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Infineon Technologies CY7C1513KV18-250BZXC

Part No.:
CY7C1513KV18-250BZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1513KV18-250BZXC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:238

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Product details

Overview

CY7C1513KV18-250BZXC from Cypress Semiconductor is a 4M × 18, 72-Mbit QDR® II SRAM with four-word burst architecture, 250 MHz maximum clock frequency (K/K), 500 MHz DDR data rate (1.8 V core / 1.4–1.8 V I/O), and 165-ball FBGA (13 × 15 × 1.4 mm) package. It delivers concurrent read/write operations for high-throughput packet buffering in network line cards.

For engineers reviewing the CY7C1513KV18-250BZXC datasheet, CY7C1513KV18-250BZXC pinout, CY7C1513KV18-250BZXC application, or CY7C1513KV18-250BZXC equivalent, key selection criteria include 1.5-cycle read latency (DOFF = HIGH), echo clocks (CQ/CQ) for timing margin recovery, separate RPS/WPS controls for depth expansion, HSTL-compatible 18-bit bidirectional data ports, and JTAG 1149.1 test access.

Technical Context

This QDR II SRAM implements dual independent synchronous ports: read port latches address on rising K edge and outputs data on C/C edges with echo-clock alignment; write port samples D[17:0] and BWS[1:0] on rising K/K edges and executes self-timed writes. The internal 1M × 18 memory array supports full coherency with no bus turnaround.

Its PLL synchronizes output timing to minimize skew across high-speed traces; DOFF pin selects between 1-cycle (LOW) and 1.5-cycle (HIGH) read latency modes; VREF and ZQ pins enable programmable impedance calibration for signal integrity at 500 Mbps per pin.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (4M × 18 organization)
Max Clock Frequency (K/K) 250 MHz - sets maximum sustained transaction rate of 250 million read+write operations/sec
Data Rate (DDR) 500 MHz - enables 9 Gbps aggregate bandwidth across 18-bit data bus
Read Latency 1.5 cycles (DOFF = HIGH) - guarantees deterministic timing for pipeline-synchronized controllers
Core Supply (VDD) 1.8 V ±0.1 V - defines minimum power rail stability requirement for internal logic and array operation
I/O Supply (VDDQ) 1.4 V to 1.8 V - supports interoperability with 1.5 V or 1.8 V system interfaces without level shifters
Package 165-ball FBGA (13 × 15 × 1.4 mm) - provides 0.8 mm ball pitch, thermal performance suitable for multi-chip modules

Pinout & Package

Package: 165-ball fine-pitch BGA (13 mm × 15 mm × 1.4 mm height), RoHS-compliant, 0.8 mm ball pitch, bottom-side thermal pad not electrically connected.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Write data input 18-bit parallel data sampled on rising K/K edges; supports byte-write via BWS[1:0]
Q[17:0] Read data output 18-bit parallel data driven on rising C/C edges; tristated when RPS deasserted
RPS Read port select Active-low synchronous control; initiates 4-word burst read on rising K edge
WPS Write port select Active-low synchronous control; enables write to D[17:0] and BWS[1:0] on rising K/K
BWS[1:0] Byte write select Two active-low signals controlling D[8:0] (BWS0) and D[17:9] (BWS1); enables partial-word writes
C, C Output clock pair Differential clock inputs for read data capture; deskews flight time mismatches across PCB traces
K, K Input clock pair Differential clock inputs for address/data sampling; only rising edges used for synchronization
CQ, CQ Echo clock outputs Delayed copies of C/C; simplify source-synchronous capture at controller side
DOFF Read latency mode High = 1.5-cycle latency; Low = 1-cycle latency - selects timing mode for controller interface design
VREF Reference voltage Provides mid-supply reference for HSTL input receivers; must be decoupled with 0.1 µF capacitor
ZQ Impedance calibration Connects to 240 Ω external resistor to ground; calibrates output driver strength and termination

Key Features

Feature Design Value
Separate read/write ports Enables true concurrent access - no bus turnaround required, eliminating arbitration delay in full-duplex traffic buffers
Four-word burst architecture Reduces address bus toggling by 75% versus single-word access - lowers EMI and simplifies routing in dense layouts
Echo clocks (CQ/CQ) Delivers timing-aligned copies of C/C at device output - eliminates need for board-level delay tuning in >400 MHz systems
Programmable drive strength (ZQ) Calibrates output impedance to match trace characteristic impedance - maintains signal integrity across process/voltage/temperature
JTAG 1149.1 boundary scan Supports IEEE-compliant testing of interconnects and solder joints - critical for high-reliability telecom and aerospace assemblies

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing ingress/egress packets in 10G/40G Ethernet switch ASICs where simultaneous read/write is required at line rate.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as first-level packet buffer; handles 250 MT/s random access with deterministic 1.5-cycle latency.

Use Value: Eliminates FIFO bottlenecks by enabling concurrent descriptor fetch and payload write - increases switch throughput by up to 35% vs. single-port alternatives.

Use Scenario: Frame buffering in OTN (Optical Transport Network) multiplexers processing OC-192/STM-64 streams.

IC Role / Device Role / Timing Role: High-bandwidth memory interfacing directly with SerDes PHYs; synchronized via echo clocks to absorb jitter from optical links.

Use Value: Maintains bit-error-rate <1e−12 under 20 ps clock skew using CQ/CQ feedback - meets ITU-T G.709 timing compliance.

Baseband Processing Cache Radar Signal Processing Buffer

Use Scenario: Temporary storage of IQ samples during LTE/5G baseband modulation/demodulation in massive MIMO radio units.

IC Role / Device Role / Timing Role: Low-latency scratchpad memory for FFT/IFFT engines; accessed via AXI4-Stream with backpressure support.

Use Value: Sustains 9 Gbps sustained bandwidth across 18-bit bus - matches peak throughput of dual 4×4 RF chains without stalling DSP pipelines.

Use Scenario: Real-time pulse-Doppler processing in airborne AESA radar systems requiring deterministic memory access for chirp storage.

IC Role / Device Role / Timing Role: Time-critical buffer for ADC sample streams; uses DOFF=LOW mode for 1-cycle latency to meet 50 ns processing deadlines.

Use Value: Guarantees worst-case read response within 4 ns jitter window - satisfies MIL-STD-461E radiated emissions constraints on timing noise.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1513KV18-300BZXC Higher max clock (300 MHz) → 600 MHz DDR; same 4M×18 density and FBGA package Requires tighter PCB layout control for signal integrity above 500 Mbps; higher power (570 mA vs. 500 mA) Select when system clock domain operates at ≥300 MHz and thermal budget allows +70 mA additional current draw.
AS7C34098B-250BIN Single-port SSRAM (not QDR); 4M×18, 250 MHz, 100-pin TQFP - no echo clocks or dual-port concurrency Lacks concurrent read/write; requires external arbitration logic; lower bandwidth (4.5 Gbps vs. 9 Gbps) Acceptable only for cost-sensitive, non-real-time applications where latency and throughput are secondary to footprint and BOM cost.

Compared with CY7C1513KV18-300BZXC, the -250BZXC trades 100 MHz clock headroom for lower power and relaxed layout; versus AS7C34098B-250BIN, it delivers double the effective bandwidth and eliminates arbitration overhead at the cost of higher pin count and complexity.

Availability

CY7C1513KV18-250BZXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing cache, and radar signal processing buffer applications requiring stable component supply across extended product lifecycles.

Supply support for CY7C1513KV18-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and microcontroller solutions for networking, automotive, and industrial systems, with emphasis on signal integrity and real-time determinism.

CY7C1513KV18 belongs to the QDR II SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in high-speed communications infrastructure.

FAQ

What is the function of the DOFF pin on CY7C1513KV18-250BZXC?

The DOFF (Data Output OFF) pin selects read latency mode: when asserted HIGH, it configures 1.5-cycle latency for improved timing margin in systems with long trace lengths; when LOW, it enables 1-cycle latency for minimal delay in tightly coupled controller interfaces. This setting is sampled synchronously on the rising edge of the K clock and remains active until changed.

How does the ZQ pin enable impedance calibration?

The ZQ pin connects to an external 240 Ω resistor to ground, allowing the device to calibrate its output driver strength and on-die termination to match PCB trace impedance. Calibration occurs automatically at power-up and can be retriggered via JTAG instruction, ensuring consistent signal integrity across voltage, temperature, and process variations without manual tuning.

Can CY7C1513KV18-250BZXC operate with only a single clock domain?

Yes - the device supports single-clock operation where K and C are tied together (and K and C tied together), eliminating need for separate clock trees. In this mode, data is sampled and driven on the same clock edges, reducing system complexity but limiting maximum achievable bandwidth compared to dual-clock configuration with echo-clock deskew.

What is the purpose of the BWS[1:0] signals in write operations?

BWS[1:0] are active-low byte write select signals that enable partial-word writes: BWS0 controls D[8:0], BWS1 controls D[17:9]. When a BWS signal is deasserted, the corresponding 9-bit byte is ignored during the write cycle, preserving existing memory contents - essential for protocol header updates without disturbing payload data in packet buffers.

CY7C1513KV18-250BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1513KV18-250BZXC FAQ

1.How can I place an order for CY7C1513KV18-250BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1513KV18-250BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1513KV18-250BZXC reliable?

The price and inventory of CY7C1513KV18-250BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1513KV18-250BZXC is usually 5 days.

3.What payment methods are accepted for CY7C1513KV18-250BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1513KV18-250BZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1513KV18-250BZXC?

CY7C1513KV18-250BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1513KV18-250BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1513KV18-250BZXC?

For technical support, including CY7C1513KV18-250BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1513KV18-250BZXC requirements.

6.How does Aetrix verify that CY7C1513KV18-250BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1513KV18-250BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1513KV18-250BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1513KV18-250BZXC?

All CY7C1513KV18-250BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1513KV18-250BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1513KV18-250BZXC part is unused and in its original packaging.

Return procedure for CY7C1513KV18-250BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1513KV18-250BZXC Tags

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