Infineon Technologies CY7C1520KV18-250BZXC
- Part No.:
- CY7C1520KV18-250BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1520KV18-250BZXC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1520KV18-250BZXC from Cypress Semiconductor is a 72-Mbit synchronous DDR-II SRAM configured as 2M × 36, operating at 250 MHz (40 ns clock period), with double-data-rate interface delivering 500 MT/s effective data rate, 1.5-cycle read latency when DOFF = HIGH, and HSTL I/O compatible with 1.5 V or 1.8 V VDDQ - deployed in high-bandwidth packet buffering for telecom line cards.
For engineers reviewing the CY7C1520KV18-250BZXC datasheet, CY7C1520KV18-250BZXC pinout, CY7C1520KV18-250BZXC application, or CY7C1520KV18-250BZXC equivalent, key selection criteria include burst-mode timing alignment, echo-clock–based data capture, dual-K/K and dual-C/C clock domain support, and JTAG 1149.1 testability for system-level DDR memory validation.
Technical Context
The device implements a synchronous pipelined architecture with two-word burst addressing driven by A0, using separate K/K input clocks for address/control latching and C/C output clocks for data strobing. All synchronous inputs register on rising edges of K or K; all outputs register on rising edges of C/C (or K/K in single-clock mode).
It integrates an on-chip PLL for precise data placement, echo clocks CQ/CQ synchronized to C/C for simplified receiver capture, and programmable output impedance via ZQ pin calibrated to external 240 Ω resistor. Read latency is configurable: 1 cycle (DDR-I mode) when DOFF = LOW, 1.5 cycles (DDR-II mode) when DOFF = HIGH.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density & Organization | 72 Mbit / 2M × 36 - supports wide-data-path buffering without external width expansion |
| Max Clock Frequency | 250 MHz - defines 4 ns minimum clock period and maximum sustained bandwidth of 18 Gb/s (36-bit × 500 MT/s) |
| Read Latency | 1.5 cycles (DOFF = HIGH) - enables tighter timing closure in systems requiring DDR-II-compliant burst response |
| I/O Voltage Support | 1.5 V or 1.8 V VDDQ - allows interoperability with both legacy 1.5 V and modern 1.8 V HSTL-18/15 bus standards |
| Output Drive | Variable-drive HSTL - impedance programmable via ZQ pin to match 40–60 Ω PCB traces, reducing signal integrity margin loss |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - provides low-inductance interconnect and thermal performance suitable for multi-SRAM memory subsystems |
| JTAG Compliance | IEEE 1149.1 TAP - enables boundary-scan testing of SRAM interconnects in dense high-speed layouts |
Pinout & Package
Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, Pb-free option available (BZXC suffix).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[35:0] | Synchronous bidirectional data | Shares physical pins for read/write; drives valid data on rising edges of C/C (or K/K); tristates automatically on deselect |
| K / K | Input clock pair (positive/negative) | Captures address, R/W, LD, BWS on rising edges; initiates all transactions; supports differential skew tolerance |
| C / C | Output clock pair (positive/negative) | Strobes read data output; enables flight-time deskewing across multiple SRAMs in parallel memory channels |
| CQ / CQ | Echo clock outputs | Free-running, phase-aligned copies of C/C; referenced by system controller for source-synchronous data capture |
| DOFF | Read latency mode control | LOW → 1-cycle DDR-I latency; HIGH → 1.5-cycle DDR-II latency; sets internal burst timing pipeline depth |
| ZQ | Impedance calibration input | Connects to 240 Ω resistor to ground; tunes DQ/CQ output drive strength to ±10% of target trace impedance |
| BWS[3:0] | Byte write select (active LOW) | BWS0–BWS3 independently mask DQ[8:0], [17:9], [26:18], [35:27]; enables partial-word writes without read-modify-write overhead |
| LD | Load strobe | Active LOW; latches address and R/W on next K/K edge; defines start of burst transaction sequence |
Key Features
| Feature | Design Value |
|---|---|
| Two-word burst architecture | Reduces external address bus toggling by 50% per access - lowers EMI and simplifies routing in high-pin-count designs |
| Programmable output impedance (ZQ) | Eliminates need for external series termination resistors; supports dynamic impedance tuning across voltage/temperature variation |
| Dual echo clocks (CQ/CQ) | Enables deterministic setup/hold timing at controller receiver without per-lane delay compensation circuitry |
| Configurable DDR-I/DDR-II latency | DOFF pin selects between 1-cycle (low-latency streaming) and 1.5-cycle (timing-margin–optimized) read response |
| On-chip PLL | Aligns internal data launch timing to C/C edges within ±30 ps jitter - critical for >400 MT/s reliable operation |
Applications
| Telecom Packet Buffering | Network Processor Interface |
|---|---|
|
Use Scenario: Line card buffers for 10G/40G Ethernet switch fabric where packets arrive at variable rates and require low-jitter, deterministic latency. IC Role / Device Role / Timing Role: High-throughput, burst-mode SRAM acting as first-level ingress/egress buffer with DDR-II timing for backpressure management. Use Value: 2M × 36 organization matches typical network processor data bus width; 250 MHz clock sustains 18 Gb/s throughput without interleaving. |
Use Scenario: External memory for multi-core network processors executing deep packet inspection with real-time flow classification. IC Role / Device Role / Timing Role: Synchronous pipelined SRAM providing zero-wait-state access to lookup tables and session state caches. Use Value: 1.5-cycle DDR-II latency ensures predictable worst-case response time; echo clocks simplify timing closure in 16+ layer PCBs. |
| Baseband Signal Processing | Industrial Video Frame Buffer |
|
Use Scenario: Intermediate storage for LTE/5G baseband processing blocks performing FFT, channel estimation, and precoding. IC Role / Device Role / Timing Role: Burst-access SRAM interfacing with FPGA-based DSP engines using source-synchronous DDR protocol. Use Value: Dual C/C clocks enable precise deskew across 36-bit data lanes; HSTL I/O ensures compatibility with Xilinx Ultrascale+ I/O banks. |
Use Scenario: Frame buffer in medical imaging systems capturing 10-bit 4K@60 Hz video streams with strict jitter and reliability requirements. IC Role / Device Role / Timing Role: High-reliability, low-soft-error SRAM storing uncompressed frame data with ECC-protected access path. Use Value: Neutron soft error immunity (1E-10 errors/bit/hour) meets IEC 62304 Class C safety requirements; FBGA package supports conformal coating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102436BLL-15BLI | 1024K × 36, 165 MHz max, single-ended LVTTL I/O, no echo clocks or ZQ calibration | Limited to lower-bandwidth control-plane buffering; lacks DDR-II timing flexibility and HSTL signal integrity | Select when cost sensitivity outweighs bandwidth needs and board-level timing margin is ample |
| MT47H64M36RT-25E:H | 2 Gb DDR2 SDRAM, 250 MHz, 1.8 V, requires refresh, command/address bus overhead | Higher density but asynchronous refresh and tRCD/tRP delays increase latency unpredictability | Select only when capacity >72 Mbit is mandatory and deterministic latency is secondary to storage size |
Compared with IS61WV102436BLL-15BLI and MT47H64M36RT-25E:H, CY7C1520KV18-250BZXC delivers deterministic sub-10 ns read latency, eliminates refresh overhead, and provides echo-clock–assisted timing closure - essential for real-time signal and packet processing.
Availability
CY7C1520KV18-250BZXC is available at Aetrix Electronics and suitable for telecom infrastructure, network processor co-processing, baseband signal processing, and industrial video frame buffering requiring stable component supply and long-term lifecycle assurance.
Supply support for CY7C1520KV18-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications applications.
CY7C1520KV18 belongs to Cypress's DDR-II synchronous SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth buffering in telecom, networking, and signal processing systems where DDR SDRAM unpredictability is unacceptable.
FAQ
What is the function of the DOFF pin on CY7C1520KV18-250BZXC?
The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables DDR-II operation with 1.5-cycle latency for improved timing margin; when LOW, it reverts to DDR-I mode with 1-cycle latency for minimal delay. This setting directly controls internal pipeline staging and must be held static during operation.
Can CY7C1520KV18-250BZXC operate without external C and C clocks?
Yes - the device supports single-clock mode where K and K serve as both input and output clocks. In this configuration, C and C pins are unused, CQ/CQ derive from K/K, and data is strobed on K/K rising edges. However, echo-clock–assisted timing closure and flight-time deskew capability are forfeited.
How is output impedance calibrated using the ZQ pin?
ZQ connects to a precision 240 Ω resistor to ground; the device measures this reference and adjusts internal drive strength to achieve 0.2 × RQ = 48 Ω output impedance. Calibration occurs automatically at power-up and can be retriggered via JTAG instruction. Direct connection to VDDQ enables minimum-impedance mode (~35 Ω).
What is the role of BWS[3:0] in byte-write operations?
BWS[3:0] are active-LOW byte write selects that gate corresponding 9-bit segments of the 36-bit DQ bus: BWS0–BWS3 control DQ[8:0], [17:9], [26:18], and [35:27]. When a BWS line is HIGH, its associated byte is masked - preserving existing memory contents without requiring read-modify-write cycles.
CY7C1520KV18-250BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1520KV18-250BZXC FAQ
1.How can I place an order for CY7C1520KV18-250BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1520KV18-250BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1520KV18-250BZXC reliable?
The price and inventory of CY7C1520KV18-250BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1520KV18-250BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1520KV18-250BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1520KV18-250BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1520KV18-250BZXC?
CY7C1520KV18-250BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1520KV18-250BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1520KV18-250BZXC?
For technical support, including CY7C1520KV18-250BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1520KV18-250BZXC requirements.
6.How does Aetrix verify that CY7C1520KV18-250BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1520KV18-250BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1520KV18-250BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1520KV18-250BZXC?
All CY7C1520KV18-250BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1520KV18-250BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1520KV18-250BZXC part is unused and in its original packaging.
Return procedure for CY7C1520KV18-250BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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