Infineon Technologies CY7C1520KV18-200BZC
- Part No.:
- CY7C1520KV18-200BZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1520KV18-200BZC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1520KV18-200BZC from Cypress Semiconductor is a 72-Mbit synchronous DDR-II SRAM configured as 2M × 36, operating at 333 MHz with double-data-rate interface delivering 666 MT/s effective bandwidth. It uses two-word burst architecture, dual input clocks (K/K) and dual output clocks (C/C), and supports 1.8 V core with HSTL I/O compatible with 1.5 V or 1.8 V VDDQ. It is deployed in high-speed packet buffering for network switches and telecom line cards.
For engineers reviewing the CY7C1520KV18-200BZC datasheet, CY7C1520KV18-200BZC pinout, CY7C1520KV18-200BZC application, or CY7C1520KV18-200BZC equivalent, key selection criteria include DDR-II burst timing, echo clock (CQ/CQ) synchronization capability, DOFF-configurable read latency (1 or 1.5 cycles), HSTL drive strength programmability, and 165-ball FBGA mechanical compatibility.
Technical Context
The device implements a pipelined synchronous architecture with internal burst counter driven by A0, latching addresses on alternating rising edges of K and K. Read data is registered and driven on rising edges of C and C (or K/K in single-clock mode), tightly aligned to echo clocks CQ/CQ for deterministic capture at the controller.
It integrates a PLL for precise data placement, JTAG 1149.1 boundary scan for testability, and ZQ-calibrated output impedance matching. Write operations are self-timed internally, and byte write select (BWS[3:0]) enables granular 9-bit byte masking without disturbing adjacent data.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density & Organization | 72 Mbit / 2M × 36 - provides 72 Mbits of fast, low-latency buffer memory with 36-bit wide data path. |
| Max Clock Frequency | 333 MHz - defines maximum system clock rate; enables 666 MT/s DDR throughput. |
| Read Latency | 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) - selectable timing mode affects controller pipeline depth and setup margin. |
| Core Supply | 1.8 V ± 0.1 V - fixed core voltage; decoupling must meet SRAM transient current demands. |
| I/O Voltage Range | VDDQ = 1.4 V to 1.8 V - supports interoperability with both 1.5 V and 1.8 V HSTL systems. |
| Package | 165-ball FBGA (13 mm × 15 mm × 1.4 mm) - fine-pitch BGA optimized for high-density routing and signal integrity. |
| Operating Temperature | 0 °C to +70 °C - commercial-grade thermal range suitable for indoor networking equipment. |
Pinout & Package
Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[35:0] | Synchronous bidirectional data bus | 36-bit DDR data path; inputs sampled on K/K rising edges, outputs driven on C/C rising edges with echo-clock alignment. |
| K, K | Dual-phase input clock pair | Used for address/control/data capture; enables precise DDR timing control and reduced skew sensitivity. |
| C, C | Dual-phase output clock pair | Drive read data; allows flight-time deskewing across multiple SRAMs in parallel configurations. |
| CQ, CQ | Output echo clocks | Free-running, phase-aligned copies of C/C; simplify source-synchronous data capture at controller without delay-locked loops. |
| BWS[3:0] | Byte write select (active-low) | Four independent 9-bit masks; enables partial writes without read-modify-write overhead in packet processing buffers. |
| DOFF | Read latency mode control | LOW = DDR-I mode (1-cycle latency); HIGH = DDR-II mode (1.5-cycle latency); sets internal pipeline behavior. |
| ZQ | Impedance calibration reference | Connects to external 240 Ω resistor to ground; calibrates DQ/CQ output driver impedance to 48 Ω ±10%. |
Key Features
| Feature | Design Value |
|---|---|
| Two-word burst architecture | Reduces external address bus toggling frequency by 50%, lowering EMI and simplifying controller address generation logic. |
| Programmable output drive strength | HSTL drivers support variable slew rate and termination via ZQ calibration-enables robust signal integrity across varied PCB trace lengths. |
| Integrated echo clocks (CQ/CQ) | Eliminates need for controller-side delay tuning; enables reliable >333 MHz DDR operation without per-device timing compensation. |
| JTAG 1149.1 boundary scan | Supports IEEE-compliant structural testing and interconnect verification in dense, multi-SRAM systems without physical probe access. |
| DOFF-selectable read latency | Allows runtime optimization: 1-cycle mode for minimal latency in real-time buffers; 1.5-cycle mode for improved timing margin in high-noise environments. |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before forwarding decisions. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared buffer SRAM interfacing directly to switch fabric controller via DDR-II bus. Use Value: 666 MT/s throughput and burst-2 access minimize frame queuing delay; echo clocks ensure deterministic data capture across 16+ parallel devices. |
Use Scenario: Holding ATM cell payloads and control headers in OC-192/STM-64 line interface modules. IC Role / Device Role / Timing Role: Synchronous burst SRAM acting as elastic store between framer and traffic manager ASICs. Use Value: 1.5-cycle latency mode (DOFF = HIGH) improves timing closure under temperature variation; 36-bit width matches cell payload alignment. |
| Baseband Processing Buffer | Radar Signal Processing FIFO |
|
Use Scenario: Temporary storage of decoded LTE/5G baseband symbols during channel estimation and equalization. IC Role / Device Role / Timing Role: DDR-II SRAM used as ping-pong buffer between DSP cores and RF front-end interfaces. Use Value: Byte write select (BWS[3:0]) enables symbol-level updates without full-word overwrites; ZQ calibration maintains signal fidelity at 1.5 V I/O. |
Use Scenario: Capturing and staging digitized radar return samples prior to FFT computation in phased-array systems. IC Role / Device Role / Timing Role: High-reliability burst SRAM serving as first-stage acquisition FIFO synchronized to ADC sampling clock. Use Value: 333 MHz clock tolerance and PLL-based data placement ensure sub-nanosecond jitter alignment critical for coherent beamforming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C3256B-20TIN | Asynchronous 256K × 16 SRAM; no DDR, no burst, no echo clocks; 20 ns access time. | Lower bandwidth, simpler interface; suited for microcontroller-based control buffers-not for high-speed packet flow. | Select only if system clock ≤ 50 MHz and DDR timing complexity must be avoided. |
| IS61WV102432BLL-15BLI | Synchronous 1M × 32 QDR SRAM; 150 MHz, quad data rate; separate read/write ports; no DOFF latency control. | Higher concurrency (simultaneous R/W), but lower peak bandwidth (600 MT/s vs 666 MT/s); requires QDR controller IP. | Prefer when true simultaneous read/write is required and controller supports QDR protocol. |
Compared with AS7C3256B-20TIN and IS61WV102432BLL-15BLI, CY7C1520KV18-200BZC uniquely delivers DDR-II burst efficiency with echo-clock–assisted timing closure at 333 MHz-critical for scalable, multi-device packet buffering where deterministic latency and board-level skew management are mandatory.
Availability
CY7C1520KV18-200BZC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and baseband processing requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant FBGA packaging.
Supply support for CY7C1520KV18-200BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems, with emphasis on signal integrity and timing precision.
CY7C1520KV18 belongs to Cypress's DDR-II synchronous SRAM product line, engineered specifically for deterministic, high-throughput buffering in packet-switched infrastructure where echo-clock–synchronized data capture eliminates controller-side timing uncertainty.
FAQ
What is the function of the DOFF pin on CY7C1520KV18-200BZC?
The DOFF pin selects read latency mode: when asserted LOW, the device operates in DDR-I mode with 1-cycle read latency; when HIGH, it enters DDR-II mode with 1.5-cycle latency. This setting determines internal pipeline depth and affects controller timing budget allocation-no external configuration register is required.
Can CY7C1520KV18-200BZC operate with only K and K clocks, without C and C?
Yes. In single-clock mode, read data is driven on the rising edges of K and K instead of C and C. The device still generates CQ and CQ referenced to K/K, preserving echo-clock functionality for source-synchronous capture-no external C/C clock sources are needed for basic operation.
How does ZQ calibration affect signal integrity on CY7C1520KV18-200BZC?
ZQ calibration adjusts DQ and CQ output driver impedance to match the system data bus (typically 48–50 Ω). Using a 240 Ω resistor from ZQ to ground sets nominal output impedance to 48 Ω ±10%, reducing reflections and improving eye diagram margins-especially critical at 666 MT/s DDR rates.
Is CY7C1520KV18-200BZC pin-compatible with CY7C1518KV18-200BZC?
No. Although both use the same 165-ball FBGA package, pin assignments differ significantly: CY7C1518KV18 has DQ[17:0], BWS[1:0], and 22 address lines (A[21:0]), while CY7C1520KV18 uses DQ[35:0], BWS[3:0], and 21 address lines (A[20:0]). Direct substitution requires PCB redesign.
CY7C1520KV18-200BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1520KV18-200BZC FAQ
1.How can I place an order for CY7C1520KV18-200BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1520KV18-200BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1520KV18-200BZC reliable?
The price and inventory of CY7C1520KV18-200BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1520KV18-200BZC is usually 5 days.
3.What payment methods are accepted for CY7C1520KV18-200BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1520KV18-200BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1520KV18-200BZC?
CY7C1520KV18-200BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1520KV18-200BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1520KV18-200BZC?
For technical support, including CY7C1520KV18-200BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1520KV18-200BZC requirements.
6.How does Aetrix verify that CY7C1520KV18-200BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1520KV18-200BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1520KV18-200BZC meets industry standards.
7.What is the process for return or replacement of CY7C1520KV18-200BZC?
All CY7C1520KV18-200BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1520KV18-200BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1520KV18-200BZC part is unused and in its original packaging.
Return procedure for CY7C1520KV18-200BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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