Infineon Technologies CY7C1520KV18-250BZIT
- Part No.:
- CY7C1520KV18-250BZIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1520KV18-250BZIT.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1520KV18-250BZIT from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous DDR-II SRAM with two-word burst architecture, 250 MHz maximum clock frequency, 1.8 V core supply, and HSTL I/O compatible with 1.5 V or 1.8 V VDDQ. It delivers 600 MB/s bandwidth in DDR mode and supports precise timing via dual K/K input clocks and dual C/C output clocks for skew management - deployed in high-speed packet buffering for telecom line cards.
For engineers reviewing the CY7C1520KV18-250BZIT datasheet, CY7C1520KV18-250BZIT pinout, CY7C1520KV18-250BZIT application, or CY7C1520KV18-250BZIT equivalent, key selection criteria include confirmed 2M × 36 organization, 250 MHz/500 Mbps DDR operation, DOFF-configurable 1-cycle (DDR-I) or 1.5-cycle (DDR-II) read latency, HSTL drive strength programmability, and JTAG 1149.1 test access support.
Technical Context
The CY7C1520KV18-250BZIT implements a synchronous pipelined SRAM core with DDR-II interface logic, using separate K/K clocks for address/control/data capture and independent C/C clocks for output data strobing. Its burst counter consumes A0 to generate sequential 36-bit word pairs on each access.
It supports both dual-clock (C/C + CQ/CQ echo clocks) and single-clock (K/K only) modes. The DOFF pin selects between 1-cycle (DOFF = LOW) and 1.5-cycle (DOFF = HIGH) read latency, while ZQ enables dynamic output impedance calibration against an external resistor to ground.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density & Organization | 72 Mbit / 2M × 36 - provides 36-bit wide data path for efficient burst transfers in networking ASIC interfaces. |
| Max Clock Frequency | 250 MHz - defines maximum sustained command rate; supports 500 MT/s DDR data rate (1000 Mbps effective). |
| Read Latency | 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) - determines minimum wait states before valid read data appears at outputs. |
| Supply Voltages | VDD = 1.8 V ±0.1 V (core); VDDQ = 1.5 V or 1.8 V (I/O) - enables interoperability with mixed-voltage memory subsystems. |
| I/O Standard | HSTL Class I - ensures signal integrity at >250 MHz with controlled slew and termination matching. |
| Package | 165-ball FBGA (13 mm × 15 mm × 1.4 mm) - standard footprint for high-density PCB routing in telecom modules. |
| JTAG Support | IEEE 1149.1 compliant TAP - enables boundary-scan testing without requiring external test fixtures. |
Pinout & Package
Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant (Pb-free).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[35:0] | Synchronous bidirectional data bus | 36-bit DDR data I/O shared across read/write; driven on rising edges of C/C (or K/K in single-clock mode); tristated when deselected. |
| K / K | Positive/negative input clocks | Capture all synchronous inputs (address, R/W, LD, BWS); define access initiation edge; used for data output in single-clock mode. |
| C / C | Positive/negative output data clocks | Strobe read data output; enable flight-time deskewing across multiple SRAMs; paired with CQ/CQ echo clocks. |
| CQ / CQ | Output echo clocks | Free-running clocks synchronized to C/C; referenced by system controller to latch Q[35:0] with minimal setup/hold margin. |
| DOFF | Read latency configuration input | Assert HIGH → 1.5-cycle DDR-II latency; assert LOW → 1-cycle DDR-I latency; sets internal timing pipeline depth. |
| ZQ | Output impedance calibration reference | Connects to external resistor to ground (RQ); calibrates DQ/CQ driver impedance to 0.2 × RQ; cannot float or tie to GND. |
| BWS[3:0] | Byte write select inputs | Four active-low signals controlling 9-bit byte lanes (BWS0–BWS3 map to D[8:0], D[17:9], D[26:18], D[35:27]); sampled on K/K edges. |
Key Features
| Feature | Design Value |
|---|---|
| Two-word burst architecture | Reduces external address bus toggling by 50% per access - lowers EMI and simplifies controller address generation logic. |
| Programmable output drive strength | HSTL buffers support variable drive via ZQ calibration - matches trace impedance across varying board stackups without redesign. |
| Configurable read latency (DOFF) | Hardware-selectable 1-cycle or 1.5-cycle latency - allows optimization for timing-critical vs. throughput-critical system partitions. |
| Dual-domain clocking (K/K + C/C) | Decouples input capture and output strobing - eliminates clock skew sensitivity between controller and memory in multi-device layouts. |
| JTAG 1149.1 boundary scan | Fully compliant TAP with instruction/data registers - enables production test coverage of solder joints and interconnects without physical probe access. |
Applications
| Telecom Line Card Buffering | High-Speed Test Equipment Memory |
|---|---|
|
Use Scenario: Storing packet headers and metadata in OC-192/STM-64 line interface units where deterministic latency and burst throughput are critical. IC Role / Device Role / Timing Role: Primary burst-access buffer interfacing directly with SerDes MAC controllers via 36-bit HSTL bus and echo-clock–based capture. Use Value: 250 MHz DDR operation delivers 600 MB/s sustained bandwidth; DOFF-selectable latency aligns with MAC arbitration windows. |
Use Scenario: Capturing high-fidelity waveform samples in automated test equipment (ATE) pattern generators with tight timing closure. IC Role / Device Role / Timing Role: Synchronous acquisition buffer synchronized to system clock domain using C/C and CQ/CQ echo clocks. Use Value: Dual-clock domain eliminates flight-time mismatch across 36-bit bus; ZQ calibration maintains signal integrity over temperature. |
| Network Processor Lookaside Cache | Industrial Video Frame Buffer |
|
Use Scenario: Offloading table lookups and flow-state storage from network processors in Layer 3 switches and routers. IC Role / Device Role / Timing Role: Low-latency, wide-data-path SRAM acting as external cache for NPU instruction/data fetch pipelines. Use Value: 1-cycle DDR-I mode (DOFF = LOW) minimizes lookup delay; 2M × 36 organization matches typical TCAM result widths. |
Use Scenario: Holding uncompressed video frames (e.g., 1080p@60Hz YUV422) in broadcast-grade encoder/decoder modules. IC Role / Device Role / Timing Role: Frame buffer accessed via burst-aligned writes from video DMA engines and reads by pixel clocked display controllers. Use Value: Two-word burst reduces address bus activity during frame writes; HSTL I/O sustains clean eye diagrams at 500 Mbps DDR rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV102436BLL-15BLI | 1024K × 36, 165-ball FBGA, 15 ns async access; no DDR, no burst, no DOFF latency control | Used in legacy systems requiring simple parallel SRAM interface without clock domain separation | Select only if DDR timing complexity must be avoided and bandwidth < 300 MB/s suffices |
| Microchip 21SPD020-250BG | 2M × 36, 165-ball FBGA, 250 MHz DDR-II, but uses SSTL-2 I/O (not HSTL) and lacks ZQ calibration | Deployed in FPGA-based prototyping where SSTL-2 compatibility is required and impedance tuning is handled externally | Choose when interfacing with Xilinx Ultrascale+ banks configured for SSTL-2, not HSTL |
Compared with IS61WV102436BLL-15BLI and 21SPD020-250BG, CY7C1520KV18-250BZIT uniquely combines HSTL I/O, on-die ZQ calibration, and hardware-selectable DDR-I/II latency - enabling tighter timing closure in high-speed serial fabric interfaces without external termination or latency compensation logic.
Availability
CY7C1520KV18-250BZIT is available at Aetrix Electronics and suitable for telecom infrastructure, automated test equipment, network processor acceleration, and industrial video processing requiring stable component supply and long-term lifecycle support.
Supply support for CY7C1520KV18-250BZIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets, with emphasis on signal integrity and system-level timing robustness.
The CY7C15xxKV18 family targets high-speed data buffering in systems demanding deterministic latency, burst efficiency, and DDR-compatible I/O - specifically engineered for SerDes-adjacent memory subsystems in telecom and test instrumentation.
FAQ
What is the function of the DOFF pin on CY7C1520KV18-250BZIT?
The DOFF (Data Output OFFset) pin configures read latency: when asserted HIGH, it enables DDR-II mode with 1.5-cycle latency; when LOW, it selects DDR-I mode with 1-cycle latency. This setting directly affects the number of K-clock cycles between address load and first valid DQ output, and is latched synchronously on the rising edge of K.
Can CY7C1520KV18-250BZIT operate without external C and C clocks?
Yes - it supports single-clock mode using only K and K for both input capture and output strobing. In this mode, CQ and CQ are generated relative to K/K instead of C/C, and read data is driven on the rising edges of K/K. All timing parameters shift accordingly, and echo clock deskew capability is lost.
How does ZQ calibration affect system-level signal integrity?
ZQ calibration adjusts the output driver impedance of DQ, CQ, and CQ pins to 0.2 × RQ, where RQ is an external precision resistor (typically 50 Ω) tied between ZQ and ground. This actively matches trace impedance, reducing reflections and improving eye height/width - especially critical at 500 Mbps DDR data rates on FR4 PCBs.
Is CY7C1520KV18-250BZIT pin-compatible with CY7C1518KV18-250BZI?
No - although both use 165-ball FBGA packages, their pinouts differ significantly: CY7C1520KV18-250BZIT has 36 DQ pins (DQ[35:0]) and four BWS inputs (BWS[3:0]), while CY7C1518KV18-250BZI has 18 DQ pins (DQ[17:0]) and two BWS inputs (BWS[1:0]). Address count (21 vs. 22) and internal array mapping also differ.
CY7C1520KV18-250BZIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1520KV18-250BZIT FAQ
1.How can I place an order for CY7C1520KV18-250BZIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1520KV18-250BZIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1520KV18-250BZIT reliable?
The price and inventory of CY7C1520KV18-250BZIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1520KV18-250BZIT is usually 5 days.
3.What payment methods are accepted for CY7C1520KV18-250BZIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1520KV18-250BZIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1520KV18-250BZIT?
CY7C1520KV18-250BZIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1520KV18-250BZIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1520KV18-250BZIT?
For technical support, including CY7C1520KV18-250BZIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1520KV18-250BZIT requirements.
6.How does Aetrix verify that CY7C1520KV18-250BZIT is sourced from the original manufacturer or authorized distributors?
All CY7C1520KV18-250BZIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1520KV18-250BZIT meets industry standards.
7.What is the process for return or replacement of CY7C1520KV18-250BZIT?
All CY7C1520KV18-250BZIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1520KV18-250BZIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1520KV18-250BZIT part is unused and in its original packaging.
Return procedure for CY7C1520KV18-250BZIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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