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Infineon Technologies CY7C1563V18-375BZC

Part No.:
CY7C1563V18-375BZC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1563V18-375BZC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,209

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Product details

Overview

CY7C1563V18 from Cypress Semiconductor is a 72-Mbit QDR-II+ SRAM with 4M × 18 organization, 2.5-cycle read latency, and dual DDR interfaces operating at 400 MHz (800 MT/s effective data rate). It features separate read/write ports, echo clocks (CQ/CQ), QVLD data-valid indicator, and HSTL I/O for high-speed networking and packet buffering applications.

For engineers reviewing the CY7C1563V18 datasheet, CY7C1563V18 pinout, CY7C1563V18 application, or CY7C1563V18 equivalent, key selection criteria include burst depth (4-word), core voltage (1.8 V ± 0.1 V), I/O voltage range (1.4 V to 1.8 V), 165-ball FBGA package, and DLL-enabled timing alignment for 375 MHz operation.

Technical Context

This device implements QDR-II+ architecture with fully independent read and write ports sharing a single multiplexed address bus. Address latching occurs on alternating rising edges of K and K clocks, enabling concurrent access without bus turnaround. The internal Delay Lock Loop (DLL) aligns CQ/CQ echo clocks to K/K for precise DDR data capture at 375 MHz.

All synchronous inputs (D[17:0], A[19:0], RPS, WPS, BWS[1:0]) are registered on K or K edges; outputs (Q[17:0], QVLD) are edge-aligned with CQ/CQ. Write operations are self-timed and synchronous, while read bursts deliver four 18-bit words per access-ensuring full coherency and deterministic latency.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (4M × 18 organization)
Maximum Clock Frequency 375 MHz - supports sustained 750 MT/s read/write throughput
Read Latency 2.5 clock cycles - enables predictable timing for pipeline-synchronized systems
Core Supply Voltage (VDD) 1.8 V ± 0.1 V - defines minimum power rail stability requirement
I/O Supply Voltage (VDDQ) 1.4 V to 1.8 V - allows interface compatibility with 1.5 V HSTL-15 or 1.8 V HSTL-18 systems
Package 165-ball FBGA (15 mm × 17 mm × 1.4 mm) - standard footprint for high-pin-count memory
Data Interface Double Data Rate (DDR) on both ports - transfers 18 bits per edge, 36 bits per K/K cycle

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous write data input 18-bit parallel data sampled on rising edges of K/K during active write cycles
Q[17:0] Synchronous read data output 18-bit parallel data driven on rising edges of CQ/CQ; tri-stated when RPS is deasserted
RPS Read port select (active low) Enables read burst; sampled on rising edge of K; initiates 4-word sequential output
WPS Write port select (active low) Enables write burst; sampled on rising edge of K; latches D[17:0] into memory array
BWS[1:0] Byte write select (active low) BWS0 controls D[8:0], BWS1 controls D[17:9]; enables partial-word writes without read-modify-write
K / K Positive/negative input clocks Rising edges control all synchronous timing; K used for address/RPS/WPS, K for D[17:0]/BWS
CQ / CQ Echo clocks Free-running, DLL-aligned copies of K/K; simplify high-speed data capture in FPGA/ASIC receivers
QVLD Data valid indicator Asserted synchronously with first valid Q[17:0] word; edge-aligned to CQ/CQ for setup/hold margining
ZQ Output impedance calibration Connects to external 240 Ω resistor to ground to tune CQ/CQ/Q[17:0] drive strength to 48 Ω ± 10%
DOFF DLL disable control Pull low to disable DLL and operate in QDR-I mode (max 167 MHz); pull high via ≤10 kΩ for normal operation

Key Features

Feature Design Value
Separate read/write ports Eliminates data bus turnaround delay and contention in full-duplex memory systems
4-word burst architecture Reduces address bus frequency by 4× versus single-word access; lowers routing complexity
HSTL I/O with variable drive Supports 1.4–1.8 V VDDQ and matches 48 Ω trace impedance via ZQ calibration
JTAG 1149.1 test access port Enables boundary-scan testing and in-system debug without additional test pads
Delay Lock Loop (DLL) Aligns CQ/CQ to K/K with < ±50 ps skew, enabling reliable 375 MHz DDR sampling

Applications

Network Packet Buffering High-Speed Test Equipment Memory

Use Scenario: Storing ingress/egress packet headers and payloads in 10G/25G Ethernet line cards.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-latency, non-blocking buffer between MAC and switch fabric ASICs.

Use Value: 4M × 18 configuration provides 72 Mbit of deterministic-access storage; 375 MHz DDR delivers 13.5 GB/s aggregate bandwidth.

Use Scenario: Capturing high-resolution waveform samples in automated test equipment (ATE) pattern generators.

IC Role / Device Role / Timing Role: High-throughput memory for real-time sample streaming between DAC and control logic.

Use Value: Independent read/write ports allow simultaneous acquisition and playback; QVLD and echo clocks enable sub-nanosecond timing alignment.

Telecom Baseband Processing FPGA-Based Protocol Acceleration

Use Scenario: Temporary storage of OFDM symbol data in LTE/5G baseband units before FFT/IFFT processing.

IC Role / Device Role / Timing Role: Burst-access memory interfacing directly with FPGA-based DSP engines using source-synchronous DDR timing.

Use Value: 2.5-cycle latency ensures minimal pipeline stall; HSTL I/O guarantees signal integrity at 375 MHz clock rates.

Use Scenario: Offloading TCP/IP or encryption processing from host CPU using FPGA-accelerated engines.

IC Role / Device Role / Timing Role: Shared memory resource between host PCIe interface and FPGA accelerator logic blocks.

Use Value: Full data coherency and concurrent read/write eliminate software-managed locking; BWS[1:0] enables byte-granular updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1565V18 2M × 36 organization (same 72 Mbit density), wider data bus, 4-byte BWS support Better suited for 32-bit/64-bit aligned systems requiring fewer address lines and higher per-cycle throughput Select when system data path is ≥32 bits and address decoding simplicity is prioritized over pin count
AS7C3256A-15JCIN 32 Mbit (2M × 16), asynchronous interface, no DDR or DLL, 15 ns access time Limited to lower-bandwidth control-plane buffers or legacy designs lacking DDR timing infrastructure Choose only for cost-sensitive, non-pipelined applications where 375 MHz bandwidth and QDR-II+ features are unnecessary

Compared with CY7C1565V18, CY7C1563V18 offers narrower 18-bit bus and lower pin count for space-constrained layouts; compared with AS7C3256A-15JCIN, it delivers >4× bandwidth and deterministic latency but requires precise DDR timing design and DLL calibration.

Availability

CY7C1563V18 is available at Aetrix Electronics and suitable for network packet buffering, high-speed test equipment memory, telecom baseband processing, and FPGA-based protocol acceleration requiring stable component supply across production lifecycles.

Supply support for CY7C1563V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets.

CY7C1563V18 belongs to the QDR-II+ SRAM product line, engineered specifically for deterministic, high-bandwidth memory access in packet-switched infrastructure and real-time signal processing systems.

FAQ

What is the minimum VDDQ voltage supported by CY7C1563V18?

The device supports VDDQ from 1.4 V to 1.8 V, exceeding the QDR Consortium's 1.5 V ± 0.1 V specification. Operation at 1.4 V is validated and enables compatibility with 1.5 V HSTL-15 systems while maintaining full timing compliance at 375 MHz.

How does the DOFF pin affect timing behavior?

When DOFF is pulled low, the internal DLL is disabled and the device reverts to QDR-I timing mode with maximum frequency reduced to 167 MHz. All timing parameters shift to QDR-I specifications, including longer read latency and loss of echo clock alignment - requiring complete redesign of timing constraints.

Can CY7C1563V18 be used with a single-ended clock source?

No - the architecture requires true differential K/K clock inputs. Driving K and K from the same source violates setup/hold requirements and disables proper DDR operation. A dedicated differential clock generator or FPGA clock buffer with complementary outputs is mandatory.

What is the function of the ZQ pin during system initialization?

ZQ must be connected to a 240 Ω resistor to ground before power-up to calibrate output driver impedance. This sets CQ, CQ, and Q[17:0] drive strength to match 48 Ω PCB traces. Leaving ZQ unconnected or tied to VSS causes undefined output impedance and signal integrity failure at 375 MHz.

CY7C1563V18-375BZC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
375 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1563V18-375BZC FAQ

1.How can I place an order for CY7C1563V18-375BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1563V18-375BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1563V18-375BZC reliable?

The price and inventory of CY7C1563V18-375BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1563V18-375BZC is usually 5 days.

3.What payment methods are accepted for CY7C1563V18-375BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1563V18-375BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1563V18-375BZC?

CY7C1563V18-375BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1563V18-375BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1563V18-375BZC?

For technical support, including CY7C1563V18-375BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1563V18-375BZC requirements.

6.How does Aetrix verify that CY7C1563V18-375BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1563V18-375BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1563V18-375BZC meets industry standards.

7.What is the process for return or replacement of CY7C1563V18-375BZC?

All CY7C1563V18-375BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1563V18-375BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1563V18-375BZC part is unused and in its original packaging.

Return procedure for CY7C1563V18-375BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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