Infineon Technologies CY7C1515JV18-300BZXC

Overview

CY7C1515JV18-300BZXC from Cypress Semiconductor is a 72-Mbit QDR® II SRAM with 2M × 36 organization, 300 MHz clock frequency, 1.8 V core supply (±0.1 V), 1.4–1.8 V I/O supply (VDDQ), and 1.5-cycle read latency with DLL enabled. It delivers 600 Mbps DDR data transfer on both read and write ports and is used in high-bandwidth packet buffering for network switches and routers.

For engineers reviewing the CY7C1515JV18-300BZXC datasheet, CY7C1515JV18-300BZXC pinout, CY7C1515JV18-300BZXC application, or CY7C1515JV18-300BZXC equivalent, key selection criteria include burst depth (4-word), dual-clock timing (K/K and C/C), echo clock support (CQ/CQ), HSTL-18 I/O compatibility, and FBGA-165 package mechanical constraints.

Technical Context

The CY7C1515JV18-300BZXC implements a synchronous pipelined QDR II architecture with physically separate read and write data paths, eliminating bus turnaround overhead. It uses independent K/K input clocks for address/data capture and C/C output clocks for data launch, with CQ/CQ echo clocks synchronized to C/C for precise receiver capture alignment.

Internally organized as four 512K × 36 arrays, it supports depth expansion via RPS/WPS port selects and byte-level write control via BWS[3:0]. The DLL enables 1.5-cycle read latency at 300 MHz; when disabled via DOFF, it operates in QDR I mode with 1-cycle latency up to 167 MHz.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body height, RoHS-compliant Pb-free finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth burst SRAM applications.

Compared with AS7C3256B-300BIN and IS61WV102436BLL-300TQI, CY7C1515JV18-300BZXC uniquely delivers concurrent 36-bit DDR read/write at 300 MHz with DLL-controlled 1.5-cycle latency and echo-clock–assisted capture-critical for next-generation packet and video processing.

Availability

CY7C1515JV18-300BZXC is available at Aetrix Electronics and suitable for network switching, telecom line card design, and high-speed test instrumentation requiring stable component supply, long-lifecycle support, and verified Pb-free FBGA packaging.

Supply support for CY7C1515JV18-300BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, industrial, and automotive applications.

CY7C1515JV18 belongs to the QDR® II SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth buffering in packet-switched infrastructure where concurrent access and precise timing are mandatory.

FAQ

What is the function of the DOFF pin?

The DOFF pin disables the internal Delay Lock Loop when pulled LOW. In this state, the device reverts to QDR I timing with 1-cycle read latency and a maximum operating frequency of 167 MHz. For normal QDR II operation at 300 MHz with 1.5-cycle latency, DOFF must be pulled HIGH via a ≤10 kΩ resistor to VDDQ.

How does the ZQ pin affect output drive strength?

ZQ connects to an external 240 Ω resistor to ground to calibrate the output driver impedance of Q[35:0] and CQ/CQ pins to 48 Ω (0.2 × 240 Ω). This ensures impedance matching to standard 50 Ω PCB traces. If ZQ is tied directly to VDDQ, the device enters minimum-impedance mode (≈30 Ω), which may increase signal integrity risk on controlled-impedance layouts.

Can CY7C1515JV18-300BZXC operate with only one clock domain?

Yes. When only K and C are used (with K and C tied to VSS or unused), the device operates in single-clock mode: K clocks all inputs and C clocks all outputs. In this configuration, Q[35:0] and CQ are referenced to K and C respectively, simplifying clock distribution at the cost of reduced skew compensation capability compared to dual-clock operation.

What is the purpose of BWS[3:0] in a 36-bit configuration?

BWS[3:0] enables selective byte-level writes to the 36-bit data bus: BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18], and BWS3 controls D[35:27]. Each active-low signal masks its corresponding 9-bit byte during write cycles, preserving unmasked bytes in memory-essential for partial updates in protocol header manipulation or metadata insertion.