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Infineon Technologies CY7C1514KV18-250BZXC

Part No.:
CY7C1514KV18-250BZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1514KV18-250BZXC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,403

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Product details

Overview

CY7C1514KV18 from Cypress Semiconductor is a 2M × 36-bit (72-Mbit), 1.8V QDR® II SRAM with synchronous pipelined architecture, dual independent read/write ports, 250 MHz K-clock operation (500 MT/s effective data rate), and DDR interfaces on both ports. It delivers concurrent high-bandwidth memory access for network packet buffering in telecom line cards and FPGA co-processor systems.

For engineers reviewing the CY7C1514KV18 datasheet, CY7C1514KV18 pinout, CY7C1514KV18 application, or CY7C1514KV18 equivalent, key selection criteria include its 2-word burst depth, DOFF-controlled 1.5-cycle vs. 1-cycle read latency, HSTL-18 I/O compatibility, 165-ball FBGA (13 × 15 mm) package, and JTAG 1149.1 test support.

Technical Context

This SRAM implements true QDR II architecture: separate read and write data paths eliminate bus turnaround, enabling simultaneous read and write transactions at full bandwidth. Address latching uses alternating rising edges of K/K clocks, while output timing relies on C/C or echo clocks (CQ/CQ) to mitigate flight-time skew.

The device integrates a PLL for precise data placement, supports programmable impedance via ZQ pin, and features synchronous self-timed writes with byte-level write select (BWS[3:0]) for partial-word updates. Core VDD = 1.8 V ±0.1 V; I/O VDDQ = 1.4–1.8 V, supporting interoperability with 1.5 V and 1.8 V systems.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 2M × 36-bit (72 Mbit) - provides 72 million bits of high-speed, low-latency storage for packet buffers or frame caches.
Maximum Clock Frequency 250 MHz K-clock - enables 500 MT/s effective throughput with DDR interface on both read and write ports.
Read Latency Configurable: 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - allows trade-off between timing margin and pipeline efficiency.
I/O Voltage Support VDDQ = 1.4 V to 1.8 V - ensures compatibility with 1.5 V and 1.8 V logic families without level-shifting.
Package 165-ball FBGA (13 × 15 × 1.4 mm) - industry-standard footprint for high-pin-count, thermally efficient board layout.
Interface Standard HSTL-18 Class I - guarantees signal integrity at 500 MT/s with controlled-impedance PCB routing.
JTAG Compliance IEEE 1149.1 - enables boundary-scan testing and in-system programming verification.

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
D[35:0] Synchronous write data inputs 36-bit parallel data sampled on rising edge of K clock; supports full or partial writes via BWS[3:0].
Q[35:0] Synchronous read data outputs 36-bit parallel data driven on rising edge of C/C or CQ/CQ clocks; echo clocks simplify capture in high-speed receivers.
K / K Input clocks (read/write) Dual-phase clock pair; rising edges latch addresses and sample D[35:0], WPS, BWS[3:0]; only rising edges used.
C / C Output clocks (read) Separate clock pair for read data timing; minimizes skew between clock and Q[35:0] signals.
CQ / CQ Echo clocks Output copies of C/C, phase-aligned with Q[35:0]; enable source-synchronous data capture in FPGA/ASIC receivers.
BWS[3:0] Byte write selects Four active-low signals controlling 8-bit byte lanes; allows selective update of any subset of 36-bit word without read-modify-write.
WPS Write port select Active-low enable for write operations; deassertion blocks all write activity including BWS and D[35:0] sampling.
DOFF Read latency control High = 1.5-cycle latency (improved timing margin); Low = 1-cycle latency (maximizes pipeline depth).
ZQ Impedance calibration reference Connects to external 240 Ω resistor to ground; enables on-die termination calibration for HSTL-18 I/O drivers.
TMS/TCK/TDI/TDO JTAG test access port Fully compliant IEEE 1149.1 interface for boundary scan, device ID, and test register access.

Key Features

Feature Design Value
Independent Read/Write Ports Enables true concurrent access-no bus turnaround required-critical for full-duplex packet processing in switch fabric controllers.
2-Word Burst Architecture Every address access transfers two consecutive 36-bit words, doubling effective bandwidth per transaction versus single-word devices.
Programmable Read Latency (DOFF) Switches between 1-cycle (low latency) and 1.5-cycle (higher setup margin) modes-supports design optimization across speed-grade variants.
HSTL-18 Output Drivers with ZQ Calibration On-die impedance matching eliminates external termination resistors and reduces PCB routing complexity for 500 MT/s signaling.
Depth Expansion Support (RPS/WPS) Separate read and write port selects allow stacking multiple devices to increase memory depth while preserving independent port operation.

Applications

Telecom Line Card Buffering Network Processor Co-Cache

Use Scenario: Storing ingress/egress packet headers and metadata in 10G/40G line cards with strict latency budgets.

IC Role / Device Role / Timing Role: High-throughput, low-latency shared memory buffer interfacing directly with SerDes MACs and traffic managers.

Use Value: Concurrent read/write capability eliminates arbitration stalls, sustaining >90% utilization under full-duplex line-rate traffic.

Use Scenario: Acting as instruction/data cache extension for multi-core network processors handling deep packet inspection.

IC Role / Device Role / Timing Role: Off-chip pipelined SRAM providing deterministic 1-cycle or 1.5-cycle read response to processor load requests.

Use Value: 36-bit wide interface matches typical NPU internal bus width, reducing interconnect count and improving bandwidth density.

FPGA-Based Protocol Accelerator High-Speed Test Equipment Memory

Use Scenario: Real-time packet reassembly and header translation in FPGA-accelerated SDN controllers.

IC Role / Device Role / Timing Role: Dual-port memory mapped into FPGA logic fabric via dedicated read/write AXI streams.

Use Value: Independent ports allow FPGA to stream incoming packets to write port while simultaneously fetching lookup results from read port.

Use Scenario: Capturing high-fidelity waveform samples in automated test equipment requiring deterministic burst capture.

IC Role / Device Role / Timing Role: Synchronous burst buffer synchronized to instrument clock domain using CQ echo clocks.

Use Value: Echo clock alignment enables sub-200 ps capture window jitter, meeting IEEE 1149.6 AC-JTAG compliance requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615 36-bit, 2M × 36, 200 MHz max clock, LVDS I/O, no DOFF latency control Lacks configurable read latency and echo clocks; requires external termination Prefer when LVDS signaling and lower power at 200 MHz are prioritized over 250 MHz bandwidth and timing flexibility.
ISSI IS61WV204836B 36-bit, 2M × 36, 167 MHz max clock, SSTL-2 I/O, asynchronous reset, no JTAG Lower speed grade, different I/O standard, no boundary scan or echo clock support Choose for cost-sensitive industrial control where 167 MHz bandwidth suffices and testability is not required.

Compared with IDT72T3615 and IS61WV204836B, CY7C1514KV18 uniquely combines 250 MHz operation, DOFF-configurable latency, CQ echo clocks for simplified capture, and IEEE 1149.1 JTAG-making it optimal for next-gen telecom and test equipment demanding maximum deterministic bandwidth.

Availability

CY7C1514KV18 is available at Aetrix Electronics and suitable for telecom infrastructure, network processor acceleration, FPGA-based protocol offload, and high-speed automated test equipment requiring stable component supply across long production lifecycles.

Supply support for CY7C1514KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and mixed-signal ICs for networking, automotive, and industrial applications, with emphasis on signal integrity and system-level timing robustness.

CY7C1514KV18 belongs to the QDR® II SRAM product line, engineered specifically for full-duplex, high-throughput memory subsystems in packet-switched infrastructure where deterministic latency and concurrent access are mandatory.

FAQ

What is the function of the DOFF pin on CY7C1514KV18?

The DOFF (Data Out Fast) pin configures read latency mode: when asserted HIGH, the device operates with 1.5-cycle read latency for improved timing margin; when LOW, it uses 1-cycle latency for maximum pipeline efficiency. This setting is sampled synchronously on the K clock and remains active until changed.

How does the CY7C1514KV18 handle partial-word writes?

Partial-word writes are controlled by four active-low Byte Write Select signals (BWS[3:0]), each enabling one 8-bit byte lane within the 36-bit word. When a BWS bit is deasserted, the corresponding byte is ignored during the write cycle, preserving existing data in those bits without requiring read-modify-write sequences.

Can CY7C1514KV18 operate with only a single clock domain?

Yes-CY7C1514KV18 supports single-clock-domain operation by tying K to C and K to C, eliminating need for separate clock generators. In this mode, echo clocks (CQ/CQ) remain functional for source-synchronous data capture, and all timing parameters shift to reflect the unified clock path per the datasheet's "Single Clock Mode" section.

What is the purpose of the ZQ pin and how must it be connected?

The ZQ pin connects to an external 240 Ω resistor to ground and enables on-die impedance calibration for HSTL-18 output drivers. This calibration ensures consistent 25 Ω driver impedance across voltage and temperature, eliminating need for external series termination and maintaining signal integrity at 500 MT/s data rates.

CY7C1514KV18-250BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1514KV18-250BZXC FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1514KV18-250BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1514KV18-250BZXC reliable?

The price and inventory of CY7C1514KV18-250BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1514KV18-250BZXC is usually 5 days.

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4.How is shipping managed for CY7C1514KV18-250BZXC?

CY7C1514KV18-250BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1514KV18-250BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1514KV18-250BZXC?

For technical support, including CY7C1514KV18-250BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1514KV18-250BZXC requirements.

6.How does Aetrix verify that CY7C1514KV18-250BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1514KV18-250BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1514KV18-250BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1514KV18-250BZXC?

All CY7C1514KV18-250BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1514KV18-250BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1514KV18-250BZXC part is unused and in its original packaging.

Return procedure for CY7C1514KV18-250BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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