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Infineon Technologies CY7C1565KV18-400BZI

Part No.:
CY7C1565KV18-400BZI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1565KV18-400BZI.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,298

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Product details

Overview

CY7C1565KV18-400BZI from Cypress Semiconductor is a 72-Mbit (2M × 36) QDR® II+ SRAM with four-word burst architecture, 2.5-cycle read latency, and dual DDR interfaces operating at 400 MHz (800 MT/s effective data rate). It features separate read/write ports, echo clocks (CQ/CQ), QVLD data-valid indicator, and PLL-based timing alignment - deployed in high-bandwidth packet buffering for network switches and routers.

For engineers reviewing the CY7C1565KV18-400BZI datasheet, CY7C1565KV18-400BZI pinout, CY7C1565KV18-400BZI application, or CY7C1565KV18-400BZI equivalent, key selection criteria include 1.8-V core / 1.4–1.8-V I/O supply compatibility, 165-ball FBGA (13 × 15 mm) package constraints, QDR II+ vs. QDR I mode switching via DOFF pin, and synchronous depth expansion using RPS/WPS controls.

Technical Context

The device implements a true quad data rate architecture with independent read and write ports sharing a multiplexed 19-bit address bus. All synchronous inputs (RPS, WPS, BWS[3:0], A[18:0], D[35:0]) are registered on rising edges of K and K clocks, while outputs (Q[35:0], QVLD, CQ, CQ) are edge-aligned to those same clocks. The internal PLL enables precise 2.5-cycle read latency when DOFF = HIGH.

Each read access delivers four sequential 36-bit words over two clock cycles (DDR), achieving full data coherency without bus turnaround. Write operations are self-timed and support byte-selectable writes via BWS[3:0], with dedicated port selects enabling depth expansion across multiple devices without external logic.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 organization), enabling 9 MB of high-speed buffer storage per device
Max Clock Frequency 400 MHz (K/K), supporting 800 MT/s effective throughput on both read and write ports
Read Latency 2.5 clock cycles (DOFF = HIGH); reduces pipeline stalls in burst-intensive traffic shaping
Core Supply VDD = 1.8 V ± 0.1 V - mandates tight regulation for stable QDR II+ timing margins
I/O Supply Range VDDQ = 1.4 V to 1.8 V - supports interoperability with 1.5-V and 1.8-V HSTL-15/18 systems
Package 165-ball FBGA (13 × 15 × 1.4 mm), 0.8-mm pitch - requires controlled impedance PCB layout for CQ/Q[35:0] routing
Output Impedance Control ZQ pin tunes CQ/CQ/Q[35:0] output drive to match system bus (0.2 × RQ), minimizing signal reflections

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
K / K Input clocks (positive/negative) Rising edges latch all synchronous inputs and time Q[35:0] output transitions; K drives read port, K drives write port
CQ / CQ Echo clocks Free-running, phase-aligned copies of K/K used by FPGA/ASIC receivers to capture Q[35:0] with zero setup/hold margin
Q[35:0] Read data outputs DDR outputs delivering four 36-bit words per access; tri-stated automatically when RPS is deasserted
D[35:0] Write data inputs DDR inputs sampled on K/K rising edges; each word written synchronously with address and BWS control
RPS / WPS Port select controls Active-LOW enables independent read/write initiation; allows concurrent transactions without arbitration logic
BWS[3:0] Byte write selects Active-LOW per-byte enables partial writes: BWS0→D[8:0], BWS1→D[17:9], BWS2→D[26:18], BWS3→D[35:27]
DOFF PLL disable input When LOW, disables PLL and reverts to QDR I mode (1-cycle latency, ≤167 MHz max); must be pulled HIGH for QDR II+ operation
QVLD Data validity indicator Edge-aligned with CQ/CQ; asserts one cycle before first valid Q[35:0] word, enabling reliable DDR capture in logic

Key Features

Feature Design Value
Separate read/write ports Eliminates data bus turnaround overhead and contention, enabling deterministic full-duplex memory access
Four-word burst + DDR interface Delivers 144 bits per clock cycle (36 × 4) at 400 MHz → 57.6 Gb/s aggregate bandwidth per port
Programmable output impedance (ZQ) Matches 40–60 Ω trace impedances without external termination resistors, reducing BOM count and board area
Synchronous depth expansion RPS/WPS enable stacking of multiple CY7C1565KV18 devices with no glue logic - each port scales independently
JTAG 1149.1 boundary scan Enables production test and debug of high-speed SRAM interconnects without physical probe access

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing ingress/egress packets in multi-gigabit Ethernet switches with strict latency budgets.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as non-blocking FIFO buffer between MAC and switch fabric, synchronized to line-rate clocks.

Use Value: 2.5-cycle read latency and concurrent read/write eliminate backpressure-induced packet drops under 100% line-rate traffic.

Use Scenario: Holding frame headers and metadata in 10G/25G optical transport equipment requiring low-jitter timing.

IC Role / Device Role / Timing Role: High-speed scratchpad memory interfacing directly with SerDes PHY controllers and DSP engines.

Use Value: Echo clocks (CQ/CQ) and QVLD enable sub-100 ps capture window for DDR data, meeting SONET/OTN jitter compliance.

Baseband Processing Cache Test Equipment Pattern Memory

Use Scenario: Temporary storage of IQ samples during real-time LTE/5G modulation/demodulation in wireless base stations.

IC Role / Device Role / Timing Role: Burst-access cache bridging FPGA-based FFT engines and RF front-end DMA controllers.

Use Value: Four-word burst transfers align precisely with 128-point FFT block sizes, maximizing memory utilization and minimizing stall cycles.

Use Scenario: Storing high-resolution stimulus/response vectors in automated semiconductor test systems (ATE).

IC Role / Device Role / Timing Role: Deterministic-access pattern generator memory synchronized to 400 MHz ATE clock domains.

Use Value: Synchronous self-timed writes guarantee write completion within fixed 2-cycle window, enabling precise vector timing control.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C36256P-15JIN Asynchronous 256K × 36 SRAM; no DDR, no echo clocks, no PLL; 15 ns access time Limited to ≤100 MHz systems; lacks burst capability and concurrent port operation Select only for cost-sensitive, low-frequency control-plane buffers where latency predictability outweighs bandwidth needs
IS61WV102436BLL-15BLI Synchronous 1M × 36 with single-port, 1.8-V core, but no QDR architecture or echo clocks Requires external arbitration logic for full-duplex use; maximum 133 MHz clock, halving bandwidth vs. CY7C1565KV18-400BZI Choose only when footprint compatibility with legacy designs is mandatory and bandwidth requirements are ≤10 Gb/s

Compared with AS7C36256P-15JIN and IS61WV102436BLL-15BLI, CY7C1565KV18-400BZI uniquely delivers concurrent DDR read/write at 400 MHz with hardware-managed timing (CQ/QVLD/PLL), making it irreplaceable in line-rate packet processing where bus turnaround and jitter-limited capture are design-critical.

Availability

CY7C1565KV18-400BZI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing cache, and ATE pattern memory requiring stable component supply across multi-year production cycles.

Supply support for CY7C1565KV18-400BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and timing precision.

The QDR® II+ SRAM product line targets deterministic, low-latency, high-throughput memory subsystems in infrastructure equipment - specifically engineered to replace asynchronous SRAMs and simplify DDR interface timing in FPGA- and ASIC-based datapaths.

FAQ

What is the function of the DOFF pin, and how does it affect timing?

The DOFF pin disables the internal PLL when asserted LOW, forcing the device into QDR I mode with 1-cycle read latency and a maximum frequency of 167 MHz. When DOFF is HIGH (default), the PLL enables 2.5-cycle latency and full 400 MHz operation. Pulling DOFF HIGH via ≤10 kΩ resistor is required for QDR II+ functionality; leaving it floating or tied LOW invalidates QDR II+ timing specifications.

How does the ZQ pin configure output drive strength?

ZQ connects to an external resistor (RQ) to ground, setting CQ, CQ, and Q[35:0] output impedance to 0.2 × RQ - typically 40 Ω for 200 Ω RQ. Alternatively, tying ZQ to VDDQ enables minimum impedance mode (~20 Ω). ZQ must never be left floating or connected to GND, as this disables impedance calibration and risks signal integrity failure.

Can CY7C1565KV18-400BZI operate with only one clock input?

No. The device requires both K and K differential clock inputs for correct DDR operation: K clocks read-port signals (RPS, A, Q[35:0], CQ), and K clocks write-port signals (WPS, BWS[3:0], D[35:0], CQ). Using only one clock violates timing specifications and prevents valid data capture on either port.

What happens to Q[35:0] when RPS is deasserted mid-burst?

When RPS is deasserted, the current read burst completes normally, and Q[35:0] drivers are tri-stated on the next rising edge of K. No partial or corrupted words are driven; the final word of the four-word burst remains valid until tri-state activation. This ensures clean bus release without glitches or contention.

CY7C1565KV18-400BZI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
400 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1565KV18-400BZI FAQ

1.How can I place an order for CY7C1565KV18-400BZI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1565KV18-400BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1565KV18-400BZI reliable?

The price and inventory of CY7C1565KV18-400BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1565KV18-400BZI is usually 5 days.

3.What payment methods are accepted for CY7C1565KV18-400BZI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1565KV18-400BZI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1565KV18-400BZI?

CY7C1565KV18-400BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1565KV18-400BZI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1565KV18-400BZI?

For technical support, including CY7C1565KV18-400BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1565KV18-400BZI requirements.

6.How does Aetrix verify that CY7C1565KV18-400BZI is sourced from the original manufacturer or authorized distributors?

All CY7C1565KV18-400BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1565KV18-400BZI meets industry standards.

7.What is the process for return or replacement of CY7C1565KV18-400BZI?

All CY7C1565KV18-400BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1565KV18-400BZI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1565KV18-400BZI part is unused and in its original packaging.

Return procedure for CY7C1565KV18-400BZI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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