Infineon Technologies CY7C1550KV18-400BZXI
- Part No.:
- CY7C1550KV18-400BZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1550KV18-400BZXI.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1550KV18-400BZXI from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous pipelined DDR II+ SRAM with 2.0-cycle read latency, 400 MHz clock operation, HSTL I/O interface, and 165-ball FBGA (13 × 15 × 1.4 mm) package. It delivers 900 Mbps double-data-rate throughput, uses echo clocks (CQ/CQ) for precise data capture, and supports programmable impedance via ZQ pin for signal integrity in high-speed memory subsystems used in network packet buffers and baseband processing.
For engineers reviewing the CY7C1550KV18-400BZXI datasheet, CY7C1550KV18-400BZXI pinout, CY7C1550KV18-400BZXI application, or CY7C1550KV18-400BZXI equivalent, key selection criteria include its 2M × 36 organization, DOFF-controlled DDR I/DDR II+ mode switching, QVLD-valid data indicator, and dual-clock (K/K) synchronous timing architecture optimized for burst-aligned memory access in telecom infrastructure.
Technical Context
This SRAM implements a two-word burst architecture where each address access retrieves two consecutive 36-bit words on alternating rising edges of complementary K and K clocks. Internal pipelining enables back-to-back read initiation every K cycle, while synchronous self-timed write circuitry eliminates external write strobes.
The device integrates a PLL for accurate data placement and echo clocks (CQ/CQ) aligned to output data edges-eliminating board-level skew compensation. DOFF pin selection determines operational mode: HIGH enables DDR II+ with 2.0-cycle latency at up to 400 MHz; LOW disables PLL and reverts to DDR I timing with 1-cycle latency at ≤167 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density & Organization | 72 Mbit, configured as 2M × 36 - supports wide-data-path buffering without external width expansion. |
| Max Clock Frequency | 400 MHz - enables 900 MB/s effective bandwidth via DDR transfers on both K and K edges. |
| Read Latency | 2.0 clock cycles (DOFF = HIGH) - deterministic timing for predictable pipeline scheduling in real-time systems. |
| I/O Voltage | VDDQ = 1.4 V to 1.8 V - compatible with both 1.5 V and 1.8 V HSTL-18/15 interfaces, easing migration across voltage domains. |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - fine-pitch footprint optimized for high-density PCB layouts in telecom line cards. |
| Core Supply | VDD = 1.8 V ± 0.1 V - low-voltage core reduces dynamic power in high-throughput memory applications. |
| Timing Reference | K/K differential clock pair - all synchronous inputs and outputs referenced to rising edges, enabling strict setup/hold control. |
Pinout & Package
Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant (BZXI suffix denotes Pb-free).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[35:0] | Synchronous bidirectional data bus | 36-bit wide DDR data path; inputs sampled on K/K rising edges during writes, outputs driven on K/K rising edges during reads with QVLD synchronization. |
| K / K | Differential clock inputs | Primary timing references for all synchronous operations; K drives address/load/control registers, K and K jointly drive data registers. |
| CQ / CQ | Output echo clocks | Free-running clocks phase-aligned to output data edges - eliminate need for separate capture clocks in FPGA/ASIC receivers. |
| QVLD | Valid data indicator | Asserted edge-aligned with CQ/CQ to signal when DQ[35:0] contains valid read data - simplifies receiver logic design. |
| DOFF | PLL disable control | Active-low pin that switches device between DDR II+ (2-cycle latency, 400 MHz) and DDR I (1-cycle latency, ≤167 MHz) modes. |
| ZQ | Impedance calibration input | Connects to external resistor to ground to calibrate output driver impedance (0.2 × RQ) for controlled-impedance trace matching. |
| LD | Load strobe | Synchronous enable sampled on K rising edge; initiates address latching and defines start of burst transaction sequence. |
| BWS[3:0] | Byte write select | Four active-low signals controlling 9-bit byte lanes (D[8:0], D[17:9], D[26:18], D[35:27]) - enables partial-word writes without read-modify-write overhead. |
Key Features
| Feature | Design Value |
|---|---|
| Two-word burst architecture | Reduces address bus frequency by 50% versus single-word SRAMs - lowers routing congestion and timing closure effort in high-pin-count FPGAs. |
| Programmable impedance (ZQ) | Enables on-die output driver tuning to match PCB trace impedance - improves signal integrity and reduces termination component count. |
| QVLD data validity indicator | Eliminates need for fixed delay chains or eye-scan calibration in receivers - accelerates system bring-up and improves timing margin robustness. |
| DOFF-selectable DDR modes | Allows hardware-compatible fallback to DDR I timing during system debug or legacy interface integration - no PCB change required. |
| JTAG 1149.1 test access port | Supports boundary scan testing and in-system programming - enables production test coverage and field firmware updates without dedicated debug headers. |
Applications
| Network Packet Buffering | Baseband Signal Processing |
|---|---|
|
Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in Layer 2/3 switches and routers before forwarding decisions. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer interfacing directly to MAC or switch fabric ASICs using HSTL-18 I/O. Use Value: 2M × 36 organization matches typical packet header + payload alignment; 400 MHz DDR interface sustains >7 Gbps line-rate buffering without bottlenecks. |
Use Scenario: Temporary storage of IQ samples and FFT coefficients in LTE/5G baseband processing units. IC Role / Device Role / Timing Role: Burst-aligned data scratchpad synchronized to DSP clock domain via K/K and echo clocks CQ/CQ. Use Value: QVLD eliminates receiver sampling uncertainty; ZQ calibration maintains signal fidelity across temperature for consistent EVM performance. |
| Telecom Line Card Memory | Radar Digital Beamforming |
|
Use Scenario: Shared memory pool for multiple channelized TDM streams in carrier-grade optical transport equipment. IC Role / Device Role / Timing Role: Depth-expanded memory bank using LD and BWS[3:0] for independent per-channel write masking. Use Value: Byte-write capability avoids destructive read-modify-write cycles; DOFF pin allows graceful degradation to DDR I if PLL fails in field. |
Use Scenario: Real-time storage of phased-array antenna sample buffers prior to digital beam synthesis. IC Role / Device Role / Timing Role: Deterministic-latency memory accessed by FPGA-based beamformer engines using synchronous burst reads. Use Value: 2.0-cycle latency ensures predictable pipeline depth; echo clocks simplify timing closure for multi-GHz ADC/DAC interfaces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C36256P-15TIN | 512K × 72, 15 ns async access, 3.3 V CMOS - no DDR, no echo clocks, no PLL. | Used in legacy control-plane memory where latency tolerance >15 ns and bandwidth <1 Gbps suffices. | Select only when DDR timing, burst efficiency, or HSTL compatibility are unnecessary. |
| IS61WV102432ALL-15BLI | 1M × 32, 15 ns async, 3.3 V LVTTL - single-ended, no burst, no QVLD or ZQ. | Fits cost-sensitive industrial controllers requiring simple parallel interface and minimal timing constraints. | Choose when system lacks DDR-capable controller or cannot support 1.8 V core supply. |
Compared with AS7C36256P-15TIN and IS61WV102432ALL-15BLI, CY7C1550KV18-400BZXI provides 4× higher effective bandwidth, deterministic DDR timing, and signal integrity features (QVLD, ZQ, echo clocks) essential for next-generation telecom and radar systems - but requires DDR-aware controller support and tighter layout controls.
Availability
CY7C1550KV18-400BZXI is available at Aetrix Electronics and suitable for network packet buffering, baseband signal processing, and telecom line card memory requiring stable component supply, long-lifecycle assurance, and RoHS-compliant packaging.
Supply support for CY7C1550KV18-400BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications applications.
CY7C1550KV18 belongs to the QDR II+ SRAM product line, engineered specifically for ultra-low-latency, high-bandwidth buffering in networking, wireless infrastructure, and defense electronics where deterministic DDR timing and signal integrity are critical.
FAQ
What is the function of the DOFF pin on CY7C1550KV18-400BZXI?
The DOFF pin is an active-low PLL disable control. When asserted LOW, it disables the internal PLL and forces the device into DDR I mode with 1-cycle read latency and maximum 167 MHz operation. When HIGH, the PLL is enabled and the device operates in DDR II+ mode with 2.0-cycle latency at up to 400 MHz. This pin must be pulled up via ≤10 kΩ resistor for normal DDR II+ operation.
How does the ZQ pin affect signal integrity in high-speed designs?
The ZQ pin connects to an external resistor to ground to calibrate the output driver impedance of DQ, CQ, and CQ pins to 0.2 × RQ. This ensures matched output impedance to PCB traces, minimizing reflections and improving eye diagram margins. Leaving ZQ unconnected or tying it to GND violates specifications and degrades signal integrity; connecting to VDDQ enables minimum-impedance mode.
Can CY7C1550KV18-400BZXI operate with VDDQ = 1.5 V?
Yes. The device supports VDDQ from 1.4 V to VDD (1.8 V), explicitly including 1.5 V operation. This allows interoperability with 1.5 V HSTL-15 receivers and eases voltage translation in mixed-supply systems. Core VDD remains fixed at 1.8 V ± 0.1 V regardless of VDDQ setting.
What role does the QVLD signal play during read operations?
QVLD is a synchronous output that asserts edge-aligned with CQ and CQ to indicate when DQ[35:0] carries valid read data. It eliminates the need for fixed delay chains or complex clock-data recovery circuits in receiving logic, directly enabling safe sampling of burst data on the same clock edge that drives QVLD - reducing FPGA resource usage and improving timing margin.
CY7C1550KV18-400BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1550KV18-400BZXI FAQ
1.How can I place an order for CY7C1550KV18-400BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1550KV18-400BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1550KV18-400BZXI reliable?
The price and inventory of CY7C1550KV18-400BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1550KV18-400BZXI is usually 5 days.
3.What payment methods are accepted for CY7C1550KV18-400BZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1550KV18-400BZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1550KV18-400BZXI?
CY7C1550KV18-400BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1550KV18-400BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1550KV18-400BZXI?
For technical support, including CY7C1550KV18-400BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1550KV18-400BZXI requirements.
6.How does Aetrix verify that CY7C1550KV18-400BZXI is sourced from the original manufacturer or authorized distributors?
All CY7C1550KV18-400BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1550KV18-400BZXI meets industry standards.
7.What is the process for return or replacement of CY7C1550KV18-400BZXI?
All CY7C1550KV18-400BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1550KV18-400BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1550KV18-400BZXI part is unused and in its original packaging.
Return procedure for CY7C1550KV18-400BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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