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Infineon Technologies CY7C1564XV18-366BZXC

Part No.:
CY7C1564XV18-366BZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1564XV18-366BZXC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,401

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Product details

Overview

CY7C1564XV18-366BZXC from Cypress Semiconductor is a 2M × 36, 72-Mbit QDR® II+ Xtreme SRAM with separate read/write ports, 2.5-cycle read latency, 366 MHz operation (900 Mbps DDR data rate), and HSTL I/Os supporting 1.5 V supply. It delivers concurrent burst transfers in high-bandwidth networking buffers and packet processors.

For engineers reviewing the CY7C1564XV18-366BZXC datasheet, CY7C1564XV18-366BZXC pinout, CY7C1564XV18-366BZXC application, or CY7C1564XV18-366BZXC equivalent, key selection criteria include dual-port timing independence, echo clock (CQ/CQ) synchronization for high-speed capture, DOFF-configurable latency mode, and 165-ball FBGA package compatibility with dense PCB layouts.

Technical Context

This SRAM implements QDR II+ Xtreme architecture with fully independent synchronous read and write ports sharing one multiplexed address bus. Address latching occurs on alternating rising edges of K and K clocks, enabling true concurrency without bus turnaround.

It integrates a PLL for precise data placement, supports programmable output impedance via ZQ calibration, and uses edge-aligned QVLD to indicate valid DDR output data synchronized to CQ/CQ. The DOFF pin selects between 2.5-cycle (PLL enabled) and 1-cycle (QDR-I mode) read latency.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 organization)
Max Clock Frequency 366 MHz - enables 732 MT/s effective throughput per port
Read Latency 2.5 cycles (DOFF = HIGH) - deterministic timing for pipeline alignment
Data Rate 900 Mbps DDR - two 36-bit words per clock cycle on each port
Supply Voltages VDD = 1.8 V ±0.1 V; VDDQ = 1.4–1.6 V - supports 1.5 V I/O interface standard
Interface Standard HSTL Class I inputs / variable-drive HSTL outputs - ensures signal integrity at >300 MHz
Package 165-ball FBGA (13 × 15 × 1.4 mm) - fine-pitch layout for high-speed routing

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, with 0.8 mm ball pitch.

Pin/Terminal Circuit Role Design Meaning
D[35:0] Synchronous write data input 36-bit wide DDR input bus sampled on rising edges of K/K; supports byte-selectable writes via BWS[3:0]
Q[35:0] Synchronous read data output 36-bit wide DDR output bus edge-aligned to CQ/CQ; tristated when RPS inactive
K / K Dual-phase input clocks Rising edges control all synchronous operations; K drives read port, K drives write port
CQ / CQ Output-synchronized echo clocks Free-running copies of K/K with matched skew - enable source-synchronous data capture
QVLD Valid data indicator Asserted coincident with first valid Q[35:0] word - eliminates need for fixed delay margining
DOFF PLL disable control LOW forces QDR-I mode (1-cycle latency, ≤167 MHz); HIGH enables full QDR-II+ timing
ZQ Output impedance calibration reference Connect to resistor-to-ground (RQ) to tune CQ/Q output drive strength to match 50 Ω trace impedance

Key Features

Feature Design Value
Separate read/write ports Eliminates data bus turnaround delays and contention - enables sustained full-duplex bandwidth
Two-word burst architecture Reduces required address transition rate by 2× - lowers routing complexity and timing closure effort
Edge-aligned QVLD + echo clocks Removes setup/hold uncertainty at receiver - simplifies PCB layout and eliminates external delay tuning
Programmable output impedance (ZQ) Enables dynamic drive strength matching to PCB trace impedance - improves signal integrity without board redesign
DOFF-configurable latency mode Single-pin hardware switch between QDR-II+ (2.5-cycle) and legacy QDR-I (1-cycle) timing - aids migration and interoperability

Applications

Network Packet Buffer High-Speed Test Equipment Memory

Use Scenario: Storing ingress/egress packet headers and payloads in 10G/25G Ethernet line cards.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-latency buffer between MAC and traffic manager, with concurrent read (transmit path) and write (receive path) access.

Use Value: 900 Mbps DDR throughput per port sustains line-rate packet buffering without stall cycles or FIFO overflow.

Use Scenario: Capturing high-fidelity waveform samples in automated test equipment (ATE) pattern generators.

IC Role / Device Role / Timing Role: High-speed acquisition memory interfacing directly to 36-bit parallel DACs and ADCs with deterministic 2.5-cycle latency.

Use Value: Echo clocks (CQ/CQ) and QVLD eliminate timing margining overhead - enabling reliable 366 MHz sampling without custom delay ICs.

Telecom Baseband Processing Real-Time Video Frame Buffer

Use Scenario: Interleaving channelized data streams in LTE/5G baseband units with strict jitter tolerance.

IC Role / Device Role / Timing Role: Synchronous burst memory providing low-jitter, phase-locked data staging between FPGA-based FFT engines and RF front-end interfaces.

Use Value: PLL-derived timing and HSTL I/Os maintain <15 ps cycle-to-cycle jitter - meeting 3GPP TS 36.104 spectral mask requirements.

Use Scenario: Storing uncompressed 4K video frames in broadcast graphics processors requiring sub-microsecond access.

IC Role / Device Role / Timing Role: Dual-port frame buffer allowing simultaneous write of incoming sensor data and read of rendered overlay layers.

Use Value: Concurrent 36-bit reads/writes at 366 MHz deliver 26.4 GB/s aggregate bandwidth - sufficient for 60 fps 4K@12-bit RGB.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C36256A-166BIN Asynchronous 256K × 36 SRAM; no DDR, no echo clocks, no PLL; 166 MHz max Lacks concurrent read/write; requires external handshake logic; unsuitable for >200 MHz systems Select only for cost-sensitive, non-pipelined designs where latency predictability is secondary to BOM simplicity
MT47H64M16HR-37E DDR2 SDRAM; 64M × 16; 375 MHz clock; requires refresh, command decoding, and burst-length configuration Higher density but adds controller overhead; not pin-compatible; introduces variable latency Choose when system already includes DDR2 controller and needs >72 Mbit capacity; avoid for deterministic real-time buffering

Compared with AS7C36256A-166BIN and MT47H64M16HR-37E, CY7C1564XV18-366BZXC provides guaranteed 2.5-cycle latency, zero-refresh operation, and native echo-clock timing - making it uniquely suited for jitter-critical, full-duplex packet and sample buffering where deterministic bandwidth is non-negotiable.

Availability

CY7C1564XV18-366BZXC is available at Aetrix Electronics and suitable for network packet buffering, high-speed test instrumentation, telecom baseband processing, and real-time video frame storage requiring stable component supply across multi-year production cycles.

Supply support for CY7C1564XV18-366BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications systems, with focus on signal integrity, timing precision, and power efficiency.

CY7C1564XV18 belongs to the QDR® II+ Xtreme SRAM product line, engineered specifically for deterministic, low-latency, full-duplex data buffering in infrastructure-grade networking and test equipment where bus turnaround overhead must be eliminated.

FAQ

What is the function of the DOFF pin on CY7C1564XV18-366BZXC?

The DOFF pin controls internal PLL operation: when pulled HIGH, the device operates in QDR-II+ mode with 2.5-cycle read latency and up to 366 MHz clock rate; when pulled LOW, it reverts to QDR-I mode with 1-cycle latency and maximum 167 MHz operation. This allows hardware-selectable timing modes without firmware changes or external configuration registers.

How does the ZQ pin affect signal integrity in high-speed designs?

ZQ enables on-die output impedance calibration: connecting an external resistor (typically 50 Ω) between ZQ and ground tunes CQ, CQ, and Q[35:0] driver strength to match PCB trace impedance. This reduces reflections and improves eye diagram margins - critical for reliable 900 Mbps DDR signaling without adding series termination resistors.

Can CY7C1564XV18-366BZXC perform simultaneous read and write operations to the same memory location?

No - while read and write ports operate concurrently, the device enforces data coherency by ensuring that a read access returns the most recently written data. Internal arbitration prevents conflicting access to the same address during overlapping cycles, guaranteeing consistent output even under full-duplex load without external lock logic.

What is the purpose of the QVLD signal, and how is it timed relative to CQ and Q[35:0]?

QVLD is asserted synchronously with the first valid 36-bit word on Q[35:0], edge-aligned to the rising edge of CQ (for read port). It eliminates the need for fixed delay compensation or eye-centering algorithms at the receiver - designers can use QVLD directly as a latch-enable signal for downstream capture registers, reducing timing closure effort.

CY7C1564XV18-366BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
366 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1564XV18-366BZXC FAQ

1.How can I place an order for CY7C1564XV18-366BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1564XV18-366BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1564XV18-366BZXC reliable?

The price and inventory of CY7C1564XV18-366BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1564XV18-366BZXC is usually 5 days.

3.What payment methods are accepted for CY7C1564XV18-366BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1564XV18-366BZXC transactions.

Note: Certain payment methods may incur a processing fee.

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CY7C1564XV18-366BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1564XV18-366BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1564XV18-366BZXC?

For technical support, including CY7C1564XV18-366BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1564XV18-366BZXC requirements.

6.How does Aetrix verify that CY7C1564XV18-366BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1564XV18-366BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1564XV18-366BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1564XV18-366BZXC?

All CY7C1564XV18-366BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1564XV18-366BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1564XV18-366BZXC part is unused and in its original packaging.

Return procedure for CY7C1564XV18-366BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1564XV18-366BZXC Tags

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