Infineon Technologies CY7C1520KV18-250BZCT
- Part No.:
- CY7C1520KV18-250BZCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1520KV18-250BZCT.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1520KV18-250BZCT from Cypress Semiconductor is a 72-Mbit synchronous DDR-II SRAM configured as 2M × 36, operating at 250 MHz (4 ns clock period), with double-data-rate I/O delivering 500 MT/s effective throughput, 1.8 V core supply, and HSTL-compatible 1.4–1.8 V I/O voltage range. It implements two-word burst reads/writes synchronized to dual K/K input clocks and dual C/C output clocks, and is used in high-bandwidth packet buffering and network switch data planes.
For engineers reviewing the CY7C1520KV18-250BZCT datasheet, CY7C1520KV18-250BZCT pinout, CY7C1520KV18-250BZCT application, or CY7C1520KV18-250BZCT equivalent, key selection criteria include DDR-II burst timing, echo clock (CQ/CQ) support for source-synchronous capture, DOFF-configurable 1-cycle vs. 1.5-cycle read latency, and 165-ball FBGA (13 × 15 × 1.4 mm) mechanical compatibility.
Technical Context
This device integrates a pipelined SRAM core with synchronous peripheral logic including a 1-bit burst counter, phase-locked loop (PLL) for precise data placement, and JTAG 1149.1 test access port. Address latching occurs on alternate rising edges of K/K, while write data is registered on both K and K edges.
Read data is driven on rising edges of C/C (or K/K in single-clock mode), tightly aligned to echo clocks CQ/CQ for system-level timing closure. The DOFF pin selects between DDR-I mode (1-cycle latency, DOFF = LOW) and DDR-II mode (1.5-cycle latency, DOFF = HIGH), enabling flexible latency/bandwidth trade-offs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization) |
| Max Clock Frequency | 250 MHz - defines 4 ns minimum clock period for timing budgeting |
| Data Rate | 500 MT/s - achieved via DDR interface transferring on both edges of 250 MHz clock |
| Core Supply Voltage | 1.8 V ± 0.1 V - powers internal SRAM array and logic; requires low-noise regulation |
| I/O Voltage Range | 1.4 V to 1.8 V - supports HSTL Class I/III compatibility and impedance tuning via ZQ |
| Read Latency | 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) - directly impacts pipeline depth in controller design |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory interfaces |
Pinout & Package
Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant, lead-free option available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[35:0] | Synchronous bidirectional data bus | 36-bit DDR I/O shared between read output and write input; driven on C/C rising edges during reads; sampled on K/K rising edges during writes |
| K / K | Dual-phase input clock pair | Rising edges latch all synchronous inputs (address, R/W, LD, BWS); define burst initiation and write sampling points |
| C / C | Dual-phase output clock pair | Rising edges gate read data output; enable flight-time deskewing across multiple SRAMs in parallel configurations |
| CQ / CQ | Output echo clocks | Free-running, source-synchronous clocks referenced to C/C; simplify controller data capture without per-lane delay calibration |
| DOFF | DDR operation mode control | LOW enables DDR-I mode (1-cycle read latency); HIGH enables DDR-II mode (1.5-cycle read latency with improved bandwidth efficiency) |
| ZQ | Output impedance calibration input | Connects to external resistor to ground to tune DQ/CQ output driver impedance to 0.2 × RQ; prevents signal integrity degradation on high-speed buses |
Key Features
| Feature | Design Value |
|---|---|
| Two-word burst architecture | Reduces address bus toggling frequency by 50% versus single-word access, lowering EMI and controller address generation load |
| Programmable read latency (1 or 1.5 cycles) | Enables optimization for either minimal latency (DOFF = LOW) or higher sustained bandwidth (DOFF = HIGH) without hardware change |
| Integrated PLL | Ensures sub-cycle alignment between internal data paths and output clocks, critical for meeting tight setup/hold windows at 500 MT/s |
| HSTL I/O with variable drive strength | Supports 1.4–1.8 V VDDQ and dynamic impedance matching via ZQ, enabling robust signal integrity across varying PCB trace lengths and loads |
| JTAG 1149.1 boundary scan | Enables production testability and interconnect verification without requiring physical probe access to high-density FBGA balls |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packets in multi-gigabit Ethernet switches before classification and forwarding. IC Role / Device Role / Timing Role: High-throughput, low-latency buffer interfacing directly to MAC-layer controllers via DDR-II bus. Use Value: 500 MT/s bandwidth and 1-cycle latency mode meet line-rate buffering requirements for 10 GbE traffic with minimal queuing delay. |
Use Scenario: Holding frame headers and payload fragments in carrier-grade DSLAM and OLT line cards. IC Role / Device Role / Timing Role: Burst-accessed SRAM providing deterministic read/write response for real-time traffic shaping engines. Use Value: Two-word burst reduces address bus activity by half, easing timing closure on dense backplane routing with multiple memory devices. |
| Industrial Protocol Gateway Cache | Test Equipment Pattern Memory |
|
Use Scenario: Caching Modbus TCP or PROFINET frames during protocol translation between fieldbus and IP networks. IC Role / Device Role / Timing Role: Synchronous burst SRAM acting as temporary staging buffer between heterogeneous protocol stacks. Use Value: DOFF-selectable latency allows tuning for either fast header inspection (1-cycle) or full-payload throughput (1.5-cycle), adapting to traffic mix. |
Use Scenario: Storing stimulus and expected response vectors in automated test equipment for semiconductor validation. IC Role / Device Role / Timing Role: Deterministic-access memory supporting precise timing alignment between pattern generator and comparator logic. Use Value: Echo clocks (CQ/CQ) eliminate per-device skew compensation, enabling simultaneous capture across 36-bit wide vector sets at 250 MHz. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C362000B-250BIN | 2M × 36, 250 MHz, 3.3 V core, SSTL-2 I/O, no echo clocks or DOFF latency selection | Lacks source-synchronous CQ/CQ and programmable latency; requires external clock deskew and fixed 2-cycle latency | Prefer when legacy 3.3 V systems exist and echo clock simplification is not required |
| IS61WV204836BLL-250BLI | 2M × 36, 250 MHz, 3.3 V core, LVTTL I/O, asynchronous burst, no DDR or PLL | No DDR interface, no PLL, no echo clocks; relies on simpler but lower-bandwidth asynchronous timing | Choose only if controller lacks DDR capability and bandwidth demand is ≤200 MB/s |
Compared with AS7C362000B-250BIN and IS61WV204836BLL-250BLI, CY7C1520KV18-250BZCT delivers higher effective bandwidth (500 MT/s vs. ≤333 MT/s), eliminates board-level clock deskew via CQ/CQ, and enables latency tuning-critical for real-time networking and test systems.
Availability
CY7C1520KV18-250BZCT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, industrial protocol gateway cache, and test equipment pattern memory requiring stable component supply, long-term lifecycle support, and verified FBGA sourcing.
Supply support for CY7C1520KV18-250BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and system-level timing.
CY7C1520KV18 belongs to Cypress's DDR-II synchronous SRAM product line, engineered specifically for deterministic, high-bandwidth buffering in packet-switched infrastructure where echo clocks and burst efficiency reduce controller complexity.
FAQ
What is the function of the DOFF pin on CY7C1520KV18-250BZCT?
The DOFF pin configures read latency mode: when asserted LOW, it enables DDR-I operation with 1-cycle read latency; when asserted HIGH, it enables DDR-II operation with 1.5-cycle read latency. This selection directly affects controller pipeline depth and achievable bandwidth efficiency, and must be set statically before initialization.
How does the ZQ pin affect signal integrity in high-speed designs?
The ZQ pin connects to an external resistor to ground to calibrate output driver impedance for DQ and CQ signals, targeting 0.2 × RQ. This ensures consistent 25–35 Ω output impedance across voltage/temperature, minimizing reflections and jitter on 500 MT/s DDR buses routed over FR4 PCBs.
Can CY7C1520KV18-250BZCT operate without external C and C clocks?
Yes - in single-clock mode, the device uses K and K for both input sampling and output data gating. However, this forfeits flight-time deskew capability and increases timing margin pressure on the controller, as CQ/CQ echo clocks are no longer available to align data capture.
What is the role of the burst counter in CY7C1520KV18-250BZCT's architecture?
The burst counter increments the least significant address bit (A0) internally to generate sequential 36-bit word addresses during each two-word burst. This eliminates the need for external address sequencing logic and halves the required address bus toggle rate, reducing controller overhead and EMI.
CY7C1520KV18-250BZCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1520KV18-250BZCT FAQ
1.How can I place an order for CY7C1520KV18-250BZCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1520KV18-250BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1520KV18-250BZCT reliable?
The price and inventory of CY7C1520KV18-250BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1520KV18-250BZCT is usually 5 days.
3.What payment methods are accepted for CY7C1520KV18-250BZCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1520KV18-250BZCT transactions.
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4.How is shipping managed for CY7C1520KV18-250BZCT?
CY7C1520KV18-250BZCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1520KV18-250BZCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1520KV18-250BZCT?
For technical support, including CY7C1520KV18-250BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1520KV18-250BZCT requirements.
6.How does Aetrix verify that CY7C1520KV18-250BZCT is sourced from the original manufacturer or authorized distributors?
All CY7C1520KV18-250BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1520KV18-250BZCT meets industry standards.
7.What is the process for return or replacement of CY7C1520KV18-250BZCT?
All CY7C1520KV18-250BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1520KV18-250BZCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1520KV18-250BZCT part is unused and in its original packaging.
Return procedure for CY7C1520KV18-250BZCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1520KV18-250BZCT Tags

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