Infineon Technologies CY7C1514KV18-300BZXC
- Part No.:
- CY7C1514KV18-300BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1514KV18-300BZXC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1514KV18 from Cypress Semiconductor is a 72-Mbit QDR® II SRAM with 2M × 36 organization, 300 MHz clock frequency, 1.8V core supply, and 1.4–1.8V I/O supply. It implements separate read/write ports with DDR interfaces on both, 2-word burst architecture, and echo clocks (CQ/CQ) for high-speed data capture in networking and packet buffering applications.
For engineers reviewing the CY7C1514KV18 datasheet, CY7C1514KV18 pinout, CY7C1514KV18 application, or CY7C1514KV18 equivalent, key selection criteria include its 300 MHz operation, x36 bus width, 165-ball FBGA package, DOFF-controlled read latency mode, and JTAG 1149.1 test support.
Technical Context
The CY7C1514KV18 uses synchronous pipelined QDR II architecture with independent read and write ports sharing a multiplexed address bus. Address latching occurs on alternate rising edges of K/K clocks, enabling concurrent transactions without bus turnaround.
It employs a PLL for precise data placement and supports two timing modes via DOFF: 1.5-cycle read latency (DOFF = HIGH) or 1-cycle latency (DOFF = LOW), matching QDR I compatibility when needed. Echo clocks CQ/CQ are output-synchronized to simplify capture at 700 MT/s.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 configuration) |
| Max Clock Frequency | 300 MHz - enables 700 MT/s effective data rate per port via DDR |
| Core Supply Voltage | 1.8 V ± 0.1 V - defines internal logic voltage and power domain isolation |
| I/O Supply Range | 1.4 V to 1.8 V - supports HSTL-compatible signaling with variable drive strength |
| Read Latency | Selectable: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) - impacts pipeline depth in high-speed controllers |
| Burst Length | 2-word fixed burst - delivers two 36-bit words per access, optimizing bandwidth efficiency |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory in dense PCB layouts |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data input | 36-bit parallel data sampled on rising edge of K/K; full bus width enables single-cycle 72-bit writes |
| Q[35:0] | Synchronous read data output | 36-bit parallel output registered to C/C clocks; supports 700 MT/s DDR reads |
| K / K | Input clocks for address/data sampling | Dual-phase clock pair - K used for read address, K for write address; both control D/Q timing |
| C / C | Output clocks for data capture | Separate clocks for Q outputs to minimize skew; paired with CQ/CQ for source-synchronous timing |
| CQ / CQ | Echo clocks | Output copies of C/C, aligned to Q[35:0] edges - eliminates flight-time mismatch in FPGA/ASIC receivers |
| WPS | Write port select | Active-low signal enabling write operations; deassertion blocks all D[35:0] latching regardless of BWS state |
| BWS[3:0] | Byte write selects | Four active-low signals controlling 8-bit byte lanes; allows partial writes without read-modify-write overhead |
| DOFF | Read latency mode control | High = 1.5-cycle latency (QDR II mode); Low = 1-cycle latency (QDR I compatibility) |
| TMS/TCK/TDI/TDO | JTAG boundary scan interface | IEEE 1149.1 compliant - enables in-system test, debug, and programmable impedance calibration |
Key Features
| Feature | Design Value |
|---|---|
| Independent Read/Write Ports | Eliminates bus turnaround delay - enables true concurrent read+write at full bandwidth |
| 2-Word Burst + DDR Interface | Delivers 72 bits per clock edge (36-bit × 2 words × 2 edges/cycle) = 4.32 Gbps aggregate bandwidth at 300 MHz |
| Echo Clocks (CQ/CQ) | Source-synchronous timing reference reduces setup/hold margin requirements by >150 ps in 700 MT/s links |
| Programmable Impedance via JTAG | Enables dynamic HSTL driver calibration without external resistors or layout changes |
| Depth Expansion Support | RPS/WPS and BWS[3:0] allow stacking multiple CY7C1514KV18 devices for wider or deeper memory configurations |
Applications
| Packet Buffering in Switch ASICs | Line Card Memory in Telecom Routers |
|---|---|
Use Scenario: High-throughput packet buffering where ingress and egress traffic must be handled simultaneously without contention. IC Role / Device Role / Timing Role: Dual-port SRAM serving as shared buffer between parser and scheduler engines, with K/K clocks synchronized to line-rate timing domains. Use Value: 72-bit x36 bus width matches typical 10G/40G packet header widths; 300 MHz operation sustains ≥4.3 Gbps sustained throughput per port. | Use Scenario: Storing forwarding tables and queue descriptors in modular router line cards requiring deterministic latency. IC Role / Device Role / Timing Role: Low-latency memory for TCAM assist and queue management, interfaced directly to FPGA fabric using CQ/CQ for reliable capture. Use Value: 1-cycle read latency mode (DOFF = LOW) reduces lookup pipeline stages; JTAG programmable impedance ensures signal integrity across backplane traces. |
| Baseband Processing in 4G/LTE eNodeB | Real-Time Video Frame Buffering |
Use Scenario: Temporary storage of OFDMA symbol buffers during uplink/downlink processing in wireless baseband units. IC Role / Device Role / Timing Role: Synchronous SRAM acting as ping-pong buffer between FFT and channel estimation blocks, clocked from FPGA-generated K/C domains. Use Value: Separate RPS/WPS enables alternating read/write phases without arbitration logic; 1.8V core minimizes power in thermally constrained RF modules. | Use Scenario: Inter-frame buffering in broadcast-grade video encoders requiring glitch-free 4K60 RGB/YUV transfers. IC Role / Device Role / Timing Role: Dual-port frame store allowing simultaneous write of incoming sensor data and read of processed output to encoder engine. Use Value: 2-word burst delivers full 36-bit pixel quads per access; echo clocks eliminate need for complex deskew circuitry in high-resolution timing paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C362000B-300BIN | 300 MHz QDR II+, 2M × 36, 1.5V core, no DOFF latency selection | Lacks 1-cycle latency mode; requires fixed 1.5-cycle timing in all configurations | Choose when system design locks to QDR II+ spec and does not require QDR I compatibility |
| IS45S32800J-300BLI | 300 MHz QDR II, 2M × 36, 1.8V core, but only 144-ball FBGA (11 × 13 mm) | Smaller footprint but reduced thermal mass and fewer power/ground balls - limits max sustained bandwidth under thermal stress | Choose for space-constrained designs where thermal derating below 300 MHz is acceptable |
Compared with AS7C362000B-300BIN and IS45S32800J-300BLI, the CY7C1514KV18 uniquely supports selectable read latency (1 or 1.5 cycles) and includes JTAG-based impedance tuning - critical for signal integrity in multi-GHz FPGA interfaces.
Availability
CY7C1514KV18 is available at Aetrix Electronics and suitable for packet buffering in network switches, line card memory in telecom routers, and baseband processing in 4G/LTE eNodeB systems requiring stable component supply across extended production lifecycles.
Supply support for CY7C1514KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets.
The QDR® II SRAM product line targets high-speed packet processing and real-time buffering applications where deterministic latency, concurrent access, and DDR bandwidth are mandatory.
FAQ
What is the function of the DOFF pin on CY7C1514KV18?
The DOFF (Data Output OFF) pin selects read latency mode: when asserted HIGH, it enables 1.5-cycle latency (standard QDR II operation); when LOW, it configures the device for 1-cycle latency, providing backward compatibility with QDR I timing. This setting affects internal pipeline staging and must be held stable during initialization.
How does the CY7C1514KV18 handle partial writes?
Partial writes are controlled by the four Byte Write Select (BWS[3:0]) inputs, each enabling or disabling one 8-bit lane of the 36-bit D[35:0] bus. When a BWS signal is deasserted (HIGH), the corresponding byte remains unaltered - eliminating need for read-modify-write cycles and reducing bus traffic in descriptor updates.
Can the CY7C1514KV18 operate with only one clock domain?
Yes - the device supports single-clock mode where K and C are driven by the same source, and K and C are tied together. In this configuration, the internal PLL is bypassed, and echo clocks CQ/CQ track the single input clock, simplifying timing closure at the cost of reduced skew tolerance versus dual-clock operation.
What is the purpose of the NC/144M and NC/288M pins?
NC/144M and NC/288M are no-connect pins not bonded to the die; they may be left floating or tied to any voltage level (VDD, VSS, or mid-rail). These pins exist for package compatibility across the QDR II family and have no electrical function - their state does not affect device operation or timing.
CY7C1514KV18-300BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 300 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1514KV18-300BZXC FAQ
1.How can I place an order for CY7C1514KV18-300BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1514KV18-300BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1514KV18-300BZXC reliable?
The price and inventory of CY7C1514KV18-300BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1514KV18-300BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1514KV18-300BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1514KV18-300BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1514KV18-300BZXC?
CY7C1514KV18-300BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1514KV18-300BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1514KV18-300BZXC?
For technical support, including CY7C1514KV18-300BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1514KV18-300BZXC requirements.
6.How does Aetrix verify that CY7C1514KV18-300BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1514KV18-300BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1514KV18-300BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1514KV18-300BZXC?
All CY7C1514KV18-300BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1514KV18-300BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1514KV18-300BZXC part is unused and in its original packaging.
Return procedure for CY7C1514KV18-300BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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