Infineon Technologies CY7C1514KV18-333BZXI

Overview

CY7C1514KV18-333BZXI from Cypress Semiconductor is a 72-Mbit QDR® II SRAM with 2M × 36 organization, 333 MHz clock frequency, 1.8V core supply, and 1.4–1.8V I/O supply. It implements separate read/write ports with DDR interfaces on both, 2-word burst architecture, and echo clocks (CQ/CQ) for high-speed data capture in networking and packet buffering systems.

For engineers reviewing the CY7C1514KV18-333BZXI datasheet, CY7C1514KV18-333BZXI pinout, CY7C1514KV18-333BZXI application, or CY7C1514KV18-333BZXI equivalent, key selection criteria include 333 MHz operation, 2M × 36 x18 bus width, FBGA-165 package, DOFF-controlled read latency mode, and HSTL-compatible variable-drive outputs.

Technical Context

This QDR II SRAM uses dual independent clock domains: K/K for address/data input timing and C/C for output timing, enabling concurrent read/write transactions without bus turnaround. Its synchronous self-timed write circuitry eliminates external write pulse control, while the integrated PLL ensures precise data placement relative to echo clocks.

The device supports programmable read latency (1-cycle when DOFF = LOW; 1.5-cycle when DOFF = HIGH) and depth expansion via RPS/WPS and BWS[3:0] signals. All inputs are registered on rising edges of K/K; all outputs are edge-aligned to C/C or CQ/CQ, minimizing skew in 700 MT/s DDR data paths.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm footprint, 1.4 mm height, RoHS-compliant Pb-free finish (BZXI suffix).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth QDR SRAM applications.

Compared with IDT72T3615L10BG and IS61WV102436BLL-15BLI, CY7C1514KV18-333BZXI delivers 20× higher bandwidth via DDR QDR II architecture, configurable latency, and echo-clock–assisted capture - making it uniquely suited for 10G+ data plane applications requiring sub-10 ns timing margins.

Availability

CY7C1514KV18-333BZXI is available at Aetrix Electronics and suitable for 10G Ethernet switching, telecom line card design, LTE baseband processing, and real-time video encoding requiring stable component supply across multi-year production cycles.

Supply support for CY7C1514KV18-333BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and timing precision.

CY7C1514KV18 belongs to the QDR II SRAM product line, engineered specifically for high-speed packet buffering and burst-oriented memory access in ASIC/FPGA-based communications infrastructure.

FAQ

What is the function of the DOFF pin on CY7C1514KV18-333BZXI?

The DOFF (Data Output OFF) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle read latency for improved timing margin; when LOW, it selects 1-cycle latency for minimal pipeline delay. This setting is sampled synchronously on the K clock and affects all subsequent read operations until changed.

How does the CY7C1514KV18-333BZXI handle partial writes to its 36-bit data bus?

It uses four active-low Byte Write Select signals (BWS[3:0]) to enable writing to individual 9-bit byte lanes: BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18], and BWS3 controls D[35:27]. Unselected bytes retain their prior values, eliminating need for read-modify-write cycles.

Can CY7C1514KV18-333BZXI operate with only a single clock source instead of differential K/K and C/C?

Yes - the device accepts single-ended clock inputs on K and C pins, with complementary K and C pins tied to VDD or VSS as specified in the datasheet. However, differential operation is recommended for optimal jitter performance and EMI reduction at 333 MHz.

What is the purpose of the NC/144M and NC/288M pins on the FBGA package?

These are no-connect pins not bonded to the die; they may be left floating or tied to any voltage level (VDD, VSS, or mid-rail). Their presence accommodates pinout compatibility across the QDR II family (e.g., CY7C1510KV18 uses NC/144M for internal 144-MHz PLL test mode, unused here).