Infineon Technologies CY7C1514JV18-250BZXC

Overview

CY7C1514JV18-250BZXC from Cypress Semiconductor is a 72-Mbit QDR® II SRAM with 2M × 36 organization, 250 MHz maximum operating frequency, 1.8 V core supply (VDD), 1.4–1.8 V I/O supply (VDDQ), and 165-ball FBGA (15 × 17 × 1.4 mm) package. It implements separate read/write ports, DDR interfaces on both ports, and 2-word burst transfers - enabling high-bandwidth buffering in network packet processors and FPGA-based data path acceleration.

For engineers reviewing the CY7C1514JV18-250BZXC datasheet, CY7C1514JV18-250BZXC pinout, CY7C1514JV18-250BZXC application, or CY7C1514JV18-250BZXC equivalent, key selection criteria include its 1.5-cycle DLL-enabled read latency, echo clock (CQ/CQ) support for timing deskew, HSTL-compatible variable-drive outputs, JTAG 1149.1 test access, and synchronous self-timed write architecture.

Technical Context

This device is a synchronous pipelined SRAM using QDR II architecture: dual independent ports (read and write), multiplexed address bus latched on alternating edges of K/K clocks, and DDR data transfer on both ports at 500 Mbps per pin (250 MHz clock × 2). It supports DLL-on mode (1.5-cycle read latency) and DLL-off mode (1-cycle latency, QDR I timing up to 167 MHz).

Internal organization is two 1M × 36 arrays; address inputs A[19:0] (20 bits) select locations; BWS[3:0] enable byte-level write masking across four 9-bit groups; RPS/WPS control port activation synchronously on K rising edge; C/C clocks drive output registers while CQ/CQ provide deskew-referenced echo clocks aligned to C/C.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant (Pb-free).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with IDT72T36150L10BG and IS61WV102432BLL-15BLI, CY7C1514JV18-250BZXC delivers 2× memory density and 2.5× bandwidth via DDR + QDR II architecture, but requires precise HSTL layout and DLL calibration - making it optimal for new high-speed data path designs, not drop-in replacements.

Availability

CY7C1514JV18-250BZXC is available at Aetrix Electronics and suitable for network switching, FPGA co-processing, telecom baseband, and high-speed test equipment requiring stable component supply, long-lifecycle assurance, and traceable sourcing.

Supply support for CY7C1514JV18-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and timing precision.

CY7C1514JV18 belongs to the QDR II SRAM product line, engineered specifically for deterministic, high-bandwidth buffering in packet-forwarding engines, FPGA accelerators, and real-time signal processing systems.

FAQ

What is the function of the DOFF pin, and how does it affect timing?

The DOFF pin disables the internal Delay Lock Loop when pulled LOW. In DLL-off mode, the device operates as a QDR I SRAM with 1-cycle read latency and reduced maximum frequency (≤167 MHz). When DOFF is HIGH (via 10 kΩ pull-up), DLL is active, enabling 1.5-cycle latency and full 250 MHz operation. Timing parameters differ significantly between modes - both sets are fully specified in the datasheet.

How are the BWS[3:0] pins used for write masking in the 2M × 36 configuration?

BWS[3:0] are active-LOW byte write selects that mask corresponding 9-bit groups of D[35:0]: BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18], and BWS3 controls D[35:27]. During a write, only bytes with asserted (LOW) BWS signals are updated; unmasked bytes retain prior values. All BWS pins are sampled synchronously on the rising edge of K/K.

Can C and C be used as single-ended clocks, or must they always be differential?

C and C are complementary clock inputs intended for differential operation to minimize skew and jitter. While the device accepts single-ended C with C tied to VSS or VDDQ, this violates HSTL timing specifications and degrades setup/hold margins. For guaranteed 250 MHz operation, differential C/C routing with matched trace lengths and proper termination is mandatory per the datasheet layout guidelines.

What is the role of the ZQ pin, and how should it be connected?

ZQ calibrates output driver impedance for Q[35:0] and CQ/CQ pins. It must be connected to a precision resistor (RQ) between ZQ and GND; output impedance is set to 0.2 × RQ. Alternatively, ZQ may be tied directly to VDDQ to enable minimum-impedance mode (≈20 Ω). ZQ must never be left floating or connected to GND - doing so causes undefined output drive strength and signal integrity failure.