Infineon Technologies CY7C1518KV18-333BZI
- Part No.:
- CY7C1518KV18-333BZI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1518KV18-333BZI.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1518KV18-333BZI from Cypress Semiconductor is a 72-Mbit (4M × 18) DDR-II synchronous pipelined SRAM with two-word burst architecture, 333 MHz clock frequency, 1.8 V core supply, HSTL I/O, and 165-ball FBGA (13 × 15 × 1.4 mm) package. It delivers 666 MT/s data transfer via double data rate interface and supports configurable 1.5-cycle or 1-cycle read latency via DOFF pin for high-bandwidth buffering in network packet processors.
For engineers reviewing the CY7C1518KV18-333BZI datasheet, CY7C1518KV18-333BZI pinout, CY7C1518KV18-333BZI application, or CY7C1518KV18-333BZI equivalent, key selection factors include DDR-II timing compliance, echo clock (CQ/CQ) synchronization capability, burst-addressed 18-bit dual-word access, and JTAG 1149.1 test port integration for system-level validation.
Technical Context
The device implements a synchronous pipelined architecture with independent K/K input clocks for address/data capture and C/C output clocks for data launch, enabling precise DDR timing control. Its internal burst counter uses A0 to generate sequential 18-bit word addresses, supporting two-word bursts without external address incrementing.
Read latency is programmable: 1.5 cycles when DOFF = HIGH (DDR-II mode), or 1 cycle when DOFF = LOW (DDR-I compatibility mode). All synchronous inputs pass through edge-triggered registers clocked by K/K, while outputs are registered to C/C (or K/K in single-clock mode), ensuring deterministic setup/hold margins at 333 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 72 Mbit (4M × 18 organization), enabling large on-chip buffering for multi-gigabit packet processing. |
| Max Clock Frequency | 333 MHz - defines maximum sustained command rate; enables 666 MT/s effective throughput via DDR. |
| Read Latency | 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - directly impacts pipeline depth and controller timing budget. |
| I/O Voltage | 1.8 V core with HSTL-compatible I/O (1.4–1.8 V adjustable drive), matching FPGA/ASIC memory interfaces. |
| Burst Mode | Two-word linear burst - reduces address bus toggling by 50% versus single-word access, lowering EMI and routing complexity. |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - provides high pin count in compact footprint suitable for dense PCB layouts. |
| JTAG Support | IEEE 1149.1 compliant TAP - enables boundary scan testing and in-system debug without additional probe points. |
Pinout & Package
Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[17:0] | Synchronous bidirectional data bus | Shares physical pins for read output and write input; driven on rising edges of C/C (or K/K); tristated automatically on deselect. |
| K / K | Positive/negative input clocks | Capture all synchronous inputs (address, R/W, LD, BWS); define command initiation edge and write data sampling timing. |
| C / C | Positive/negative output data clocks | Control timing of DQ[17:0] read data launch; used with CQ/CQ to deskew flight time across multiple devices. |
| CQ / CQ | Echo clocks referenced to C/C | Free-running, phase-aligned copies of C/C; simplify receiver-side data capture by eliminating board trace skew compensation. |
| DOFF | Read latency mode select | Configures DDR-II (1.5-cycle latency, DOFF = HIGH) or DDR-I compatible (1-cycle latency, DOFF = LOW) operation. |
| ZQ | Output impedance calibration input | Connects to external resistor to ground to tune DQ/CQ output driver impedance to 0.2 × RQ; ensures signal integrity on 50 Ω buses. |
Key Features
| Feature | Design Value |
|---|---|
| Two-word burst architecture | Reduces required address transitions by half per data transfer, cutting address bus bandwidth demand and simplifying controller logic. |
| Programmable read latency (1 or 1.5 cycles) | Enables seamless migration between DDR-I and DDR-II systems while maintaining timing closure across generations. |
| Integrated echo clocks (CQ/CQ) | Eliminates need for per-device delay tuning in multi-SRAM systems; enables deterministic data capture at 666 MT/s. |
| Variable-drive HSTL outputs | Adjustable drive strength via ZQ calibration ensures optimal signal integrity across varying trace lengths and loading conditions. |
| JTAG 1149.1 test access port | Supports automated boundary scan testing and in-circuit debugging without requiring dedicated test fixtures or probes. |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with line-rate throughput. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer interfacing directly to MAC or switch fabric ASIC via DDR-II bus. Use Value: Two-word burst and echo clocks enable deterministic 666 MT/s reads/writes, minimizing packet jitter and head-of-line blocking. |
Use Scenario: Frame buffering in 10G/40G optical transport equipment requiring ECC-free, fast-access memory with tight timing control. IC Role / Device Role / Timing Role: Synchronous SRAM acting as frame store between SerDes and DSP, clocked by recovered line clock derivatives. Use Value: Programmable 1-cycle/1.5-cycle latency allows alignment with diverse PHY timing budgets without redesigning controller logic. |
| Test Equipment Pattern Memory | High-Speed Data Acquisition Buffer |
|
Use Scenario: Storing stimulus/response patterns in automated test equipment (ATE) for semiconductor wafer probing. IC Role / Device Role / Timing Role: Burst-accessed memory mapped to pattern generator sequencer, synchronized to system test clock. Use Value: 333 MHz clock + DDR interface delivers sustained 1.33 GB/s bandwidth, supporting >1 Gbps vector rates with minimal latency overhead. |
Use Scenario: Capturing transient analog waveforms from high-speed ADCs (≥1 GSPS) before post-processing in FPGA. IC Role / Device Role / Timing Role: Real-time circular buffer accepting parallel digital samples via burst writes, with echo-clock-synchronized reads for analysis. Use Value: CQ/CQ echo clocks eliminate inter-lane skew, enabling accurate time-aligned reconstruction of multi-channel sampled data. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR-II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C35128PFS-333BIN | 512-Mbit density (32M × 18), 333 MHz, but uses SSTL-18 I/O and lacks echo clocks (CQ/CQ) and DOFF latency control. | Higher density but no built-in deskew support; requires external clock forwarding and tighter layout control for >500 MT/s operation. | Select when raw capacity outweighs timing simplicity; avoid if echo clock-based capture is required for system scalability. |
| IS61WV102418BLL-333BLI | 18-Mbit (512K × 36), 333 MHz, asynchronous burst mode only; no DDR interface, no K/K or C/C clocks, no JTAG. | Lower bandwidth (single-data-rate), simpler interface, but incompatible with DDR-II timing protocols and burst addressing. | Choose only for cost-sensitive, lower-throughput designs where DDR-II features are unnecessary and controller resources are constrained. |
Compared with AS7C35128PFS-333BIN and IS61WV102418BLL-333BLI, CY7C1518KV18-333BZI uniquely combines DDR-II timing, echo clock synchronization, and programmable latency in a 72-Mbit density-enabling robust, scalable high-speed buffering without external deskew circuitry or controller-level timing compensation.
Availability
CY7C1518KV18-333BZI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, test equipment pattern storage, and high-speed data acquisition requiring stable component supply and long-term industrial availability.
Supply support for CY7C1518KV18-333BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, with expertise in SRAM, Flash, PSoC, and USB controllers.
CY7C1518KV18 belongs to Cypress's DDR-II synchronous SRAM product line, engineered specifically for applications demanding deterministic low-latency, high-throughput memory access in networking, test, and instrumentation systems.
FAQ
What is the function of the DOFF pin on CY7C1518KV18-333BZI?
The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables DDR-II operation with 1.5-cycle latency; when LOW, it reverts to DDR-I–compatible 1-cycle latency. This pin directly controls internal timing paths and must be set during power-up initialization to match the host controller's expected timing model.
Can CY7C1518KV18-333BZI operate without external C and C clocks?
Yes - the device supports single-clock mode using only K and K for both input capture and output launch. In this mode, C and C are unused, and CQ/CQ are generated relative to K/K. However, echo clock functionality and optimal deskew performance require C/C connection, so single-clock mode trades timing margin for reduced clock routing complexity.
How does ZQ calibration affect signal integrity?
ZQ calibration adjusts the output driver impedance of DQ[17:0] and CQ/CQ pins to match the system data bus (typically 50 Ω). By connecting an external resistor RQ from ZQ to ground, the device sets output impedance to 0.2 × RQ - e.g., 250 Ω resistor yields 50 Ω drive strength - reducing reflections and improving eye diagram margins at 666 MT/s.
Is CY7C1518KV18-333BZI pin-compatible with CY7C1520KV18-333BZI?
No - although both use the same 165-ball FBGA package, their pinouts differ significantly: CY7C1518KV18 has DQ[17:0], BWS[1:0], and 22 address lines (A[21:0]), while CY7C1520KV18 has DQ[35:0], BWS[3:0], and 21 address lines (A[20:0]). Direct substitution requires PCB redesign and firmware adaptation due to data width and control signal mismatches.
CY7C1518KV18-333BZI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 333 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1518KV18-333BZI FAQ
1.How can I place an order for CY7C1518KV18-333BZI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1518KV18-333BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1518KV18-333BZI reliable?
The price and inventory of CY7C1518KV18-333BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1518KV18-333BZI is usually 5 days.
3.What payment methods are accepted for CY7C1518KV18-333BZI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1518KV18-333BZI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1518KV18-333BZI?
CY7C1518KV18-333BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1518KV18-333BZI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1518KV18-333BZI?
For technical support, including CY7C1518KV18-333BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1518KV18-333BZI requirements.
6.How does Aetrix verify that CY7C1518KV18-333BZI is sourced from the original manufacturer or authorized distributors?
All CY7C1518KV18-333BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1518KV18-333BZI meets industry standards.
7.What is the process for return or replacement of CY7C1518KV18-333BZI?
All CY7C1518KV18-333BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1518KV18-333BZI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1518KV18-333BZI part is unused and in its original packaging.
Return procedure for CY7C1518KV18-333BZI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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