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Infineon Technologies CY7C1513KV18-250BZXI

Part No.:
CY7C1513KV18-250BZXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1513KV18-250BZXI.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:688

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Product details

Overview

CY7C1513KV18-250BZXI from Cypress Semiconductor is a 4M × 18, 72-Mbit QDR® II SRAM with four-word burst architecture, 250 MHz maximum operating frequency (400 Mbps per pin), 1.8 V core supply, and 1.4–1.8 V I/O supply. It features separate read/write ports, DDR interfaces on both ports, echo clocks (CQ/CQ), and PLL-based timing control for high-bandwidth networking buffer applications.

For engineers reviewing the CY7C1513KV18-250BZXI datasheet, CY7C1513KV18-250BZXI pinout, CY7C1513KV18-250BZXI application, or CY7C1513KV18-250BZXI equivalent, key selection criteria include concurrent read/write capability, 1.8 V core + flexible VDDQ, 165-ball FBGA (13 × 15 × 1.4 mm), DOFF-controlled read latency (1 or 1.5 cycles), and JTAG 1149.1 test support.

Technical Context

This QDR II SRAM implements true dual-port synchronous operation with independent K/K input clocks for address/data capture and C/C output clocks for data launch-enabling precise DDR timing without bus turnaround. Its internal pipelined architecture supports concurrent read and write transactions at full bandwidth.

The device uses a single multiplexed address bus latched on alternate rising edges of K, with depth expansion enabled via RPS/WPS controls and BWS[1:0] byte write selects. Read latency is configurable via DOFF: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH), and all writes are internally self-timed.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (4M × 18 organization)
Max Clock Frequency 250 MHz - sets maximum sustained throughput of 1.8 Gbps (250 MHz × 2 × 18 bits)
Core Supply Voltage 1.8 V ±0.1 V - defines minimum power rail stability requirement for reliable internal logic operation
I/O Supply Range 1.4 V to 1.8 V - supports interoperability with 1.5 V or 1.8 V system I/O domains
Data Interface Double Data Rate (DDR) on both read and write ports - enables data transfer on every rising edge of K/K and C/C clocks
Read Latency Configurable: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) - directly impacts pipeline depth in controller design
Package 165-ball FBGA (13 × 15 × 1.4 mm) - standard high-density footprint compatible with automated PCB assembly

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, Pb-free option available.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous write data inputs Latched on rising edge of K clock; 18-bit parallel data path for burst writes
Q[17:0] Synchronous read data outputs Driven on rising edges of C/C clocks; tristated when RPS is deasserted
RPS Read port select (active LOW) Enables read access and output drivers; sampled on rising edge of K
WPS Write port select (active LOW) Enables write access and data sampling; sampled on rising edge of K
BWS[1:0] Byte write select (active LOW) BWS0 controls D[8:0], BWS1 controls D[17:9]; enables partial-word writes without read-modify-write
K / K Positive/negative input clocks Capture all synchronous inputs (address, data, control); K used for rising-edge sampling only
C / C Positive/negative output clocks Launch read data; used together to deskew flight time across memory devices
CQ / CQ Echo clocks Output copies of C/C with matched trace delay; simplify high-speed data capture at controller
DOFF Read latency control HIGH → 1.5-cycle latency; LOW → 1-cycle latency; configures internal pipeline staging
VDD / VDDQ / VSS Power and ground terminals VDD = 1.8 V core; VDDQ = 1.4–1.8 V I/O; dedicated VSS balls per bank reduce switching noise

Key Features

Feature Design Value
Separate read/write data ports Eliminates bus turnaround overhead; enables full-duplex memory access essential for packet buffering
Four-word burst architecture Reduces address bus toggling by 75% vs. single-word access - lowers system-level EMI and routing complexity
Configurable read latency (1 or 1.5 cycles) Allows tuning of controller pipeline depth to match system timing budget without hardware change
JTAG 1149.1 boundary scan Enables production-level interconnect testing and in-system debug without additional test fixtures
Variable-drive HSTL output buffers Adjustable drive strength matches trace impedance - minimizes signal integrity issues at 666 Mbps DDR rates
PLL-based clock management Ensures accurate data placement relative to C/C edges - critical for setup/hold compliance at 250 MHz

Applications

High-Speed Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with line-rate throughput.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as ingress/egress FIFO with concurrent read/write - absorbs traffic bursts while maintaining deterministic latency.

Use Value: 4M × 18 capacity supports >128 KB packet buffer; 250 MHz DDR interface delivers 1.8 Gbps bandwidth needed for 10Gbps+ line cards.

Use Scenario: Buffering voice, video, and control data streams in carrier-grade DSLAMs and OLTs with strict jitter and latency requirements.

IC Role / Device Role / Timing Role: QDR II SRAM serving as shared memory between multiple DSPs and network processors - synchronized via C/C echo clocks.

Use Value: Echo clocks (CQ/CQ) enable controller to sample data with ±50 ps skew margin at 666 Mbps, meeting ITU-T G.984 jitter specs.

High-Performance Computing Cache Tag Storage Test Equipment Pattern Memory

Use Scenario: Storing cache directory tags and coherency metadata in multi-core CPU interconnect fabrics requiring low-latency random access.

IC Role / Device Role / Timing Role: Low-latency SRAM providing sub-5 ns read access (1-cycle mode) for tag lookups during L2/L3 cache snoop operations.

Use Value: DOFF = LOW configures 1-cycle latency; 1.8 V core reduces dynamic power vs. older 3.3 V QDR I parts - critical for thermal density in dense compute modules.

Use Scenario: Storing high-speed digital stimulus and expected response patterns in ATE systems performing 100+ MHz functional tests.

IC Role / Device Role / Timing Role: Deterministic-access memory feeding pattern generators and comparators - synchronized using K/K and C/C clocks for precise edge alignment.

Use Value: Self-timed writes guarantee consistent 10 ns write cycle time regardless of voltage/temp variation - eliminates test program timing margin uncertainty.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1513KV18-300BZXI Higher max frequency (300 MHz vs. 250 MHz); identical pinout, voltage, and feature set Supports 2.16 Gbps bandwidth; requires tighter PCB layout and higher-quality clock distribution Select when system clock tree can sustain 300 MHz with <15 ps jitter; otherwise CY7C1513KV18-250BZXI offers better margin and lower power
AS7C36256A-250BIN Asynchronous SRAM (not QDR); 250 MHz max access time; ×16 organization; SOJ package No concurrent read/write; no DDR interface; no echo clocks - incompatible with QDR controller designs Only viable for legacy board refresh where QDR architecture is not required; not a drop-in replacement

Compared with CY7C1513KV18-300BZXI, the -250BZXI trades 17% bandwidth for relaxed timing closure and ~12% lower active current; versus AS7C36256A-250BIN, it provides true dual-port concurrency and DDR signaling - enabling architectures impossible with asynchronous SRAM.

Availability

CY7C1513KV18-250BZXI is available at Aetrix Electronics and suitable for high-speed networking equipment, telecom line cards, test instrumentation, and HPC interconnect designs requiring stable component supply, long-lifecycle support, and guaranteed Pb-free sourcing.

Supply support for CY7C1513KV18-250BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CY7C1513KV18 belongs to Cypress's QDR II SRAM product line, engineered specifically for bandwidth-intensive, low-latency buffer applications in networking infrastructure where concurrent read/write and deterministic timing are mandatory.

FAQ

What is the function of the DOFF pin on CY7C1513KV18-250BZXI?

The DOFF (Data Output OFF) pin configures read latency: when asserted HIGH, it enables 1.5-cycle latency for improved timing margin in high-speed systems; when LOW, it selects 1-cycle latency for minimal pipeline delay. This setting directly affects the number of clock cycles between address assertion and valid Q[17:0] output, and must be fixed at power-up.

Can CY7C1513KV18-250BZXI operate with only a single clock domain?

Yes - the device supports single-clock-mode operation where K and C are tied together (and K and C tied together). In this mode, data is launched on the same clock edges used for input capture, simplifying clock routing at the cost of reduced skew compensation capability compared to independent C/C usage.

How does the BWS[1:0] pin configuration support partial writes?

BWS0 controls write enable for D[8:0], and BWS1 controls D[17:9]. When either is deasserted (HIGH), the corresponding 9-bit byte is ignored during the write cycle - preserving existing data in those bits. This eliminates need for read-modify-write sequences in applications requiring nibble- or byte-granular updates.

Is JTAG boundary scan supported on CY7C1513KV18-250BZXI, and how is it enabled?

Yes - the device implements IEEE 1149.1 JTAG TAP with TDI, TDO, TCK, and TMS pins. JTAG is always enabled at power-up; no configuration fuse or register setting is required. Boundary scan testing follows standard 1149.1 protocols and supports full pin interconnect verification in assembled PCBs.

CY7C1513KV18-250BZXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1513KV18-250BZXI FAQ

1.How can I place an order for CY7C1513KV18-250BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1513KV18-250BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1513KV18-250BZXI reliable?

The price and inventory of CY7C1513KV18-250BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1513KV18-250BZXI is usually 5 days.

3.What payment methods are accepted for CY7C1513KV18-250BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1513KV18-250BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1513KV18-250BZXI?

CY7C1513KV18-250BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1513KV18-250BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1513KV18-250BZXI?

For technical support, including CY7C1513KV18-250BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1513KV18-250BZXI requirements.

6.How does Aetrix verify that CY7C1513KV18-250BZXI is sourced from the original manufacturer or authorized distributors?

All CY7C1513KV18-250BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1513KV18-250BZXI meets industry standards.

7.What is the process for return or replacement of CY7C1513KV18-250BZXI?

All CY7C1513KV18-250BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1513KV18-250BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1513KV18-250BZXI part is unused and in its original packaging.

Return procedure for CY7C1513KV18-250BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1513KV18-250BZXI Tags

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