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Infineon Technologies CY7C1518KV18-333BZI

Part No.:
CY7C1518KV18-333BZI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1518KV18-333BZI.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,678

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Product details

Overview

CY7C1518KV18-333BZI from Cypress Semiconductor is a 72-Mbit (4M × 18) DDR-II synchronous pipelined SRAM with two-word burst architecture, 333 MHz clock frequency, 1.8 V core supply, HSTL I/O, and 165-ball FBGA (13 × 15 × 1.4 mm) package. It delivers 666 MT/s data transfer via double data rate interface and supports configurable 1.5-cycle or 1-cycle read latency via DOFF pin for high-bandwidth buffering in network packet processors.

For engineers reviewing the CY7C1518KV18-333BZI datasheet, CY7C1518KV18-333BZI pinout, CY7C1518KV18-333BZI application, or CY7C1518KV18-333BZI equivalent, key selection factors include DDR-II timing compliance, echo clock (CQ/CQ) synchronization capability, burst-addressed 18-bit dual-word access, and JTAG 1149.1 test port integration for system-level validation.

Technical Context

The device implements a synchronous pipelined architecture with independent K/K input clocks for address/data capture and C/C output clocks for data launch, enabling precise DDR timing control. Its internal burst counter uses A0 to generate sequential 18-bit word addresses, supporting two-word bursts without external address incrementing.

Read latency is programmable: 1.5 cycles when DOFF = HIGH (DDR-II mode), or 1 cycle when DOFF = LOW (DDR-I compatibility mode). All synchronous inputs pass through edge-triggered registers clocked by K/K, while outputs are registered to C/C (or K/K in single-clock mode), ensuring deterministic setup/hold margins at 333 MHz.

Key Specifications

Parameter Value and Actual Design Meaning
Density 72 Mbit (4M × 18 organization), enabling large on-chip buffering for multi-gigabit packet processing.
Max Clock Frequency 333 MHz - defines maximum sustained command rate; enables 666 MT/s effective throughput via DDR.
Read Latency 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - directly impacts pipeline depth and controller timing budget.
I/O Voltage 1.8 V core with HSTL-compatible I/O (1.4–1.8 V adjustable drive), matching FPGA/ASIC memory interfaces.
Burst Mode Two-word linear burst - reduces address bus toggling by 50% versus single-word access, lowering EMI and routing complexity.
Package 165-ball FBGA (13 × 15 × 1.4 mm) - provides high pin count in compact footprint suitable for dense PCB layouts.
JTAG Support IEEE 1149.1 compliant TAP - enables boundary scan testing and in-system debug without additional probe points.

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
DQ[17:0] Synchronous bidirectional data bus Shares physical pins for read output and write input; driven on rising edges of C/C (or K/K); tristated automatically on deselect.
K / K Positive/negative input clocks Capture all synchronous inputs (address, R/W, LD, BWS); define command initiation edge and write data sampling timing.
C / C Positive/negative output data clocks Control timing of DQ[17:0] read data launch; used with CQ/CQ to deskew flight time across multiple devices.
CQ / CQ Echo clocks referenced to C/C Free-running, phase-aligned copies of C/C; simplify receiver-side data capture by eliminating board trace skew compensation.
DOFF Read latency mode select Configures DDR-II (1.5-cycle latency, DOFF = HIGH) or DDR-I compatible (1-cycle latency, DOFF = LOW) operation.
ZQ Output impedance calibration input Connects to external resistor to ground to tune DQ/CQ output driver impedance to 0.2 × RQ; ensures signal integrity on 50 Ω buses.

Key Features

Feature Design Value
Two-word burst architecture Reduces required address transitions by half per data transfer, cutting address bus bandwidth demand and simplifying controller logic.
Programmable read latency (1 or 1.5 cycles) Enables seamless migration between DDR-I and DDR-II systems while maintaining timing closure across generations.
Integrated echo clocks (CQ/CQ) Eliminates need for per-device delay tuning in multi-SRAM systems; enables deterministic data capture at 666 MT/s.
Variable-drive HSTL outputs Adjustable drive strength via ZQ calibration ensures optimal signal integrity across varying trace lengths and loading conditions.
JTAG 1149.1 test access port Supports automated boundary scan testing and in-circuit debugging without requiring dedicated test fixtures or probes.

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with line-rate throughput.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer interfacing directly to MAC or switch fabric ASIC via DDR-II bus.

Use Value: Two-word burst and echo clocks enable deterministic 666 MT/s reads/writes, minimizing packet jitter and head-of-line blocking.

Use Scenario: Frame buffering in 10G/40G optical transport equipment requiring ECC-free, fast-access memory with tight timing control.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as frame store between SerDes and DSP, clocked by recovered line clock derivatives.

Use Value: Programmable 1-cycle/1.5-cycle latency allows alignment with diverse PHY timing budgets without redesigning controller logic.

Test Equipment Pattern Memory High-Speed Data Acquisition Buffer

Use Scenario: Storing stimulus/response patterns in automated test equipment (ATE) for semiconductor wafer probing.

IC Role / Device Role / Timing Role: Burst-accessed memory mapped to pattern generator sequencer, synchronized to system test clock.

Use Value: 333 MHz clock + DDR interface delivers sustained 1.33 GB/s bandwidth, supporting >1 Gbps vector rates with minimal latency overhead.

Use Scenario: Capturing transient analog waveforms from high-speed ADCs (≥1 GSPS) before post-processing in FPGA.

IC Role / Device Role / Timing Role: Real-time circular buffer accepting parallel digital samples via burst writes, with echo-clock-synchronized reads for analysis.

Use Value: CQ/CQ echo clocks eliminate inter-lane skew, enabling accurate time-aligned reconstruction of multi-channel sampled data.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR-II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C35128PFS-333BIN 512-Mbit density (32M × 18), 333 MHz, but uses SSTL-18 I/O and lacks echo clocks (CQ/CQ) and DOFF latency control. Higher density but no built-in deskew support; requires external clock forwarding and tighter layout control for >500 MT/s operation. Select when raw capacity outweighs timing simplicity; avoid if echo clock-based capture is required for system scalability.
IS61WV102418BLL-333BLI 18-Mbit (512K × 36), 333 MHz, asynchronous burst mode only; no DDR interface, no K/K or C/C clocks, no JTAG. Lower bandwidth (single-data-rate), simpler interface, but incompatible with DDR-II timing protocols and burst addressing. Choose only for cost-sensitive, lower-throughput designs where DDR-II features are unnecessary and controller resources are constrained.

Compared with AS7C35128PFS-333BIN and IS61WV102418BLL-333BLI, CY7C1518KV18-333BZI uniquely combines DDR-II timing, echo clock synchronization, and programmable latency in a 72-Mbit density-enabling robust, scalable high-speed buffering without external deskew circuitry or controller-level timing compensation.

Availability

CY7C1518KV18-333BZI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, test equipment pattern storage, and high-speed data acquisition requiring stable component supply and long-term industrial availability.

Supply support for CY7C1518KV18-333BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, with expertise in SRAM, Flash, PSoC, and USB controllers.

CY7C1518KV18 belongs to Cypress's DDR-II synchronous SRAM product line, engineered specifically for applications demanding deterministic low-latency, high-throughput memory access in networking, test, and instrumentation systems.

FAQ

What is the function of the DOFF pin on CY7C1518KV18-333BZI?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables DDR-II operation with 1.5-cycle latency; when LOW, it reverts to DDR-I–compatible 1-cycle latency. This pin directly controls internal timing paths and must be set during power-up initialization to match the host controller's expected timing model.

Can CY7C1518KV18-333BZI operate without external C and C clocks?

Yes - the device supports single-clock mode using only K and K for both input capture and output launch. In this mode, C and C are unused, and CQ/CQ are generated relative to K/K. However, echo clock functionality and optimal deskew performance require C/C connection, so single-clock mode trades timing margin for reduced clock routing complexity.

How does ZQ calibration affect signal integrity?

ZQ calibration adjusts the output driver impedance of DQ[17:0] and CQ/CQ pins to match the system data bus (typically 50 Ω). By connecting an external resistor RQ from ZQ to ground, the device sets output impedance to 0.2 × RQ - e.g., 250 Ω resistor yields 50 Ω drive strength - reducing reflections and improving eye diagram margins at 666 MT/s.

Is CY7C1518KV18-333BZI pin-compatible with CY7C1520KV18-333BZI?

No - although both use the same 165-ball FBGA package, their pinouts differ significantly: CY7C1518KV18 has DQ[17:0], BWS[1:0], and 22 address lines (A[21:0]), while CY7C1520KV18 has DQ[35:0], BWS[3:0], and 21 address lines (A[20:0]). Direct substitution requires PCB redesign and firmware adaptation due to data width and control signal mismatches.

CY7C1518KV18-333BZI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
333 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1518KV18-333BZI FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1518KV18-333BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1518KV18-333BZI reliable?

The price and inventory of CY7C1518KV18-333BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1518KV18-333BZI is usually 5 days.

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CY7C1518KV18-333BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1518KV18-333BZI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1518KV18-333BZI?

For technical support, including CY7C1518KV18-333BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1518KV18-333BZI requirements.

6.How does Aetrix verify that CY7C1518KV18-333BZI is sourced from the original manufacturer or authorized distributors?

All CY7C1518KV18-333BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1518KV18-333BZI meets industry standards.

7.What is the process for return or replacement of CY7C1518KV18-333BZI?

All CY7C1518KV18-333BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1518KV18-333BZI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1518KV18-333BZI part is unused and in its original packaging.

Return procedure for CY7C1518KV18-333BZI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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