Infineon Technologies CY7C1515AV18-200BZC

Overview

CY7C1515AV18 from Cypress Semiconductor is a 72-Mbit QDR-II SRAM with 2M × 36 organization, 1.8V core supply, and 1.4–1.8V I/O voltage support. It delivers 600 MHz DDR data transfer on independent read/write ports, features 4-word burst architecture, DLL-enabled 1.5-cycle read latency, and operates in 165-ball FBGA (15 × 17 × 1.4 mm). It is used in high-bandwidth packet buffering for network switches and routers.

For engineers reviewing the CY7C1515AV18 datasheet, CY7C1515AV18 pinout, CY7C1515AV18 application, or CY7C1515AV18 equivalent, key selection criteria include QDR-II dual-port timing, x36 bus width compatibility, HSTL-18 I/O compliance, DLL-on/off mode behavior, and FBGA thermal/mechanical constraints in multi-chip memory subsystems.

Technical Context

The CY7C1515AV18 implements true dual-port synchronous pipelined access: separate K/K clocks latch write addresses and data, while C/C clocks drive read outputs with echo clocks (CQ/CQ) for precise source-synchronous capture. Its 512K × 36 internal array is accessed via 19-bit multiplexed address bus, with depth expansion enabled by BWS[3:0] and port-select signals (RPS/WPS).

It supports two operational modes: DLL-enabled QDR-II mode (1.5-cycle read latency, up to 300 MHz clock → 600 Mbps per pin) and DLL-disabled QDR-I mode (1-cycle latency, max 167 MHz). Core logic runs at 1.8 V ±0.1 V; I/O drivers are HSTL-18 compliant with programmable drive strength and ZQ impedance calibration.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant. Thermal and mechanical design supports high-density memory stacking in telecom line cards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with IDT72T36150 and IS61WV102436B, CY7C1515AV18 uniquely delivers 72-Mbit density with true dual-port DDR, DLL-controlled latency, and HSTL-18/ZQ compliance-making it the sole option for 300 MHz QDR-II systems requiring x36 width and source-synchronous timing.

Availability

CY7C1515AV18 is available at Aetrix Electronics and suitable for network switch fabric buffering, high-speed ATE trace memory, telecom baseband inter-processor communication, and avionics data concentrators requiring stable component supply and long-term industrial lifecycle support.

Supply support for CY7C1515AV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and timing precision.

CY7C1515AV18 belongs to the QDR-II SRAM product line, engineered specifically for deterministic, high-throughput memory interfacing in packet-processing and real-time test systems where dual-port concurrency and sub-ns timing control are mandatory.

FAQ

What is the minimum VDDQ voltage supported for reliable operation?

The CY7C1515AV18 supports VDDQ from 1.4 V to 1.8 V. Operation below 1.4 V violates HSTL-18 Class I specifications and risks setup/hold violations on Q[35:0] outputs. At 1.4 V, output drive strength is reduced but remains compliant with HSTL termination standards when ZQ calibration is applied.

Can the device operate without connecting the ZQ pin?

No. The ZQ pin must be connected either to a resistor-to-ground (for impedance tuning) or directly to VDDQ (for minimum impedance mode). Leaving ZQ unconnected or tied to VSS causes undefined output driver behavior and may result in signal integrity failures or excessive current draw.

How does DLL disable (DOFF = LOW) affect timing parameters?

When DOFF is pulled LOW, the DLL is disabled and the device reverts to QDR-I timing: read latency drops to 1 cycle, maximum operating frequency is limited to 167 MHz, and CQ/CQ echo clocks track K/K instead of C/C. All AC timing specs shift to QDR-I values per Table 5 of the datasheet.

Is the 165-ball FBGA package compatible with standard reflow profiles?

Yes. The CY7C1515AV18 FBGA uses lead-free solder balls and conforms to IPC/JEDEC J-STD-020D moisture sensitivity level 3. Recommended peak reflow temperature is 260 °C for ≤30 seconds; board layout must observe 0.3 mm solder mask defined pad design and 0.15 mm stencil aperture reduction for optimal void control.