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Infineon Technologies CY7C1548KV18-400BZC

Part No.:
CY7C1548KV18-400BZC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1548KV18-400BZC.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:105

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Product details

Overview

CY7C1548KV18 from Cypress Semiconductor is a 72-Mbit (4M × 18) DDR II+ synchronous pipelined SRAM with two-word burst architecture, 2.0-cycle read latency at 400 MHz, HSTL I/O interface, and 1.8 V core / 1.4–1.8 V I/O supply. It delivers 900 Mbps data throughput via double-data-rate transfers synchronized to K/K clocks and supports echo-clock–based data capture in high-speed memory subsystems for networking line cards and packet buffer applications.

For engineers reviewing the CY7C1548KV18 datasheet, CY7C1548KV18 pinout, CY7C1548KV18 application, or CY7C1548KV18 equivalent, key selection criteria include DDR II+ timing compliance, QVLD-driven data validity signaling, PLL-enabled 2-cycle latency mode, and FBGA-165 package compatibility with high-density PCB layouts.

Technical Context

This SRAM implements a synchronous pipelined architecture where address and control signals are registered on the rising edge of K, while data is sampled on both K and K edges. The internal organization comprises two 2M × 18 arrays, enabling concurrent access to adjacent words within a single burst cycle.

The device integrates a PLL for precise data placement and uses echo clocks (CQ/CQ) aligned to output data, eliminating system-level skew compensation. DOFF pin selection determines operation mode: PLL-enabled DDR II+ (2-cycle latency, up to 450 MHz) or DDR I–compatible (1-cycle latency, ≤167 MHz).

Key Specifications

Parameter Value and Actual Design Meaning
Density & Organization 72 Mbit, configured as 4M × 18 - enables compact 18-bit wide memory interfaces without external width expansion.
Max Clock Frequency 400 MHz (K/K) - supports sustained 900 Mbps DDR data rate with deterministic timing margins.
Read Latency 2.0 clock cycles when DOFF = HIGH - ensures predictable pipeline depth for real-time buffer management.
I/O Voltage Range VDDQ = 1.4 V to 1.8 V - allows interoperability with both 1.5 V and 1.8 V HSTL-15/18 systems.
Core Supply VDD = 1.8 V ± 0.1 V - mandates tight regulation but reduces dynamic power vs. 2.5 V SRAMs.
Package 165-ball FBGA (13 × 15 × 1.4 mm) - provides low-inductance interconnect and thermal performance for high-speed routing.
Output Signaling QVLD pin synchronized to CQ/CQ - eliminates need for external strobe generation or deskew logic.

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
DQ[17:0] Synchronous bidirectional data bus Transfers 18-bit words on both K and K rising edges; tri-states automatically on deselect to prevent bus contention.
K / K Differential clock inputs Define all synchronous timing; K captures address/control, both clocks register write data and drive read data.
CQ / CQ Output echo clocks Free-running, phase-aligned copies of K/K used by system logic to latch DQ outputs without additional delay matching.
QVLD Valid data indicator Asserted edge-aligned with CQ/CQ to signal that DQ[17:0] contains valid burst word - replaces complex timing margining.
DOFF PLL disable control Active-low input that switches device from DDR II+ (2-cycle) to DDR I (1-cycle) mode - enables backward compatibility.
LD Load strobe Sampled on K rising edge to initiate each burst transaction; defines address and R/W direction for the full 2-word sequence.
BWS[1:0] Byte write select Active-low controls write masking per 9-bit byte (BWS0 → DQ[8:0], BWS1 → DQ[17:9]) - enables partial-word updates without read-modify-write.

Key Features

Feature Design Value
Two-word burst architecture Reduces address bus toggling frequency by 50% versus single-word SRAMs - lowers EMI and simplifies controller address sequencing.
Integrated PLL with echo clocks Eliminates board-level clock forwarding complexity and enables deterministic data capture across temperature/voltage corners.
QVLD synchronization Removes need for fixed or programmable output delay tuning - simplifies FPGA interface design and reduces timing closure effort.
Programmable output impedance (ZQ) Allows on-die termination calibration to match trace impedance (via external 240 Ω resistor) - improves signal integrity without discrete terminators.
JTAG 1149.1 boundary scan Enables production testability and debug visibility of interconnects in dense BGA layouts without physical probe access.

Applications

Packet Buffer Memory Network Processor Interface

Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet switch ASICs.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency burst-access SRAM serving as first-level packet buffer with deterministic 2-cycle read response.

Use Value: Enables line-rate packet classification and forwarding by delivering two 18-bit words per 400 MHz clock cycle without wait states.

Use Scenario: Interfacing between network processor cores and external traffic manager ICs in telecom baseband units.

IC Role / Device Role / Timing Role: Synchronous DDR II+ interface bridging mismatched clock domains while maintaining sub-2 ns data valid window.

Use Value: Eliminates external FIFOs and clock domain crossing logic by providing echo-clocked QVLD–guided data handoff.

Depth-Expanded Memory Subsystem Real-Time Video Frame Buffer

Use Scenario: Constructing 36-bit or 72-bit wide memory banks using multiple CY7C1548KV18 devices in parallel.

IC Role / Device Role / Timing Role: Identical timing and automatic output tri-state on deselect enable seamless depth expansion without glue logic.

Use Value: Guarantees atomic 2-word bursts across all devices, preventing partial writes and simplifying address decoding.

Use Scenario: Storing uncompressed YUV422 video lines in broadcast-grade encoder/decoder modules operating at 1080p60.

IC Role / Device Role / Timing Role: Low-jitter, burst-capable SRAM supplying pixel data to video processing pipelines with strict timing deadlines.

Use Value: Delivers consistent 900 Mbps bandwidth with QVLD–confirmed data validity - avoids frame drop due to timing uncertainty.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C362000B-400BIN 4M × 18 QDR-II SRAM, 400 MHz, 1.8 V core, but lacks integrated PLL and echo clocks; uses separate K/K and CQ/CQ pins with looser skew specs. Requires external clock deskew circuitry and tighter layout constraints to meet setup/hold on CQ-relative data capture. Select when legacy QDR-II compatibility is required and system-level timing margining is feasible.
IS61WV102418BLL-400BLI 1M × 18 asynchronous SRAM with 400 MHz data rate only achievable via external pipelining; no DDR interface, no QVLD, no burst mode. Needs controller-side address sequencing and data latching logic - increases FPGA resource usage and latency variability. Select only for cost-sensitive, non-real-time applications where deterministic latency is not critical.

Compared with AS7C362000B-400BIN and IS61WV102418BLL-400BLI, CY7C1548KV18 uniquely integrates PLL-based data placement and echo-clock–driven QVLD, reducing system-level timing validation effort and enabling higher reliability in jitter-sensitive packet buffering.

Availability

CY7C1548KV18 is available at Aetrix Electronics and suitable for networking line cards, telecom baseband units, and broadcast video encoders requiring stable component supply, long-term lifecycle support, and guaranteed FBGA-165 packaging consistency.

Supply support for CY7C1548KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications applications.

CY7C1548KV18 belongs to the QDR II+ SRAM product line, engineered specifically for deterministic, low-latency packet buffering and high-throughput inter-ASIC communication in carrier-grade infrastructure equipment.

FAQ

What is the function of the DOFF pin, and how does it affect timing?

The DOFF pin disables the internal PLL when asserted LOW, switching the device into DDR I mode with 1-cycle read latency and maximum 167 MHz operation. When HIGH, the PLL enables DDR II+ mode with 2-cycle latency and up to 450 MHz clocking. This dual-mode capability allows backward compatibility while supporting higher bandwidth in new designs.

How does the ZQ pin calibrate output impedance?

ZQ connects to an external 240 Ω resistor to ground, enabling on-die calibration of CQ, CQ, and DQ output drivers to match 0.2 × RQ = 48 Ω. This achieves precise HSTL-compatible termination without discrete resistors, improving signal integrity on high-speed memory buses and reducing PCB layer count.

Can CY7C1548KV18 be used in depth-expanded configurations?

Yes - its automatic output tri-state on deselect, identical timing across all units, and shared K/K clocking allow seamless depth expansion. Two or more devices can be stacked with common control lines and independent DQ buses, enabling wider data paths (e.g., 36-bit or 72-bit) without added logic or timing penalties.

What is the role of QVLD in system-level timing closure?

QVLD is edge-aligned with CQ and CQ and asserts precisely when DQ[17:0] contains valid data. This eliminates the need for fixed or adaptive output delay settings in FPGA receivers, directly enabling single-cycle capture of burst data and significantly simplifying timing analysis and implementation in high-speed memory interfaces.

CY7C1548KV18-400BZC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II+
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
400 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1548KV18-400BZC FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1548KV18-400BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1548KV18-400BZC reliable?

The price and inventory of CY7C1548KV18-400BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1548KV18-400BZC is usually 5 days.

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CY7C1548KV18-400BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1548KV18-400BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1548KV18-400BZC?

For technical support, including CY7C1548KV18-400BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1548KV18-400BZC requirements.

6.How does Aetrix verify that CY7C1548KV18-400BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1548KV18-400BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1548KV18-400BZC meets industry standards.

7.What is the process for return or replacement of CY7C1548KV18-400BZC?

All CY7C1548KV18-400BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1548KV18-400BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1548KV18-400BZC part is unused and in its original packaging.

Return procedure for CY7C1548KV18-400BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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