Infineon Technologies CY7C1518JV18-300BZC

Overview

CY7C1518JV18-300BZC from Cypress Semiconductor is a 72-Mbit synchronous pipelined DDR II SRAM organized as 4M × 18, operating at 300 MHz with 1.5-cycle read latency (DLL enabled), 1.8V core supply, HSTL I/O, and 165-ball FBGA (15 × 17 × 1.4 mm). It delivers 600 MT/s effective data rate via double-data-rate transfers synchronized to K/K and C/C clock pairs, and is used in high-bandwidth packet buffering for network switches and baseband processing in wireless infrastructure.

For engineers reviewing the CY7C1518JV18-300BZC datasheet, CY7C1518JV18-300BZC pinout, CY7C1518JV18-300BZC application, or CY7C1518JV18-300BZC equivalent, key selection criteria include DDR II burst timing compliance, DLL-enabled latency mode, HSTL-18 output drive matching, echo clock (CQ/CQ) synchronization capability, and 2-word burst address incrementing behavior.

Technical Context

The device implements a synchronous pipelined architecture with dual-clock domain separation: K/K clocks control all input registers (address, R/W, LD, BWS), while C/C clocks govern output register timing for Q[17:0] and echo clocks CQ/CQ. Burst logic uses A0 as LSB input to generate two sequential 18-bit words per access.

Internally, it features a Delay Lock Loop (DLL) that aligns CQ/CQ edges to C/C for precise data capture; when DOFF = LOW, DLL disables and operation reverts to DDR I mode with 1-cycle latency and ≤167 MHz max frequency. All data I/O shares DQ[17:0] pins with tristate control on deselection.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free finish (BZC suffix).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Compared with IS61WV102418BLL-150TQLI and R1EX24012AS0C-000B, CY7C1518JV18-300BZC uniquely combines 300 MHz operation, DLL-adjustable latency, and integrated CQ/CQ echo clocks - enabling plug-and-play timing closure in high-density DDR II memory subsystems without external compensation.

Availability

CY7C1518JV18-300BZC is available at Aetrix Electronics and suitable for network switching, wireless infrastructure, industrial imaging, and automated test equipment requiring stable component supply, long-lifecycle support, and guaranteed Pb-free FBGA sourcing.

Supply support for CY7C1518JV18-300BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets, with headquarters in San Jose, CA.

This device belongs to Cypress's DDR II synchronous SRAM product line, engineered specifically for deterministic-latency, high-bandwidth buffering in packet-switched and real-time signal processing systems where DDR I timing margins are insufficient.

FAQ

What is the function of the DOFF pin, and how does it affect timing?

The DOFF pin disables the internal Delay Lock Loop when pulled LOW. In this state, the device operates in DDR I mode with 1-cycle read latency and a maximum frequency of 167 MHz. When DOFF is HIGH (default), DLL is active and enables 1.5-cycle latency at full 300 MHz operation. The timing parameters differ significantly between modes - DDR I timing tables apply only when DOFF = LOW.

Can CY7C1518JV18-300BZC operate with only K/K clocks, without C/C?

Yes - the device supports single-clock mode. Tie C and C HIGH at power-on to configure the device to use K/K for both input registration and output timing. In this mode, Q[17:0] and CQ/CQ are driven on K/K edges, eliminating the need for separate output clocks. All timing parameters remain valid, but echo clock benefits and board-level deskew capability are lost.

How does ZQ calibration impact signal integrity?

ZQ calibration adjusts the output driver strength of DQ[17:0] and CQ/CQ pins to match the system data bus impedance. Connecting ZQ to a precision resistor (RQ) to ground sets output impedance to 0.2 × RQ. This minimizes reflections and ensures consistent edge rates across voltage and temperature - critical for maintaining eye opening at 600 MT/s. Leaving ZQ unconnected or tying it to GND violates specification and degrades timing margins.

Is the 165-ball FBGA package compatible with standard reflow profiles?

Yes - the BZC suffix denotes a RoHS-compliant, Pb-free 165-ball FBGA package qualified for standard lead-free reflow profiles (J-STD-020D). Peak temperature must not exceed 260°C, with time above liquidus (TAL) limited to 60–150 seconds. Board layout must follow Cypress's recommended pad geometry, solder mask clearance, and thermal relief guidelines to prevent voiding and mechanical stress on solder joints.