Infineon Technologies CY7C1515V18-167BZXI
- Part No.:
- CY7C1515V18-167BZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1515V18-167BZXI.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,193
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Product details
Overview
CY7C1515V18 from Cypress Semiconductor is a 72-Mbit QDR-II SRAM with 2M × 36 organization, 167 MHz maximum operating frequency, 1.8 V core supply (±0.1 V), and 1.4–1.8 V I/O supply (VDDQ). It implements separate read/write ports with DDR interfaces on both, 4-word burst architecture, and echo clocks (CQ/CQ) for high-speed data capture in networking and packet buffering systems.
For engineers reviewing the CY7C1515V18 datasheet, CY7C1515V18 pinout, CY7C1515V18 application, or CY7C1515V18 equivalent, key selection criteria include its x36 bus width, 165-ball FBGA package, synchronous self-timed writes, HSTL-compatible I/O, and JTAG 1149.1 test access support.
Technical Context
The CY7C1515V18 uses QDR-II architecture with fully independent read and write ports sharing a multiplexed 19-bit address bus (A[18:0]). Each port operates synchronously on rising edges of dedicated K/K input clocks, enabling concurrent transactions without bus turnaround.
Read data is clocked out via C/C output clocks with associated echo clocks CQ/CQ to compensate for flight-time skew; write data is latched on K/K edges. Internal DLL ensures precise data placement, and byte write selects (BWS[3:0]) enable granular 8-bit write control across the 36-bit data bus.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 configuration) |
| Max Clock Frequency | 167 MHz - defines maximum sustained transaction rate for both ports |
| Data Bus Width | 36-bit bidirectional I/O - supports high-throughput packet payload storage |
| Core Supply Voltage | 1.8 V ± 0.1 V - powers internal logic and array; requires tight regulation |
| I/O Supply Range | VDDQ = 1.4 V to 1.8 V - sets HSTL output drive strength and input threshold |
| Burst Length | 4 words - reduces address bus toggling frequency by 4× vs. single-word access |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - standard footprint for high-pin-count memory |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body height, RoHS-compliant Pb-free option available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data inputs | Latched on rising edge of K/K; full 36-bit parallel write path |
| Q[35:0] | Synchronous read data outputs | Driven on rising edge of C/C; tri-stated when RPS deasserted |
| A[18:0] | Multiplexed address inputs | Shared by read/write ports; 19 bits address 2M locations |
| RPS | Read port select (active LOW) | Enables read burst; output drivers tri-state on deassertion |
| WPS | Write port select (active LOW) | Initiates write burst; ignores D[35:0] when deasserted |
| BWS[3:0] | Byte write enables (active LOW) | Selects four independent 8-bit lanes; preserves unwritten bytes |
| K, K | Positive/negative input clocks | Control all synchronous inputs; rising edges latch addresses/data |
| C, C | Positive/negative output clocks | Source timing for Q[35:0]; used with CQ/CQ for deskewed capture |
| CQ, CQ | Echo clocks referenced to C/C | Free-running, phase-aligned copies for receiver-side clock-data alignment |
| ZQ | Output impedance calibration input | Connects to external resistor to ground to tune Q[35:0]/CQ/CQ drive strength |
| DOFF | DLL disable (active LOW) | Disables internal Delay Lock Loop; alters timing parameters significantly |
| TCK/TMS/TDI/TDO | JTAG 1149.1 interface | Supports boundary-scan testing and device programming |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Eliminates data bus turnaround delay and contention in full-duplex traffic buffers |
| Double Data Rate I/O | 600 MT/s effective bandwidth per port at 167 MHz clock (4-word burst × 2 edges/cycle) |
| On-chip DLL | Aligns internal data paths to minimize setup/hold violations at 167 MHz operation |
| HSTL Class I compatible I/O | Ensures signal integrity on high-speed backplanes with controlled-impedance routing |
| Variable drive strength | Configurable via ZQ pin to match PCB trace impedance (typically 50 Ω) |
| JTAG 1149.1 support | Enables production-level boundary-scan test coverage without custom test fixtures |
Applications
| Packet Buffering in Switch ASICs | Line Card Memory in Telecom Routers |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switching fabric. IC Role / Device Role / Timing Role: Dual-port SRAM acting as first-level buffer between ingress parser and egress scheduler, synchronized to line-rate clocks. Use Value: Concurrent read/write enables real-time packet reordering without arbitration latency; 36-bit width matches typical header+payload bus width. |
Use Scenario: Temporary storage of fragmented IP packets during classification and forwarding in carrier-grade routers. IC Role / Device Role / Timing Role: High-bandwidth memory co-located with network processor, interfacing via HSTL buses running at 167 MHz. Use Value: Echo clocks (CQ/CQ) simplify timing closure on long traces between NP and SRAM; DLL ensures stable data eye at full speed. |
| Baseband Processing in 4G/LTE BTS | Real-Time Video Frame Buffering |
|
Use Scenario: Holding channel estimation results and precoded symbols in MIMO baseband processing units. IC Role / Device Role / Timing Role: Low-latency, deterministic-access memory for symbol-level pipeline stages in FPGA-based PHY layers. Use Value: Synchronous self-timed writes guarantee write completion within fixed cycles; BWS[3:0] allows partial symbol updates without full-word overwrite. |
Use Scenario: Inter-frame buffering for 1080p60 video streams in broadcast encoders and professional video switchers. IC Role / Device Role / Timing Role: Dual-port frame store enabling simultaneous write of incoming frame and read of previous frame for motion compensation. Use Value: 72-Mbit capacity supports two full 1920×1080×24bpp frames; 4-word burst reduces address bus load in pixel-clock domain. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T36150L10PF | 36-bit QDR-II+, 250 MHz max, 1.5 V core, 1.5 V I/O; different pinout and timing model | Higher speed but incompatible voltage and package; requires board redesign | Choose only if system clock exceeds 167 MHz and power delivery supports 1.5 V core |
| ISSI IS61WV102436B | 1024K × 36 sync SRAM, single clock, 166 MHz, 3.3 V I/O; no DDR or echo clocks | Lacks concurrent read/write and high-speed timing aids; lower bandwidth density | Acceptable only for cost-sensitive, non-real-time buffering where latency tolerance > 10 ns |
Compared with IDT72T36150L10PF and IS61WV102436B, the CY7C1515V18 delivers optimal balance of proven 167 MHz QDR-II performance, HSTL compatibility, and mature ecosystem support for telecom infrastructure designs.
Availability
CY7C1515V18 is available at Aetrix Electronics and suitable for packet buffering in network switches, line card memory in telecom routers, baseband processing in LTE BTS, and real-time video frame buffering requiring stable component supply and long-term industrial availability.
Supply support for CY7C1515V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable solutions for industrial, automotive, and communications markets.
The QDR-II SRAM product line was designed specifically for high-bandwidth, low-latency buffering in networking and telecommunications equipment where deterministic dual-port access and DDR timing predictability are critical.
FAQ
What is the minimum VDDQ voltage supported for CY7C1515V18 operation?
The device specifies VDDQ = 1.4 V to 1.8 V. Operation below 1.4 V violates HSTL Class I input thresholds and output drive specifications; marginally functional behavior is not guaranteed. System designs must maintain VDDQ ≥ 1.4 V with ≤ ±3% ripple under all load conditions.
Can CY7C1515V18 operate without the DLL enabled?
Yes - asserting DOFF LOW disables the DLL, but timing parameters change significantly: tAC increases by up to 1.8 ns, and tHZ and tLZ widen. This mode is only recommended for validation or low-speed debug; production use requires DLL enabled for 167 MHz compliance.
How many address pins does CY7C1515V18 require, and what is their function?
CY7C1515V18 uses 19 address pins (A[18:0]) shared between read and write ports. These are latched on rising edges of K/K to select one of 2M memory locations; no separate read/write address buses are needed due to QDR-II multiplexing architecture.
Is CY7C1515V18 pin-compatible with other devices in the CY7C15xxV18 family?
No - while all share the same 165-ball FBGA package, pin assignments differ across x8/x9/x18/x36 variants. For example, BWS[3:0] occupy unique ball positions in CY7C1515V18 versus BWS[1:0] in CY7C1513V18; direct substitution requires PCB redesign.
CY7C1515V18-167BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1515V18-167BZXI FAQ
1.How can I place an order for CY7C1515V18-167BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1515V18-167BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1515V18-167BZXI reliable?
The price and inventory of CY7C1515V18-167BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1515V18-167BZXI is usually 5 days.
3.What payment methods are accepted for CY7C1515V18-167BZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1515V18-167BZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1515V18-167BZXI?
CY7C1515V18-167BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1515V18-167BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1515V18-167BZXI?
For technical support, including CY7C1515V18-167BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1515V18-167BZXI requirements.
6.How does Aetrix verify that CY7C1515V18-167BZXI is sourced from the original manufacturer or authorized distributors?
All CY7C1515V18-167BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1515V18-167BZXI meets industry standards.
7.What is the process for return or replacement of CY7C1515V18-167BZXI?
All CY7C1515V18-167BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1515V18-167BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1515V18-167BZXI part is unused and in its original packaging.
Return procedure for CY7C1515V18-167BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1515V18-167BZXI Tags

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