Infineon Technologies CY7C1518KV18-333BZXC

Overview

CY7C1518KV18-333BZXC from Cypress Semiconductor is a 72-Mbit (4M × 18) synchronous DDR-II SRAM with two-word burst architecture, 333 MHz clock frequency, double-data-rate interface delivering 666 MT/s effective throughput, and 1.8 V core supply with HSTL I/O. It operates in pipelined read mode with 1.5-cycle latency when DOFF = HIGH and 1-cycle latency when DOFF = LOW, targeting high-bandwidth buffering in network packet processors and telecom line cards.

For engineers reviewing the CY7C1518KV18-333BZXC datasheet, CY7C1518KV18-333BZXC pinout, CY7C1518KV18-333BZXC application, or CY7C1518KV18-333BZXC equivalent, key selection criteria include DDR-II timing compliance, echo clock (CQ/CQ) support for source-synchronous data capture, dual-K/K input clocking for precise write strobing, and FBGA-165 package compatibility with high-density PCB layouts.

Technical Context

The device implements a synchronous pipelined architecture where all address, control, and data inputs are registered on rising edges of complementary K/K clocks. Read data is driven synchronously on C/C output clocks (or K/K in single-clock mode), with echo clocks CQ/CQ phase-aligned to C/C to enable controller-side deskewing.

Burst addressing is controlled by A0 feeding a 1-bit counter that generates sequential 18-bit word addresses per access. Write operations use on-chip self-timed logic, while byte write select signals BWS0/BWS1 allow independent 9-bit byte updates without disturbing adjacent data - critical for partial-word packet header modifications.

Key Specifications

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, with 0.8 mm ball pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR-II SRAM applications.

Compared with AS7C3256A-15JIN and IS61WV102418BLL-10BLI, CY7C1518KV18-333BZXC delivers 6.6× higher effective bandwidth via DDR-II and eliminates board-level clock deskew complexity through integrated echo clocks - critical for systems requiring deterministic sub-ns timing alignment.

Availability

CY7C1518KV18-333BZXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, FPGA-based protocol accelerators, and high-speed test equipment requiring stable component supply and long-term industrial availability.

Supply support for CY7C1518KV18-333BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable system-on-chip solutions for industrial, automotive, and communications markets.

CY7C1518KV18 belongs to Cypress's DDR-II synchronous SRAM product line, engineered specifically for high-throughput, low-latency buffering in packet-switched infrastructure where deterministic timing and signal integrity at >500 MT/s are mandatory.

FAQ

What is the function of the DOFF pin on CY7C1518KV18-333BZXC?

The DOFF (Data Output OFF) pin selects read latency mode: when asserted HIGH, it enables DDR-II operation with 1.5-cycle latency for improved timing margin; when LOW, it reverts to DDR-I–compatible 1-cycle latency. This setting is sampled synchronously on the rising edge of K and remains active until changed, directly impacting controller pipeline configuration.

Can CY7C1518KV18-333BZXC operate without external C and C clocks?

Yes - the device supports single-clock mode using only K and K for both input registration and output timing. In this mode, read data is driven on K/K rising edges, and CQ/CQ are generated relative to K/K instead of C/C. However, echo-clock deskew capability is lost, limiting maximum reliable trace length and system scalability.

How does ZQ calibration affect signal integrity in CY7C1518KV18-333BZXC?

ZQ calibration adjusts the output driver strength of DQ, CQ, and CQ pins to match a 240 Ω external resistor, resulting in ~50 Ω effective output impedance. This minimizes reflections on 50 Ω PCB traces, reducing eye diagram degradation and enabling stable 666 MT/s operation across temperature and voltage variations without external termination.

Is CY7C1518KV18-333BZXC pin-compatible with CY7C1520KV18-333BZXC?

No - although both share the same 165-ball FBGA package footprint, their pinouts differ significantly. CY7C1518KV18 uses DQ[17:0], BWS0/BWS1, and 22 address lines (A[21:0]), while CY7C1520KV18 uses DQ[35:0], BWS0–BWS3, and 21 address lines (A[20:0]). Interchange requires PCB redesign and firmware adaptation.