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Infineon Technologies CY7C1520KV18-250BZIT

Part No.:
CY7C1520KV18-250BZIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1520KV18-250BZIT.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,566

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Product details

Overview

CY7C1520KV18-250BZIT from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous DDR-II SRAM with two-word burst architecture, 250 MHz maximum clock frequency, 1.8 V core supply, and HSTL I/O compatible with 1.5 V or 1.8 V VDDQ. It delivers 600 MB/s bandwidth in DDR mode and supports precise timing via dual K/K input clocks and dual C/C output clocks for skew management - deployed in high-speed packet buffering for telecom line cards.

For engineers reviewing the CY7C1520KV18-250BZIT datasheet, CY7C1520KV18-250BZIT pinout, CY7C1520KV18-250BZIT application, or CY7C1520KV18-250BZIT equivalent, key selection criteria include confirmed 2M × 36 organization, 250 MHz/500 Mbps DDR operation, DOFF-configurable 1-cycle (DDR-I) or 1.5-cycle (DDR-II) read latency, HSTL drive strength programmability, and JTAG 1149.1 test access support.

Technical Context

The CY7C1520KV18-250BZIT implements a synchronous pipelined SRAM core with DDR-II interface logic, using separate K/K clocks for address/control/data capture and independent C/C clocks for output data strobing. Its burst counter consumes A0 to generate sequential 36-bit word pairs on each access.

It supports both dual-clock (C/C + CQ/CQ echo clocks) and single-clock (K/K only) modes. The DOFF pin selects between 1-cycle (DOFF = LOW) and 1.5-cycle (DOFF = HIGH) read latency, while ZQ enables dynamic output impedance calibration against an external resistor to ground.

Key Specifications

Parameter Value and Actual Design Meaning
Density & Organization 72 Mbit / 2M × 36 - provides 36-bit wide data path for efficient burst transfers in networking ASIC interfaces.
Max Clock Frequency 250 MHz - defines maximum sustained command rate; supports 500 MT/s DDR data rate (1000 Mbps effective).
Read Latency 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) - determines minimum wait states before valid read data appears at outputs.
Supply Voltages VDD = 1.8 V ±0.1 V (core); VDDQ = 1.5 V or 1.8 V (I/O) - enables interoperability with mixed-voltage memory subsystems.
I/O Standard HSTL Class I - ensures signal integrity at >250 MHz with controlled slew and termination matching.
Package 165-ball FBGA (13 mm × 15 mm × 1.4 mm) - standard footprint for high-density PCB routing in telecom modules.
JTAG Support IEEE 1149.1 compliant TAP - enables boundary-scan testing without requiring external test fixtures.

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant (Pb-free).

Pin/Terminal Circuit Role Design Meaning
DQ[35:0] Synchronous bidirectional data bus 36-bit DDR data I/O shared across read/write; driven on rising edges of C/C (or K/K in single-clock mode); tristated when deselected.
K / K Positive/negative input clocks Capture all synchronous inputs (address, R/W, LD, BWS); define access initiation edge; used for data output in single-clock mode.
C / C Positive/negative output data clocks Strobe read data output; enable flight-time deskewing across multiple SRAMs; paired with CQ/CQ echo clocks.
CQ / CQ Output echo clocks Free-running clocks synchronized to C/C; referenced by system controller to latch Q[35:0] with minimal setup/hold margin.
DOFF Read latency configuration input Assert HIGH → 1.5-cycle DDR-II latency; assert LOW → 1-cycle DDR-I latency; sets internal timing pipeline depth.
ZQ Output impedance calibration reference Connects to external resistor to ground (RQ); calibrates DQ/CQ driver impedance to 0.2 × RQ; cannot float or tie to GND.
BWS[3:0] Byte write select inputs Four active-low signals controlling 9-bit byte lanes (BWS0–BWS3 map to D[8:0], D[17:9], D[26:18], D[35:27]); sampled on K/K edges.

Key Features

Feature Design Value
Two-word burst architecture Reduces external address bus toggling by 50% per access - lowers EMI and simplifies controller address generation logic.
Programmable output drive strength HSTL buffers support variable drive via ZQ calibration - matches trace impedance across varying board stackups without redesign.
Configurable read latency (DOFF) Hardware-selectable 1-cycle or 1.5-cycle latency - allows optimization for timing-critical vs. throughput-critical system partitions.
Dual-domain clocking (K/K + C/C) Decouples input capture and output strobing - eliminates clock skew sensitivity between controller and memory in multi-device layouts.
JTAG 1149.1 boundary scan Fully compliant TAP with instruction/data registers - enables production test coverage of solder joints and interconnects without physical probe access.

Applications

Telecom Line Card Buffering High-Speed Test Equipment Memory

Use Scenario: Storing packet headers and metadata in OC-192/STM-64 line interface units where deterministic latency and burst throughput are critical.

IC Role / Device Role / Timing Role: Primary burst-access buffer interfacing directly with SerDes MAC controllers via 36-bit HSTL bus and echo-clock–based capture.

Use Value: 250 MHz DDR operation delivers 600 MB/s sustained bandwidth; DOFF-selectable latency aligns with MAC arbitration windows.

Use Scenario: Capturing high-fidelity waveform samples in automated test equipment (ATE) pattern generators with tight timing closure.

IC Role / Device Role / Timing Role: Synchronous acquisition buffer synchronized to system clock domain using C/C and CQ/CQ echo clocks.

Use Value: Dual-clock domain eliminates flight-time mismatch across 36-bit bus; ZQ calibration maintains signal integrity over temperature.

Network Processor Lookaside Cache Industrial Video Frame Buffer

Use Scenario: Offloading table lookups and flow-state storage from network processors in Layer 3 switches and routers.

IC Role / Device Role / Timing Role: Low-latency, wide-data-path SRAM acting as external cache for NPU instruction/data fetch pipelines.

Use Value: 1-cycle DDR-I mode (DOFF = LOW) minimizes lookup delay; 2M × 36 organization matches typical TCAM result widths.

Use Scenario: Holding uncompressed video frames (e.g., 1080p@60Hz YUV422) in broadcast-grade encoder/decoder modules.

IC Role / Device Role / Timing Role: Frame buffer accessed via burst-aligned writes from video DMA engines and reads by pixel clocked display controllers.

Use Value: Two-word burst reduces address bus activity during frame writes; HSTL I/O sustains clean eye diagrams at 500 Mbps DDR rates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61WV102436BLL-15BLI 1024K × 36, 165-ball FBGA, 15 ns async access; no DDR, no burst, no DOFF latency control Used in legacy systems requiring simple parallel SRAM interface without clock domain separation Select only if DDR timing complexity must be avoided and bandwidth < 300 MB/s suffices
Microchip 21SPD020-250BG 2M × 36, 165-ball FBGA, 250 MHz DDR-II, but uses SSTL-2 I/O (not HSTL) and lacks ZQ calibration Deployed in FPGA-based prototyping where SSTL-2 compatibility is required and impedance tuning is handled externally Choose when interfacing with Xilinx Ultrascale+ banks configured for SSTL-2, not HSTL

Compared with IS61WV102436BLL-15BLI and 21SPD020-250BG, CY7C1520KV18-250BZIT uniquely combines HSTL I/O, on-die ZQ calibration, and hardware-selectable DDR-I/II latency - enabling tighter timing closure in high-speed serial fabric interfaces without external termination or latency compensation logic.

Availability

CY7C1520KV18-250BZIT is available at Aetrix Electronics and suitable for telecom infrastructure, automated test equipment, network processor acceleration, and industrial video processing requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1520KV18-250BZIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets, with emphasis on signal integrity and system-level timing robustness.

The CY7C15xxKV18 family targets high-speed data buffering in systems demanding deterministic latency, burst efficiency, and DDR-compatible I/O - specifically engineered for SerDes-adjacent memory subsystems in telecom and test instrumentation.

FAQ

What is the function of the DOFF pin on CY7C1520KV18-250BZIT?

The DOFF (Data Output OFFset) pin configures read latency: when asserted HIGH, it enables DDR-II mode with 1.5-cycle latency; when LOW, it selects DDR-I mode with 1-cycle latency. This setting directly affects the number of K-clock cycles between address load and first valid DQ output, and is latched synchronously on the rising edge of K.

Can CY7C1520KV18-250BZIT operate without external C and C clocks?

Yes - it supports single-clock mode using only K and K for both input capture and output strobing. In this mode, CQ and CQ are generated relative to K/K instead of C/C, and read data is driven on the rising edges of K/K. All timing parameters shift accordingly, and echo clock deskew capability is lost.

How does ZQ calibration affect system-level signal integrity?

ZQ calibration adjusts the output driver impedance of DQ, CQ, and CQ pins to 0.2 × RQ, where RQ is an external precision resistor (typically 50 Ω) tied between ZQ and ground. This actively matches trace impedance, reducing reflections and improving eye height/width - especially critical at 500 Mbps DDR data rates on FR4 PCBs.

Is CY7C1520KV18-250BZIT pin-compatible with CY7C1518KV18-250BZI?

No - although both use 165-ball FBGA packages, their pinouts differ significantly: CY7C1520KV18-250BZIT has 36 DQ pins (DQ[35:0]) and four BWS inputs (BWS[3:0]), while CY7C1518KV18-250BZI has 18 DQ pins (DQ[17:0]) and two BWS inputs (BWS[1:0]). Address count (21 vs. 22) and internal array mapping also differ.

CY7C1520KV18-250BZIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1520KV18-250BZIT FAQ

1.How can I place an order for CY7C1520KV18-250BZIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1520KV18-250BZIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1520KV18-250BZIT reliable?

The price and inventory of CY7C1520KV18-250BZIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1520KV18-250BZIT is usually 5 days.

3.What payment methods are accepted for CY7C1520KV18-250BZIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1520KV18-250BZIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1520KV18-250BZIT?

CY7C1520KV18-250BZIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1520KV18-250BZIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1520KV18-250BZIT?

For technical support, including CY7C1520KV18-250BZIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1520KV18-250BZIT requirements.

6.How does Aetrix verify that CY7C1520KV18-250BZIT is sourced from the original manufacturer or authorized distributors?

All CY7C1520KV18-250BZIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1520KV18-250BZIT meets industry standards.

7.What is the process for return or replacement of CY7C1520KV18-250BZIT?

All CY7C1520KV18-250BZIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1520KV18-250BZIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1520KV18-250BZIT part is unused and in its original packaging.

Return procedure for CY7C1520KV18-250BZIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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