Infineon Technologies CY7C1515KV18-300BZXI

Overview

CY7C1515KV18 from Cypress Semiconductor is a 2M × 36, 72-Mbit QDR® II SRAM with four-word burst architecture, 333 MHz clock support (666 MHz DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply. It features separate read/write ports, echo clocks (CQ/CQ), and PLL-based timing for high-bandwidth networking buffers in packet forwarding engines.

For engineers reviewing the CY7C1515KV18 datasheet, CY7C1515KV18 pinout, CY7C1515KV18 application, or CY7C1515KV18 equivalent, key selection criteria include its 2M × 36 organization, 165-ball FBGA package, DOFF-configurable 1.5-cycle vs. 1-cycle read latency, and HSTL-compatible 36-bit DDR I/O interface.

Technical Context

This QDR II SRAM implements fully independent synchronous read and write ports sharing a single multiplexed address bus, with address latching on alternate rising edges of K/K clocks. Its internal 512K × 36 memory array is organized across four sub-arrays to support depth expansion via RPS/WPS controls.

The device uses dual output clocks (C/C) and echo clocks (CQ/CQ) to compensate for board-level skew, while the integrated PLL ensures precise data placement at 666 MHz. Write operations are self-timed and synchronous, with byte write selects (BWS[3:0]) enabling granular 8-bit write masking without read-modify-write cycles.

Key Specifications

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with IDT72T3615L5 and IS61WV204836B, CY7C1515KV18 delivers 34% higher bandwidth (666 vs. 500 MT/s) and eliminates system-level timing calibration via integrated PLL and CQ/CQ, reducing design cycle time by ~3 weeks in high-speed router development.

Availability

CY7C1515KV18 is available at Aetrix Electronics and suitable for packet buffering in L3 switches, line card memory in core routers, and traffic manager subsystems requiring stable component supply across multi-year production programs.

Supply support for CY7C1515KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.

CY7C1515KV18 belongs to the QDR® II SRAM product line, engineered specifically for deterministic, high-bandwidth packet processing in carrier-grade networking equipment where concurrent access and sub-ns timing control are critical.

FAQ

What is the function of the DOFF pin on CY7C1515KV18?

The DOFF (Data Output OFF) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle latency for relaxed setup/hold timing at 333 MHz; when LOW, it selects 1-cycle latency for minimum delay. This setting directly affects the C/C clock-to-output timing and must be fixed at power-up based on system timing budget.

Can CY7C1515KV18 operate with only a single clock domain?

Yes - the device supports single-clock-mode operation where K/K drives both input and output registers. In this mode, C/C are tied to K/K, and Q[35:0] outputs are clocked by K/K instead of C/C. This simplifies clock tree design but sacrifices the skew-compensation benefit of dual-output clocks.

How does byte write select (BWS[3:0]) work in practice?

BWS[3:0] are active-low signals that mask corresponding 8-bit lanes of D[35:0] during write cycles. For example, asserting BWS0 LOW while holding BWS1–BWS3 HIGH writes only D[7:0], leaving D[35:8] unchanged. This enables atomic updates to specific fields in packet descriptors without external read-modify-write logic.

Is the 165-ball FBGA package of CY7C1515KV18 compatible with standard reflow profiles?

Yes - the package complies with IPC/JEDEC J-STD-020 moisture sensitivity level 3 and supports standard lead-free reflow profiles (peak 260°C). The 0.8 mm ball pitch and 13 × 15 mm body require 6 mil trace/space routing and controlled-impedance microstrip lines for DDR signal integrity at 666 MHz.