Infineon Technologies CY7C1518JV18-300BZXC

Overview

CY7C1518JV18-300BZXC from Cypress Semiconductor is a 72-Mbit (4M × 18) synchronous pipelined DDR II SRAM with 300 MHz clock operation, 1.5-cycle read latency (DLL enabled), HSTL I/O interface, and 165-ball FBGA (15 × 17 × 1.4 mm) package. It delivers 600 MT/s data throughput via double-data-rate transfers synchronized to K/K and C/C clocks, and supports burst-of-two reads/writes for high-bandwidth networking buffer applications.

For engineers reviewing the CY7C1518JV18-300BZXC datasheet, CY7C1518JV18-300BZXC pinout, CY7C1518JV18-300BZXC application, or CY7C1518JV18-300BZXC equivalent, key selection criteria include DDR II timing compliance, DLL-enabled latency mode, HSTL-18 drive capability, 1.8V core/VDDQ supply, and FBGA thermal/mechanical compatibility in multi-chip memory subsystems.

Technical Context

This SRAM implements a synchronous pipelined architecture with dual-clock domain control: K/K clocks register all inputs (address, R/W, LD, BWS), while C/C clocks govern output data timing and echo clock generation. The internal burst counter uses A0 to sequence two consecutive 18-bit words per access.

It integrates a Delay Lock Loop (DLL) for precise data-eye alignment at 300 MHz, enabling 1.5-cycle read latency; when DOFF is asserted low, it reverts to DDR I behavior with 1-cycle latency up to 167 MHz. Echo clocks CQ/CQ are phase-aligned to C/C and referenced to output data edges-critical for source-synchronous capture in high-speed SerDes or packet buffer designs.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, JEDEC MO-270AC compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Compared with IS61WV102418BLL-15BLI and R1EX24012AS0C-000A#, CY7C1518JV18-300BZXC uniquely combines DLL-controlled 1.5-cycle latency, HSTL-18 impedance programmability, and CQ/CQ echo clocks-enabling robust 300 MHz DDR II operation without external timing compensation or layout tuning.

Availability

CY7C1518JV18-300BZXC is available at Aetrix Electronics and suitable for 10G Ethernet switching, OTN line card design, LTE baseband processing, and broadcast video encoding requiring stable component supply, long-lifecycle assurance, and traceable sourcing.

Supply support for CY7C1518JV18-300BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems, with emphasis on signal integrity and timing precision.

The CY7C15xxJ series targets high-speed packet and frame buffering in telecom infrastructure, delivering DDR II SRAMs optimized for deterministic latency, source-synchronous timing, and HSTL bus compatibility.

FAQ

What is the function of the DOFF pin, and how does it affect timing?

The DOFF pin disables the internal Delay Lock Loop when pulled LOW. In this state, the device operates in DDR I mode with 1-cycle read latency and maximum frequency reduced to 167 MHz. When DOFF is HIGH, DLL is active, enabling 1.5-cycle latency and full 300 MHz operation. The timing parameters differ significantly between modes-designers must select AC timing tables accordingly.

Can CY7C1518JV18-300BZXC operate with only K/K clocks, without C/C?

Yes. When C and C are tied HIGH at power-on, the device enters single-clock mode: K/K clocks control both input registration and output timing. All timing parameters remain valid, and CQ/CQ echo clocks are generated relative to K/K instead of C/C. This mode eliminates need for separate output clock routing but forfeits flight-time deskew capability.

How is output impedance calibrated using the ZQ pin?

ZQ connects to an external 240 Ω resistor to ground. During power-up or ZQ calibration command, the device measures this reference and adjusts its HSTL output drivers to achieve 48 Ω (0.2 × 240 Ω) impedance. This ensures consistent signal integrity across VDDQ variations and temperature. ZQ must never be left floating or tied to GND.

Is the 165-ball FBGA package compatible with standard reflow profiles?

Yes. The CY7C1518JV18-300BZXC FBGA adheres to IPC/JEDEC J-STD-020D moisture sensitivity level 3 and supports standard lead-free reflow profiles (peak 260°C). Its 0.8 mm ball pitch and 1.4 mm height allow placement with standard SMT equipment; recommended stencil aperture is 0.35 mm round with 50% area reduction for optimal solder paste release.