDR) | 600 Mbps per pin; achieved via double-data-rate transfers on both read and write ports using K/K and C/C clocks. |
| Read Latency | 1.5 cycles (DOFF = HIGH); guarantees deterministic output timing for pipeline-synchronized systems like SerDes framers. |
| Supply Voltages | VDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O); allows interoperability with 1.5V or 1.8V logic families and reduces switching noise. |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm); supports fine-pitch routing, thermal dissipation up to 1.2 W, and JEDEC-compliant reflow profiles. |
| Interface Standard | HSTL Class I outputs with programmable drive strength; ensures signal integrity on >10 cm traces at 300 MHz with controlled impedance. |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant, Pb-free (BZXI suffix).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | 18-bit parallel data sampled on rising edge of K clock; supports full or partial writes via BWS[1:0]. |
| Q[17:0] | Synchronous read data output | 18-bit DDR output registered on C/C clocks; aligned with echo clock CQ for simplified capture in FPGA receivers. |
| K / K | Input clock pair | Differential clock inputs for address and write data latching; only rising edges used-no DDR clock interpretation required. |
| C / C | Output clock pair | Separate clocks for read data output registers; minimizes skew between Q[17:0] and C/C paths in high-speed layouts. |
| CQ / CQ | Echo clock outputs | Phase-aligned copies of C/C; routed alongside Q[17:0] to enable source-synchronous capture in ASIC/FPGA receivers. |
| BWS[1:0] | Byte write select | Active-low controls for D[8:0] (BWS0) and D[17:9] (BWS1); enables selective 9-bit sub-word writes without read-modify-write overhead. |
| WPS | Write port select | Active-low enable for write operations; deassertion blocks all D[17:0] sampling and prevents unintended memory updates. |
| RPS | Read port select | Active-low enable for read operations; deassertion forces Q[17:0] into high-impedance state, supporting depth expansion. |
| DOFF | Read latency mode control | High = 1.5-cycle latency (QDR II mode); Low = 1-cycle latency (QDR I backward compatibility). |
| VDD / VDDQ | Power supplies | VDD = 1.8 V core rail; VDDQ = 1.4–1.8 V I/O rail; separate domains isolate switching noise and support mixed-voltage system interfacing. |
Key Features
| Feature | Design Value |
|---|---|
| Independent Read/Write Ports | Eliminates bus turnaround delay-enables simultaneous 300 MT/s reads and writes, doubling effective bandwidth over single-port SRAMs. |
| 2-Word Burst Architecture | Every access delivers two consecutive 18-bit words; reduces address strobe overhead and simplifies controller logic for sequential packet payloads. |
| Integrated PLL Timing Engine | Locks to K/K input to generate low-jitter C/C and CQ/CQ outputs-ensures < ±50 ps clock-to-Q skew across all 18 data bits at 300 MHz. |
| HSTL Class I Output Drivers | Programmable drive strength (12–24 mA) matches 50 Ω transmission lines; eliminates external termination resistors and saves board space. |
| JTAG 1149.1 Boundary Scan | Enables in-system test of solder joints and interconnects in dense FBGA layouts-critical for telecom equipment manufacturing yield assurance. |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing ingress/egress Ethernet frames in multi-port 10GbE switch ASICs with real-time traffic shaping. IC Role / Device Role / Timing Role: Dual-port SRAM acting as first-level packet buffer-accepting wire-speed writes while servicing priority reads for QoS scheduling. Use Value: Concurrent 300 MT/s read/write throughput avoids head-of-line blocking and maintains sub-microsecond latency under 100% load. |
Use Scenario: Frame assembly/disassembly in OC-192/STM-64 SONET/SDH framer modules requiring deterministic latency. IC Role / Device Role / Timing Role: Synchronous memory staging buffer between SerDes PHY and DSP processor-aligned to system clock domain via PLL. Use Value: 1.5-cycle read latency (DOFF = HIGH) and echo clocks (CQ/CQ) enable reliable capture in FPGA fabric with no timing closure margin loss. |
| High-Speed Test Equipment Memory | Avionics Data Recorder Buffer |
|
Use Scenario: Capturing multi-channel digital stimulus/response data at 600 MB/s in automated test systems for ASIC validation. IC Role / Device Role / Timing Role: High-bandwidth streaming buffer interfaced to FPGA-based pattern generator-using BWS[1:0] for partial-word trace tagging. Use Value: Byte-selectable writes eliminate read-modify-write cycles during metadata insertion, preserving full 300 MT/s sustained write rate. |
Use Scenario: Real-time buffering of flight sensor telemetry (ARINC 429, MIL-STD-1553) before compression and storage in ruggedized avionics units. IC Role / Device Role / Timing Role: Radiation-tolerant (neutron soft error immunity documented) SRAM providing deterministic access for safety-critical logging. Use Value: Single-cycle read latency mode (DOFF = LOW) meets hard real-time deadlines for fault detection and response within 3.3 ns clock period. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C361024B-300BIN | 300 MHz, 4M × 18-bit, but uses common I/O (not separate read/write ports); requires bus turnaround; no echo clocks or PLL. | Lacks true concurrency-read/write cannot overlap; unsuitable for full-duplex packet buffers. | Select only if cost sensitivity outweighs bandwidth requirement and controller can manage turnaround timing. |
| IS61WV102418BLL-300TQLI | 300 MHz, 1M × 18-bit QDR II, same architecture but lower density; 100-ball TQFP vs. 165-ball FBGA. | Insufficient capacity for multi-gigabit buffering; TQFP limits trace routing density and thermal performance in high-power line cards. | Consider only for space-constrained legacy designs where 4M × 18 is not required and FBGA assembly is unavailable. |
Compared with AS7C361024B-300BIN and IS61WV102418BLL-300TQLI, CY7C1512KV18-300BZXI uniquely delivers true concurrent access, echo-clock–assisted capture, and 72-Mbit density in an industrial-grade FBGA-making it the only viable option for 10G+ packet processing where latency predictability and bandwidth are non-negotiable.
Availability
CY7C1512KV18-300BZXI is available at Aetrix Electronics and suitable for network infrastructure, telecom line card development, and high-speed test equipment requiring stable component supply across extended production lifecycles.
Supply support for CY7C1512KV18-300BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
CY7C1512KV18 belongs to the QDR® II SRAM product line, designed specifically for deterministic, high-bandwidth buffering in networking and telecommunications infrastructure where concurrent read/write, low latency, and signal integrity are critical.
FAQ
What is the function of the DOFF pin on CY7C1512KV18-300BZXI?
The DOFF (Data-Off) pin selects read latency mode: when asserted HIGH, it configures the device for QDR II operation with 1.5-cycle read latency and optimized burst timing; when LOW, it enables QDR I compatibility mode with 1-cycle latency. This pin is sampled synchronously on the rising edge of the K clock and must be stable before initialization completes.
Can CY7C1512KV18-300BZXI operate with only a single clock signal?
No-it requires two distinct clock pairs: K/K for address and write data capture, and C/C for read data output registration. Using only one clock violates timing specifications and disables echo clock generation (CQ/CQ). The device does not support single-clock-domain operation; attempting it results in undefined data output and potential metastability.
How does the BWS[1:0] signal control partial writes in CY7C1512KV18-300BZXI?
BWS[1:0] are active-low byte write selects: BWS0 enables writing to D[8:0], and BWS1 enables D[17:9]. Both must be asserted to write the full 18-bit word. When either is deasserted, the corresponding 9-bit segment retains its prior value-enabling atomic partial updates without read-modify-write sequences or external logic.
Is CY7C1512KV18-300BZXI compatible with 1.5V-only I/O systems?
Yes-its VDDQ supply accepts 1.4 V to 1.8 V, and HSTL Class I outputs are fully compliant with 1.5V VTT termination. When VDDQ = 1.5V, output swing is 0.75V with 25 Ω driver impedance, meeting JEDEC HSTL-I electrical specs. No level-shifting circuitry is needed for 1.5V FPGA or ASIC interfaces.
CY7C1512KV18-300BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 300 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1512KV18-300BZXI FAQ
1.How can I place an order for CY7C1512KV18-300BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1512KV18-300BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1512KV18-300BZXI reliable?
The price and inventory of CY7C1512KV18-300BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512KV18-300BZXI is usually 5 days.
3.What payment methods are accepted for CY7C1512KV18-300BZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512KV18-300BZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1512KV18-300BZXI?
CY7C1512KV18-300BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1512KV18-300BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1512KV18-300BZXI?
For technical support, including CY7C1512KV18-300BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512KV18-300BZXI requirements.
6.How does Aetrix verify that CY7C1512KV18-300BZXI is sourced from the original manufacturer or authorized distributors?
All CY7C1512KV18-300BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512KV18-300BZXI meets industry standards.
7.What is the process for return or replacement of CY7C1512KV18-300BZXI?
All CY7C1512KV18-300BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512KV18-300BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1512KV18-300BZXI part is unused and in its original packaging.
Return procedure for CY7C1512KV18-300BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1512KV18-300BZXI Tags

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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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M24C02-FMC6TG
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AT24C08C-STUM-T
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