Infineon Technologies CY7C1513KV18-300BZXC

Overview

CY7C1513KV18-300BZXC from Cypress Semiconductor is a 4M × 18 (72-Mbit) QDR® II SRAM with synchronous pipelined architecture, dual independent read/write ports, 300 MHz clock operation, DDR interfaces delivering 600 MT/s effective data rate, and 1.8 V core / 1.4–1.8 V I/O supply. It serves as high-bandwidth buffer memory in network packet processors requiring concurrent access and deterministic latency.

For engineers reviewing the CY7C1513KV18-300BZXC datasheet, CY7C1513KV18-300BZXC pinout, CY7C1513KV18-300BZXC application, or CY7C1513KV18-300BZXC equivalent, key selection criteria include four-word burst timing, echo clock (CQ/CQ) support for source-synchronous capture, DOFF-configurable 1.5-cycle vs. 1-cycle read latency, and FBGA-165 package compatibility with high-speed PCB routing constraints.

Technical Context

This QDR II SRAM implements separate K/K input clocks for address/data capture and C/C output clocks for data launch-enabling precise DDR timing control without bus turnaround. Its internal PLL synchronizes echo clocks (CQ/CQ) to output data edges, reducing setup/hold margin requirements at 600 MT/s.

The device supports depth expansion via RPS/WPS port selects and byte-level write masking (BWS[1:0]) across its 18-bit data width. All operations are fully synchronous with rising-edge-triggered registers, and writes are internally self-timed to guarantee atomicity without external handshaking.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, Pb-free termination.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with CY7C1513KV18-250BZXC, the -300BZXC delivers 20% higher bandwidth and tighter timing margins but consumes ~14% more current; versus AS7C3256A-15JCIN, it requires a QDR II–capable controller but enables full-duplex operation and deterministic latency critical for modern packet processing.

Availability

CY7C1513KV18-300BZXC is available at Aetrix Electronics and suitable for network packet processors, telecom line cards, baseband units, and high-speed test equipment requiring stable component supply across extended production lifecycles.

Supply support for CY7C1513KV18-300BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.

CY7C1513KV18 belongs to the QDR® II SRAM product line, engineered specifically for deterministic, concurrent-access memory subsystems in packet-switched infrastructure where bus turnaround overhead must be eliminated.

FAQ

What is the function of the DOFF pin on CY7C1513KV18-300BZXC?

The DOFF (Data Out Fast) pin configures read latency: when asserted HIGH, it enables 1.5-cycle latency for improved timing margin in high-speed systems; when LOW, it selects 1-cycle latency for minimal pipeline delay. This setting is sampled at power-up and remains static during operation-no runtime reconfiguration is supported.

Can CY7C1513KV18-300BZXC operate with only a single clock domain (K only)?

Yes-the device supports single-clock mode where K drives both input capture and output launch. In this mode, C and C are tied to K and K respectively, and echo clocks (CQ/CQ) remain functional. However, dual-clock mode (separate K/K and C/C) is required to achieve full timing deskew benefits and maximum bandwidth efficiency.

How does byte write select (BWS[1:0]) work for the 18-bit data width?

BWS[0] controls the lower 9 bits (D[8:0]), and BWS[1] controls the upper 9 bits (D[17:9]). Both are active-low; asserting either disables writing to its respective 9-bit byte while preserving existing data in that byte. This enables partial-word updates without read-modify-write cycles-essential for metadata field manipulation in packet buffers.

Is the 165-ball FBGA package of CY7C1513KV18-300BZXC compatible with standard reflow profiles?

Yes-the package complies with IPC/JEDEC J-STD-020 moisture sensitivity level 3 and supports standard lead-free reflow profiles (peak temperature ≤260°C). Board layout must observe 0.8 mm ball pitch spacing, controlled-impedance routing for K/K and C/C pairs, and dedicated VSS/VDDQ decoupling per datasheet recommendations to maintain signal integrity at 300 MHz.