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Infineon Technologies CY7C1550KV18-400BZXI

Part No.:
CY7C1550KV18-400BZXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1550KV18-400BZXI.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,453

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Product details

Overview

CY7C1550KV18-400BZXI from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous pipelined DDR II+ SRAM with 2.0-cycle read latency, 400 MHz clock operation, HSTL I/O interface, and 165-ball FBGA (13 × 15 × 1.4 mm) package. It delivers 900 Mbps double-data-rate throughput, uses echo clocks (CQ/CQ) for precise data capture, and supports programmable impedance via ZQ pin for signal integrity in high-speed memory subsystems used in network packet buffers and baseband processing.

For engineers reviewing the CY7C1550KV18-400BZXI datasheet, CY7C1550KV18-400BZXI pinout, CY7C1550KV18-400BZXI application, or CY7C1550KV18-400BZXI equivalent, key selection criteria include its 2M × 36 organization, DOFF-controlled DDR I/DDR II+ mode switching, QVLD-valid data indicator, and dual-clock (K/K) synchronous timing architecture optimized for burst-aligned memory access in telecom infrastructure.

Technical Context

This SRAM implements a two-word burst architecture where each address access retrieves two consecutive 36-bit words on alternating rising edges of complementary K and K clocks. Internal pipelining enables back-to-back read initiation every K cycle, while synchronous self-timed write circuitry eliminates external write strobes.

The device integrates a PLL for accurate data placement and echo clocks (CQ/CQ) aligned to output data edges-eliminating board-level skew compensation. DOFF pin selection determines operational mode: HIGH enables DDR II+ with 2.0-cycle latency at up to 400 MHz; LOW disables PLL and reverts to DDR I timing with 1-cycle latency at ≤167 MHz.

Key Specifications

Parameter Value and Actual Design Meaning
Density & Organization 72 Mbit, configured as 2M × 36 - supports wide-data-path buffering without external width expansion.
Max Clock Frequency 400 MHz - enables 900 MB/s effective bandwidth via DDR transfers on both K and K edges.
Read Latency 2.0 clock cycles (DOFF = HIGH) - deterministic timing for predictable pipeline scheduling in real-time systems.
I/O Voltage VDDQ = 1.4 V to 1.8 V - compatible with both 1.5 V and 1.8 V HSTL-18/15 interfaces, easing migration across voltage domains.
Package 165-ball FBGA (13 × 15 × 1.4 mm) - fine-pitch footprint optimized for high-density PCB layouts in telecom line cards.
Core Supply VDD = 1.8 V ± 0.1 V - low-voltage core reduces dynamic power in high-throughput memory applications.
Timing Reference K/K differential clock pair - all synchronous inputs and outputs referenced to rising edges, enabling strict setup/hold control.

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant (BZXI suffix denotes Pb-free).

Pin/Terminal Circuit Role Design Meaning
DQ[35:0] Synchronous bidirectional data bus 36-bit wide DDR data path; inputs sampled on K/K rising edges during writes, outputs driven on K/K rising edges during reads with QVLD synchronization.
K / K Differential clock inputs Primary timing references for all synchronous operations; K drives address/load/control registers, K and K jointly drive data registers.
CQ / CQ Output echo clocks Free-running clocks phase-aligned to output data edges - eliminate need for separate capture clocks in FPGA/ASIC receivers.
QVLD Valid data indicator Asserted edge-aligned with CQ/CQ to signal when DQ[35:0] contains valid read data - simplifies receiver logic design.
DOFF PLL disable control Active-low pin that switches device between DDR II+ (2-cycle latency, 400 MHz) and DDR I (1-cycle latency, ≤167 MHz) modes.
ZQ Impedance calibration input Connects to external resistor to ground to calibrate output driver impedance (0.2 × RQ) for controlled-impedance trace matching.
LD Load strobe Synchronous enable sampled on K rising edge; initiates address latching and defines start of burst transaction sequence.
BWS[3:0] Byte write select Four active-low signals controlling 9-bit byte lanes (D[8:0], D[17:9], D[26:18], D[35:27]) - enables partial-word writes without read-modify-write overhead.

Key Features

Feature Design Value
Two-word burst architecture Reduces address bus frequency by 50% versus single-word SRAMs - lowers routing congestion and timing closure effort in high-pin-count FPGAs.
Programmable impedance (ZQ) Enables on-die output driver tuning to match PCB trace impedance - improves signal integrity and reduces termination component count.
QVLD data validity indicator Eliminates need for fixed delay chains or eye-scan calibration in receivers - accelerates system bring-up and improves timing margin robustness.
DOFF-selectable DDR modes Allows hardware-compatible fallback to DDR I timing during system debug or legacy interface integration - no PCB change required.
JTAG 1149.1 test access port Supports boundary scan testing and in-system programming - enables production test coverage and field firmware updates without dedicated debug headers.

Applications

Network Packet Buffering Baseband Signal Processing

Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in Layer 2/3 switches and routers before forwarding decisions.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer interfacing directly to MAC or switch fabric ASICs using HSTL-18 I/O.

Use Value: 2M × 36 organization matches typical packet header + payload alignment; 400 MHz DDR interface sustains >7 Gbps line-rate buffering without bottlenecks.

Use Scenario: Temporary storage of IQ samples and FFT coefficients in LTE/5G baseband processing units.

IC Role / Device Role / Timing Role: Burst-aligned data scratchpad synchronized to DSP clock domain via K/K and echo clocks CQ/CQ.

Use Value: QVLD eliminates receiver sampling uncertainty; ZQ calibration maintains signal fidelity across temperature for consistent EVM performance.

Telecom Line Card Memory Radar Digital Beamforming

Use Scenario: Shared memory pool for multiple channelized TDM streams in carrier-grade optical transport equipment.

IC Role / Device Role / Timing Role: Depth-expanded memory bank using LD and BWS[3:0] for independent per-channel write masking.

Use Value: Byte-write capability avoids destructive read-modify-write cycles; DOFF pin allows graceful degradation to DDR I if PLL fails in field.

Use Scenario: Real-time storage of phased-array antenna sample buffers prior to digital beam synthesis.

IC Role / Device Role / Timing Role: Deterministic-latency memory accessed by FPGA-based beamformer engines using synchronous burst reads.

Use Value: 2.0-cycle latency ensures predictable pipeline depth; echo clocks simplify timing closure for multi-GHz ADC/DAC interfaces.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C36256P-15TIN 512K × 72, 15 ns async access, 3.3 V CMOS - no DDR, no echo clocks, no PLL. Used in legacy control-plane memory where latency tolerance >15 ns and bandwidth <1 Gbps suffices. Select only when DDR timing, burst efficiency, or HSTL compatibility are unnecessary.
IS61WV102432ALL-15BLI 1M × 32, 15 ns async, 3.3 V LVTTL - single-ended, no burst, no QVLD or ZQ. Fits cost-sensitive industrial controllers requiring simple parallel interface and minimal timing constraints. Choose when system lacks DDR-capable controller or cannot support 1.8 V core supply.

Compared with AS7C36256P-15TIN and IS61WV102432ALL-15BLI, CY7C1550KV18-400BZXI provides 4× higher effective bandwidth, deterministic DDR timing, and signal integrity features (QVLD, ZQ, echo clocks) essential for next-generation telecom and radar systems - but requires DDR-aware controller support and tighter layout controls.

Availability

CY7C1550KV18-400BZXI is available at Aetrix Electronics and suitable for network packet buffering, baseband signal processing, and telecom line card memory requiring stable component supply, long-lifecycle assurance, and RoHS-compliant packaging.

Supply support for CY7C1550KV18-400BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications applications.

CY7C1550KV18 belongs to the QDR II+ SRAM product line, engineered specifically for ultra-low-latency, high-bandwidth buffering in networking, wireless infrastructure, and defense electronics where deterministic DDR timing and signal integrity are critical.

FAQ

What is the function of the DOFF pin on CY7C1550KV18-400BZXI?

The DOFF pin is an active-low PLL disable control. When asserted LOW, it disables the internal PLL and forces the device into DDR I mode with 1-cycle read latency and maximum 167 MHz operation. When HIGH, the PLL is enabled and the device operates in DDR II+ mode with 2.0-cycle latency at up to 400 MHz. This pin must be pulled up via ≤10 kΩ resistor for normal DDR II+ operation.

How does the ZQ pin affect signal integrity in high-speed designs?

The ZQ pin connects to an external resistor to ground to calibrate the output driver impedance of DQ, CQ, and CQ pins to 0.2 × RQ. This ensures matched output impedance to PCB traces, minimizing reflections and improving eye diagram margins. Leaving ZQ unconnected or tying it to GND violates specifications and degrades signal integrity; connecting to VDDQ enables minimum-impedance mode.

Can CY7C1550KV18-400BZXI operate with VDDQ = 1.5 V?

Yes. The device supports VDDQ from 1.4 V to VDD (1.8 V), explicitly including 1.5 V operation. This allows interoperability with 1.5 V HSTL-15 receivers and eases voltage translation in mixed-supply systems. Core VDD remains fixed at 1.8 V ± 0.1 V regardless of VDDQ setting.

What role does the QVLD signal play during read operations?

QVLD is a synchronous output that asserts edge-aligned with CQ and CQ to indicate when DQ[35:0] carries valid read data. It eliminates the need for fixed delay chains or complex clock-data recovery circuits in receiving logic, directly enabling safe sampling of burst data on the same clock edge that drives QVLD - reducing FPGA resource usage and improving timing margin.

CY7C1550KV18-400BZXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Last Time Buy
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II+
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
400 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1550KV18-400BZXI FAQ

1.How can I place an order for CY7C1550KV18-400BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1550KV18-400BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1550KV18-400BZXI reliable?

The price and inventory of CY7C1550KV18-400BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1550KV18-400BZXI is usually 5 days.

3.What payment methods are accepted for CY7C1550KV18-400BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1550KV18-400BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1550KV18-400BZXI?

CY7C1550KV18-400BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1550KV18-400BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1550KV18-400BZXI?

For technical support, including CY7C1550KV18-400BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1550KV18-400BZXI requirements.

6.How does Aetrix verify that CY7C1550KV18-400BZXI is sourced from the original manufacturer or authorized distributors?

All CY7C1550KV18-400BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1550KV18-400BZXI meets industry standards.

7.What is the process for return or replacement of CY7C1550KV18-400BZXI?

All CY7C1550KV18-400BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1550KV18-400BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1550KV18-400BZXI part is unused and in its original packaging.

Return procedure for CY7C1550KV18-400BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1550KV18-400BZXI Tags

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