Infineon Technologies CY7C1513AV18-200BZC

Overview

CY7C1513AV18 from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 1.8V QDR-II SRAM with separate read/write ports, 300 MHz clock support (600 Mbps DDR data rate), 1.5-cycle read latency with DLL enabled, and 165-ball FBGA (15 × 17 × 1.4 mm) packaging. It delivers concurrent high-bandwidth memory access for network packet buffering in telecom line cards.

For engineers reviewing the CY7C1513AV18 datasheet, CY7C1513AV18 pinout, CY7C1513AV18 application, or CY7C1513AV18 equivalent, key selection criteria include burst depth (4-word), dual-clock timing (K/K and C/C), echo clock support (CQ/CQ), HSTL-18 I/O compatibility, and DLL-enabled latency mode.

Technical Context

The CY7C1513AV18 implements QDR-II architecture with fully independent synchronous read and write ports sharing a multiplexed 20-bit address bus (A[19:0]). Read and write operations are latched on alternate rising edges of K/K clocks, enabling true concurrency without bus turnaround.

It uses two dedicated clock pairs: K/K for address/data capture and C/C for output timing, with free-running echo clocks CQ/CQ referenced to C/C to simplify high-speed data capture. The internal Delay Lock Loop (DLL) enables precise 1.5-cycle read latency at 300 MHz; disabling DLL reverts to QDR-I mode with 1-cycle latency up to 167 MHz.

Key Specifications

Pinout & Package

165-ball Fine-Pitch Ball Grid Array (FBGA) package, 15 mm × 17 mm footprint, 1.4 mm height, 0.8 mm ball pitch. Compliant with JEDEC MO-245, RoHS and lead-free assembly requirements.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with AS7C3256B-20TIN and IS61WV102418BLL-10BLI, the CY7C1513AV18 uniquely delivers 600 Mbps DDR bandwidth, deterministic 1.5-cycle latency, and source-synchronous echo clocking - essential for 10G+ networking and real-time baseband systems.

Availability

CY7C1513AV18 is available at Aetrix Electronics and suitable for network packet buffering, high-speed switch fabric memory, telecom line card buffering, and baseband processing requiring stable component supply and long-term industrial availability.

Supply support for CY7C1513AV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets.

The QDR-II SRAM product line targets high-speed infrastructure applications demanding deterministic latency, concurrent access, and source-synchronous timing - specifically optimized for networking, telecom, and baseband signal processing.

FAQ

What is the minimum VDDQ voltage supported for reliable operation?

The CY7C1513AV18 specifies VDDQ = 1.4 V to 1.8 V. Operation below 1.4 V is not guaranteed: HSTL-18 driver thresholds and output swing fall outside JEDEC-compliant margins, risking setup/hold violations at 300 MHz. Designs must maintain VDDQ ≥ 1.4 V across temperature and load.

Can C and C be driven from the same clock source with 180° phase shift?

Yes - C and C are designed for complementary 180° phase-shifted inputs. This configuration minimizes skew between output clock edges and enables precise double-data-rate sampling of Q[17:0]. The device's timing specifications assume matched C/C flight times within ±50 ps.

How does DOFF affect read latency and maximum operating frequency?

When DOFF = LOW, the DLL is disabled and the device operates in QDR-I mode: read latency reduces to 1 cycle but maximum frequency drops to 167 MHz. At 300 MHz, DLL must be enabled (DOFF = HIGH via 10 kΩ pull-up) to meet timing; DLL-off mode is incompatible with rated speed grade.

Is ZQ pin required for functional operation, or only for impedance tuning?

ZQ is required for production-level signal integrity: it calibrates output driver impedance to match the PCB trace (typically 50 Ω). Leaving ZQ unconnected or tied to GND violates specification and causes excessive overshoot/ringing on Q[17:0] and CQ/CQ outputs at 600 Mbps. Connect ZQ to RQ (≈240 Ω) to ground.