Infineon Technologies CY7C1563V18-400BZC
- Part No.:
- CY7C1563V18-400BZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1563V18-400BZC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1563V18 from Cypress Semiconductor is a 4M × 18-bit (72-Mbit), 1.8V QDR-II+ SRAM with separate read/write ports, 400 MHz clock support, 2.5-cycle read latency, and DDR interfaces on both ports enabling 800 MT/s effective data rate. It uses HSTL I/O, DLL-based timing alignment, and 165-ball FBGA packaging for high-speed networking and packet buffering applications.
For engineers reviewing the CY7C1563V18 datasheet, CY7C1563V18 pinout, CY7C1563V18 application, or CY7C1563V18 equivalent, key selection criteria include burst depth (4-word), port independence, echo clock (CQ/CQ) timing support, QVLD validity signaling, and VDDQ range (1.4V to 1.8V) compatibility with system I/O rails.
Technical Context
This device implements QDR-II+ architecture with fully independent synchronous read and write ports sharing a single multiplexed address bus. Address latching occurs on alternating rising edges of K and K clocks, enabling concurrent access without bus turnaround.
It integrates a Delay Lock Loop (DLL) for precise data placement relative to echo clocks CQ and CQ, supports depth expansion via RPS/WPS controls, and delivers full data coherency through pipelined self-timed writes and dedicated output registers synchronized to K/K edges.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4M × 18-bit = 72 Mbit; enables compact high-bandwidth buffer storage in FPGA/ASIC interconnects. |
| Max Clock Frequency | 400 MHz; defines maximum sustained transaction rate for both read and write ports. |
| Read Latency | 2.5 clock cycles; determines minimum delay between read command assertion and first valid Q[x:0] output. |
| Data Rate | 800 MT/s (DDR on K/K); doubles throughput per clock cycle versus single-data-rate interfaces. |
| VDD / VDDQ | Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4 V to 1.8 V; allows flexible interface voltage matching with 1.5V or 1.8V logic families. |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm); provides high pin count and thermal performance for dense PCB layouts. |
| Interface Standard | HSTL Class I inputs / variable-drive HSTL outputs; ensures signal integrity at >400 MHz with controlled impedance routing. |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | 18-bit parallel data sampled on rising edge of K clock during active WPS; supports partial writes via BWS[1:0]. |
| Q[17:0] | Synchronous read data output | 18-bit parallel data driven on rising edges of both K and K; tri-stated when RPS is deasserted. |
| RPS | Read port select (active low) | Enables read burst initiation; sampled on rising edge of K; output drivers auto-tri-state after deselect. |
| WPS | Write port select (active low) | Enables write operation; sampled on rising edge of K; ignores D[17:0] when deasserted. |
| BWS[1:0] | Byte write select (active low) | BWS0 controls D[8:0], BWS1 controls D[17:9]; enables selective 9-bit byte updates without disturbing other bytes. |
| K / K | Positive/negative input clocks | Rising edges control all synchronous timing; K used for address/RPS/WPS capture; K used for D[17:0] capture. |
| CQ / CQ | Echo clocks (output) | Free-running, DLL-aligned copies of K/K; simplify high-speed data capture by providing deterministic strobe timing. |
| QVLD | Data validity indicator | Asserted synchronously with CQ/CQ edges; signals that Q[17:0] contains valid burst data for current cycle. |
| ZQ | Output impedance calibration | Connects to external resistor to ground to tune CQ/CQ/Q[17:0] drive strength to match 50 Ω or 75 Ω trace impedance. |
| DOFF | DLL disable control | Pulling low disables DLL, reverting to QDR-I timing mode (max 167 MHz); must be pulled up for normal QDR-II+ operation. |
Key Features
| Feature | Design Value |
|---|---|
| Independent Read/Write Ports | Eliminates data bus turnaround overhead and contention, enabling true simultaneous read/write at full bandwidth. |
| 4-Word Burst Architecture | Transfers 72 bits (4 × 18) per read/write command, reducing address bus toggling and controller complexity. |
| Delay Lock Loop (DLL) | Aligns CQ/CQ and Q[17:0] edges to K/K with sub-cycle precision, enabling reliable sampling at 400 MHz. |
| QVLD Validity Signal | Provides explicit, edge-aligned indication of valid output data-critical for safe latch timing in FPGA receivers. |
| HSTL I/O with Variable Drive | Supports impedance-matched routing and configurable slew rate; compatible with ASIC/FPGA HSTL I/O banks. |
Applications
| High-Speed Packet Buffering | Network Switch Fabric Interface |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches. IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between line-card ASIC and switch fabric controller. Use Value: Concurrent read/write eliminates arbitration delays; 800 MT/s bandwidth sustains 10 Gbps+ line rates with low latency. |
Use Scenario: Interfacing between traffic manager and scheduler in carrier-grade routers. IC Role / Device Role / Timing Role: High-throughput memory bridge with deterministic 2.5-cycle read response for scheduling decisions. Use Value: Echo clocks (CQ/CQ) and QVLD enable robust data capture in 400 MHz systems without complex deskew circuitry. |
| FPGA-Based Protocol Acceleration | Baseband Processing in Wireless Infrastructure |
|
Use Scenario: Offloading TCP/IP checksum, encryption, or packet classification in FPGA-accelerated NICs. IC Role / Device Role / Timing Role: Local burst-access memory for FPGA soft-core processors handling real-time packet inspection. Use Value: 18-bit width matches common FPGA data paths; HSTL I/O ensures clean signal integrity at 400 MHz clock domain crossings. |
Use Scenario: Storing channelized IQ samples and FFT intermediate results in LTE/5G baseband units. IC Role / Device Role / Timing Role: Low-latency, high-bandwidth scratchpad memory for DSP pipelines requiring dual-port access. Use Value: DLL-aligned echo clocks synchronize FPGA capture logic to memory output timing, reducing setup/hold margin requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1565V18 | 2M × 36-bit configuration (same 72-Mbit density); wider data bus, fewer address bits (A[18:0]), four BWS signals. | Better suited for 32/36-bit datapath systems (e.g., wide-bus ASICs); requires different PCB layout and controller addressing. | Select when system data path width matches 36-bit and burst efficiency favors fewer address transitions over narrower word size. |
| AS7C3256B-15JCIN | 256K × 16-bit (4-Mbit) async SRAM; no DDR, no DLL, no echo clocks; 15 ns access, 3.3V only. | Limited to low-frequency control-plane buffers; lacks concurrency, bandwidth, and timing precision for data-plane use. | Only viable for non-critical, low-bandwidth auxiliary storage where QDR-II+ features are unnecessary. |
Compared with CY7C1565V18, CY7C1563V18 offers higher per-pin efficiency in 18-bit systems and simpler BWS decoding; compared with AS7C3256B-15JCIN, it delivers 16× more bandwidth and deterministic timing essential for real-time packet processing.
Availability
CY7C1563V18 is available at Aetrix Electronics and suitable for high-speed packet buffering, network switch fabric interfaces, FPGA-based protocol acceleration, and baseband processing applications requiring stable component supply and long-term industrial availability.
Supply support for CY7C1563V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, computing, and industrial markets.
CY7C1563V18 belongs to the QDR-II+ SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory needs in networking and telecom infrastructure.
FAQ
What is the function of the DOFF pin on CY7C1563V18?
The DOFF pin disables the internal Delay Lock Loop when pulled low, forcing the device into QDR-I timing mode with reduced maximum frequency (167 MHz). For standard QDR-II+ operation at 400 MHz, DOFF must be externally pulled up to VDDQ using ≤10 kΩ resistor. Leaving DOFF floating or tied to ground invalidates QDR-II+ timing specifications.
How does the ZQ pin affect output drive strength?
ZQ connects to an external resistor (RQ) to ground to calibrate the output impedance of Q[17:0], CQ, and CQ pins to 0.2 × RQ. With RQ = 240 Ω, outputs are tuned to ~48 Ω for 50 Ω PCB traces. Alternatively, tying ZQ to VDDQ enables minimum-impedance mode (~25 Ω), useful for short, heavily loaded nets.
Can CY7C1563V18 operate with only one clock input?
No. The device requires both K and K clocks for full functionality: K captures address, RPS, and WPS; K captures write data D[17:0]. Both clocks drive DDR output timing and echo clock generation. Omitting either clock violates timing and prevents correct burst operation or data capture.
What happens to Q[17:0] when RPS is deasserted?
When RPS is deasserted (high), the read port is deselected. The current read burst completes, and Q[17:0] are automatically tri-stated on the next rising edge of the K clock. No dummy or undefined data is driven; the bus enters high-impedance state immediately after final valid word transfer.
CY7C1563V18-400BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1563V18-400BZC FAQ
1.How can I place an order for CY7C1563V18-400BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1563V18-400BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1563V18-400BZC reliable?
The price and inventory of CY7C1563V18-400BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1563V18-400BZC is usually 5 days.
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Once your CY7C1563V18-400BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1563V18-400BZC?
For technical support, including CY7C1563V18-400BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1563V18-400BZC requirements.
6.How does Aetrix verify that CY7C1563V18-400BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1563V18-400BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1563V18-400BZC meets industry standards.
7.What is the process for return or replacement of CY7C1563V18-400BZC?
All CY7C1563V18-400BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1563V18-400BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1563V18-400BZC part is unused and in its original packaging.
Return procedure for CY7C1563V18-400BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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