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Infineon Technologies CY7C1514KV18-200BZXC

Part No.:
CY7C1514KV18-200BZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1514KV18-200BZXC.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,483

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Product details

Overview

CY7C1514KV18 from Cypress Semiconductor is a 2M × 36-bit (72-Mbit), 1.8V QDR® II SRAM with dual DDR interfaces, 350 MHz clock support (700 MT/s data rate), 1.5-cycle read latency (DOFF = HIGH), and synchronous self-timed writes - deployed in high-bandwidth packet buffering for network line cards.

For engineers reviewing the CY7C1514KV18 datasheet, CY7C1514KV18 pinout, CY7C1514KV18 application, or CY7C1514KV18 equivalent, key selection criteria include burst depth (2-word), I/O voltage compatibility (VDDQ = 1.4–1.8 V), FBGA-165 package footprint, and QDR II-specific timing controls (K/K, C/C, CQ/CQ, DOFF).

Technical Context

This SRAM implements true dual-port architecture with physically separate read and write data paths, eliminating bus turnaround overhead. It uses two independent input clocks (K and K) for address/data capture and two output clocks (C and C) plus echo clocks (CQ and CQ) to manage skew across 36-bit wide DDR buses at 350 MHz.

The device supports programmable impedance via ZQ pin, JTAG 1149.1 boundary scan, and configurable read latency (1-cycle with DOFF = LOW, 1.5-cycle with DOFF = HIGH). All operations are fully synchronous, with address latching on alternating edges of K clock and internal pipelined access.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density2M × 36-bit (72 Mbit) - provides 72 million bits of fast, low-latency buffer storage for multi-gigabit packet processing.
Max Clock Frequency350 MHz - enables 700 MT/s effective data rate per port using DDR signaling on both read and write interfaces.
Read Latency1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - selectable timing mode for optimizing system-level pipeline alignment.
Supply VoltagesVDD = 1.8 V ±0.1 V; VDDQ = 1.4–1.8 V - supports interoperability with 1.5 V or 1.8 V I/O domains without level shifters.
Burst Length2-word fixed burst - delivers two consecutive 36-bit words per access, matching typical network header + payload granularity.
Package165-ball FBGA (13 × 15 × 1.4 mm) - industry-standard footprint for high-density routing and thermal management in telecom PCBs.
Interface StandardHSTL Class I - ensures signal integrity at 700 MT/s with controlled-impedance trace design and ZQ calibration support.

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
D[35:0]Synchronous write data inputs36-bit parallel data sampled on rising edge of K clock; supports byte-selectable writes via BWS[3:0].
Q[35:0]Synchronous read data outputs36-bit parallel DDR outputs registered to C/C clocks; echo clocks CQ/CQ simplify source-synchronous capture.
K, KInput clocks for address/data captureDual-phase clocks drive read/write address latching and write data sampling; only rising edges used.
C, COutput clocks for read data timingSeparate output domain clocks minimize flight-time mismatch between data and clock signals.
CQ, CQEcho clocksReplica of C/C clocks routed with data; enable precise latch timing at receiver without board-level skew compensation.
DOFFRead latency controlActive-HIGH selects 1.5-cycle latency; Active-LOW selects 1-cycle latency - configures pipeline depth for system timing closure.
BWS[3:0]Byte write select inputsFour active-LOW signals enabling independent 8-bit write masking - preserves unselected bytes during partial writes.
RPS, WPSPort select controlsActive-LOW signals enable concurrent read/write transactions on shared address bus without arbitration logic.
ZQImpedance calibration referenceConnects to external 240 Ω resistor to ground; calibrates HSTL output driver strength for consistent signal integrity.
TMS, TCK, TDI, TDOJTAG 1149.1 test interfaceSupports boundary scan testing, device identification, and in-system programming verification.

Key Features

FeatureDesign Value
True dual-port DDR architectureEliminates bus turnaround delay by dedicating D[35:0] to writes and Q[35:0] to reads - sustains full 700 MT/s throughput on both ports simultaneously.
Programmable read latencyDOFF pin allows runtime selection between 1-cycle (low-latency streaming) and 1.5-cycle (higher-frequency timing margin) modes - adapts to system clock tree constraints.
Source-synchronous echo clocksCQ/CQ signals track Q[35:0] propagation delay - remove need for complex PCB length matching and simplify high-speed data capture in FPGA-based systems.
On-die impedance calibrationZQ pin enables automatic adjustment of HSTL output driver strength - maintains signal fidelity across voltage/temperature variation without external termination resistors.
Byte-selectable write capabilityBWS[3:0] supports granular 8-bit write masking - avoids read-modify-write cycles when updating sub-word fields in protocol headers or metadata buffers.

Applications

Network Packet BufferingTelecom Line Card Memory

Use Scenario: Storing ingress/egress packet headers and payloads in 10G/25G Ethernet switch ASICs.

IC Role / Device Role / Timing Role: High-throughput, low-latency shared memory buffer interfacing directly with SerDes MAC controllers and traffic managers.

Use Value: 2-word burst + 700 MT/s DDR bandwidth meets line-rate buffering requirements for 25 Gbps links without external FIFOs.

Use Scenario: Frame assembly/disassembly in OTN or CPRI baseband processing units.

IC Role / Device Role / Timing Role: Synchronous dual-port SRAM providing time-aligned read/write access for jitter-tolerant transport layer buffering.

Use Value: Independent RPS/WPS control enables deterministic latency for real-time frame reordering without arbitration stalls.

High-Speed Test Equipment MemoryAvionics Data Acquisition Buffer

Use Scenario: Capturing high-fidelity waveform samples in digital storage oscilloscopes and bit-error-rate testers.

IC Role / Device Role / Timing Role: Burst-mode acquisition memory synchronized to sampling clock with minimal pipeline delay.

Use Value: 1-cycle latency mode (DOFF = LOW) reduces trigger-to-capture delay to ≤3 ns at 350 MHz - critical for sub-nanosecond timing resolution.

Use Scenario: Real-time sensor fusion buffering in flight control computers handling ARINC 429/664 data streams.

IC Role / Device Role / Timing Role: Radiation-tolerant (neutron soft error immunity rated) memory for deterministic, lockstep-safe data staging.

Use Value: Full data coherency and synchronous self-timed writes ensure atomic updates across 36-bit word boundaries - prevents partial writes during power transients.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72T365236-bit QDR II+ (400 MHz max), integrated DLL instead of PLL, no ZQ calibrationHigher frequency ceiling but requires tighter board layout control for DLL stabilityPreferred for new designs targeting >350 MHz operation where layout resources allow DLL tuning.
ISSI IS61WV102436B36-bit QDR II (333 MHz max), no echo clocks, simplified pinout (no CQ/CQ), lower IccLimited skew compensation capability; suited for cost-sensitive, lower-bandwidth systemsSelect when 333 MHz bandwidth suffices and echo clock routing complexity must be avoided.

Compared with IDT72T3652 and IS61WV102436B, CY7C1514KV18 offers optimal balance of 350 MHz performance, echo-clock–assisted timing margin, and ZQ-calibrated HSTL drive - making it ideal for field-upgradable telecom hardware requiring proven reliability and layout flexibility.

Availability

CY7C1514KV18 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, high-speed test equipment memory, and avionics data acquisition requiring stable component supply across extended product lifecycles.

Supply support for CY7C1514KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.

CY7C1514KV18 belongs to the QDR II SRAM product line, engineered specifically for deterministic, low-latency, dual-port buffering in multi-gigabit serial data infrastructure where bus turnaround overhead must be eliminated.

FAQ

What is the function of the DOFF pin on CY7C1514KV18?

The DOFF (Data Output OFFset) pin selects read latency mode: when HIGH, it enables 1.5-cycle latency for improved timing margin at 350 MHz; when LOW, it enables 1-cycle latency for minimum delay in streaming applications. This setting is sampled synchronously on the K clock and affects all subsequent read operations until changed.

How does the ZQ pin operate for impedance calibration?

The ZQ pin connects to an external 240 Ω resistor to ground and initiates on-die calibration of HSTL output driver strength. Calibration occurs automatically at power-up and can be triggered manually via JTAG. It compensates for process, voltage, and temperature variations to maintain ±15% output impedance accuracy - critical for signal integrity at 700 MT/s.

Can CY7C1514KV18 operate with only one clock domain (K-only)?

Yes - CY7C1514KV18 supports single-clock-domain operation where K and K are tied together, and C and C are tied together. In this mode, the device functions as a standard QDR II part with simplified clock routing, though maximum frequency may be limited by combined clock skew; full dual-clock operation is required to achieve guaranteed 350 MHz performance.

What is the purpose of BWS[3:0] signals in write operations?

BWS[3:0] are active-LOW byte write select signals that mask individual 8-bit segments of the 36-bit D[35:0] bus during writes. When a BWS bit is deasserted (HIGH), the corresponding byte remains unaltered in memory - enabling efficient partial-word updates without read-modify-write sequences, essential for protocol header manipulation in networking applications.

CY7C1514KV18-200BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1514KV18-200BZXC FAQ

1.How can I place an order for CY7C1514KV18-200BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1514KV18-200BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1514KV18-200BZXC reliable?

The price and inventory of CY7C1514KV18-200BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1514KV18-200BZXC is usually 5 days.

3.What payment methods are accepted for CY7C1514KV18-200BZXC?

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CY7C1514KV18-200BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1514KV18-200BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1514KV18-200BZXC?

For technical support, including CY7C1514KV18-200BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1514KV18-200BZXC requirements.

6.How does Aetrix verify that CY7C1514KV18-200BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1514KV18-200BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1514KV18-200BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1514KV18-200BZXC?

All CY7C1514KV18-200BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1514KV18-200BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1514KV18-200BZXC part is unused and in its original packaging.

Return procedure for CY7C1514KV18-200BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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