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Infineon Technologies CY7C1565KV18-400BZXI

Part No.:
CY7C1565KV18-400BZXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1565KV18-400BZXI.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,340

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Product details

Overview

CY7C1565KV18-400BZXI from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with 2M × 36 organization, 400 MHz maximum clock frequency, 2.5-cycle read latency (DOFF = HIGH), and 165-ball FBGA (13 × 15 × 1.4 mm) package. It features separate read/write ports, DDR interfaces on both ports, echo clocks (CQ/CQ), and QVLD data-valid indicator - deployed in high-bandwidth packet buffering for network line cards and telecom switching fabric.

For engineers reviewing the CY7C1565KV18-400BZXI datasheet, CY7C1565KV18-400BZXI pinout, CY7C1565KV18-400BZXI application, or CY7C1565KV18-400BZXI equivalent, key selection criteria include burst depth (four 36-bit words), VDDQ support range (1.4 V to 1.8 V), PLL-enabled timing alignment, HSTL I/O compatibility, and JTAG 1149.1 test access capability.

Technical Context

The device implements a synchronous pipelined architecture with independent read and write ports sharing a multiplexed 19-bit address bus. All inputs (A, D[35:0], RPS, WPS, BWS[3:0]) are registered on rising edges of K/K clocks; all outputs (Q[35:0], QVLD, CQ/CQ) are edge-aligned to K/K with output registers. The internal 512K × 36 × 4 array enables full data coherency and concurrent read/write transactions without bus turnaround.

Operation mode is determined by DOFF: HIGH enables QDR II+ mode (2.5-cycle latency, up to 400 MHz), LOW forces QDR I mode (1-cycle latency, ≤167 MHz). A PLL synchronizes internal timing for precise data placement, while ZQ pin calibrates output impedance to match system bus (0.2 × RQ or min-impedance mode).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 organization)
Max Clock Frequency 400 MHz - defines maximum sustained bandwidth of 2.88 GB/s (4 × 36-bit × 400 MHz)
Read Latency 2.5 cycles (with DOFF = HIGH) - determines minimum time from address latch to first valid Q-word
VDD / VDDQ Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4 V to 1.8 V - supports mixed-voltage system integration
Interface Standard HSTL Class I inputs / variable-drive HSTL outputs - ensures signal integrity at >400 MHz DDR rates
Package 165-ball FBGA (13 × 15 × 1.4 mm) - provides 0.8 mm ball pitch, thermal and electrical performance for dense PCB layouts
JTAG Support IEEE 1149.1 compliant TAP - enables boundary-scan testing and production validation

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, Pb-free compatible.

Pin/Terminal Circuit Role Design Meaning
K / K Input clocks Rising edges control all synchronous register sampling and output timing; K drives read port, K drives write port
CQ / CQ Echo clocks Free-running, edge-aligned copies of K/K - simplify high-speed data capture in FPGA/ASIC receivers
Q[35:0] Read data outputs DDR outputs delivering four sequential 36-bit words per access; tri-stated when RPS is deasserted
D[35:0] Write data inputs DDR inputs accepting four sequential 36-bit words; ignored unless WPS is asserted
RPS / WPS Port select controls Active-LOW signals enabling independent read/write port activation; allow depth expansion via port gating
BWS[3:0] Byte write selects Active-LOW per-byte enables (BWS0–BWS3 cover D[8:0] to D[35:27]); enable partial writes without read-modify-write
QVLD Data validity indicator Output pulse edge-aligned to CQ/CQ - unambiguously signals when Q[35:0] carries valid burst data
ZQ Impedance calibration input Connects to external resistor to ground to tune CQ/CQ/Q[35:0] output drive strength to system trace impedance
DOFF PLL disable control Active-LOW pin forcing QDR I mode (1-cycle latency); required for fallback operation or low-frequency initialization

Key Features

Feature Design Value
Four-word burst architecture Reduces address bus toggling frequency by 4× versus single-word access - lowers EMI and routing complexity
Separate read/write data paths Eliminates data bus turnaround delays and contention - enables true concurrent read/write at full bandwidth
Programmable output impedance (ZQ) Enables dynamic matching to PCB trace impedance without external termination resistors - improves signal fidelity
Synchronous self-timed writes Internal write sequencing eliminates external write-strobe timing constraints - simplifies controller interface logic
QVLD + echo clocks (CQ/CQ) Provides deterministic, jitter-tolerant data capture window for FPGA/ASIC receivers - reduces setup/hold margin requirements

Applications

Network Packet Buffering Telecom Switch Fabric

Use Scenario: Storing ingress/egress packets in 10G/40G line cards where bursty traffic demands zero-latency memory access.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between ingress parser and egress scheduler, synchronized to line-rate clocks.

Use Value: 2.5-cycle latency and concurrent read/write enable real-time packet reordering without pipeline stalls.

Use Scenario: Interconnecting crosspoint switch ASICs in carrier-grade TDM-over-IP systems requiring deterministic latency.

IC Role / Device Role / Timing Role: High-throughput memory node providing synchronized data staging between switch stages and control processors.

Use Value: Four-word burst and echo clocks ensure sub-nanosecond timing alignment across multi-chip switch fabrics.

High-Speed Test Equipment Memory Avionics Data Acquisition Buffer

Use Scenario: Capturing high-resolution waveform samples in automated test equipment (ATE) with >500 MS/s sampling rates.

IC Role / Device Role / Timing Role: Burst-capable buffer interfacing directly to ADC/DAC controllers, clocked from precision timing modules.

Use Value: HSTL I/O and 400 MHz operation sustain continuous streaming into FPGA-based processing pipelines.

Use Scenario: Real-time sensor fusion in flight control units where ARINC-429 and MIL-STD-1553 data must be time-correlated.

IC Role / Device Role / Timing Role: Deterministic latency SRAM buffering time-stamped sensor frames prior to DSP analysis.

Use Value: QVLD and PLL-aligned outputs guarantee timestamp accuracy within ±100 ps across temperature and voltage.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II+ SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1565KV18-550BZXI Higher max clock (550 MHz), same 2.5-cycle latency, identical pinout/package Requires tighter timing closure and higher power (1310 mA vs. 1000 mA at 400 MHz) Select when system clock budget allows >400 MHz and bandwidth >3.96 GB/s is required
AS7C362000B-400BIN Asynchronous SRAM, 2M × 36, no DDR/QDR architecture, no echo clocks or QVLD Limited to ≤100 MHz random-access; lacks burst concurrency and timing alignment features Only viable for non-real-time buffering where latency and bandwidth are secondary to cost and simplicity

Compared with CY7C1565KV18-400BZXI, the -550BZXI delivers 37.5% higher bandwidth but increases power and layout complexity; the AS7C362000B-400BIN sacrifices deterministic timing and concurrency for lower cost and simpler interface - making it unsuitable for QDR-dependent systems.

Availability

CY7C1565KV18-400BZXI is available at Aetrix Electronics and suitable for network packet buffering, telecom switch fabric, and high-speed test equipment requiring stable component supply, long-lifecycle support, and guaranteed Pb-free compliance.

Supply support for CY7C1565KV18-400BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with focus on signal integrity and timing-critical systems.

The CY7C1565KV18 belongs to Cypress's QDR® II+ SRAM product line, engineered specifically for deterministic, high-bandwidth memory access in packet-switched infrastructure where bus turnaround and latency variability must be eliminated.

FAQ

What is the function of the DOFF pin, and how does it affect timing?

The DOFF pin disables the internal PLL when driven LOW, forcing the device into QDR I mode with 1-cycle read latency and reduced maximum frequency (≤167 MHz). In normal QDR II+ operation (DOFF = HIGH), the PLL enables precise 2.5-cycle latency and 400 MHz operation. This dual-mode capability supports flexible initialization sequences and fallback timing margins during system bring-up.

How does the ZQ pin calibrate output impedance, and what external component is required?

ZQ connects to an external resistor (RQ) tied to ground; the device measures RQ and configures its CQ, CQ, and Q[35:0] output drivers to 0.2 × RQ. A typical RQ value is 50 Ω, yielding 10 Ω driver impedance. Alternatively, tying ZQ to VDDQ enables minimum-impedance mode. ZQ must never be left floating or connected to GND.

Can CY7C1565KV18-400BZXI support depth expansion, and how is it implemented?

Yes - depth expansion is achieved using RPS and WPS pins as port-select enables. Multiple devices can share the same address and data buses; asserting RPS/WPS on only one device per transaction isolates its read/write port. This allows stacking devices to increase total memory depth while preserving burst concurrency and timing alignment across the bank.

What is the role of QVLD, and why is it critical in high-speed systems?

QVLD is an active-HIGH output pulse edge-aligned to CQ/CQ that asserts exactly when Q[35:0] carries valid data from the current burst. In FPGA-based receivers, QVLD replaces complex clock-domain crossing logic by providing a deterministic, jitter-immune strobe - reducing timing uncertainty and eliminating metastability risk in >400 MHz DDR capture paths.

CY7C1565KV18-400BZXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
400 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1565KV18-400BZXI FAQ

1.How can I place an order for CY7C1565KV18-400BZXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1565KV18-400BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1565KV18-400BZXI reliable?

The price and inventory of CY7C1565KV18-400BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1565KV18-400BZXI is usually 5 days.

3.What payment methods are accepted for CY7C1565KV18-400BZXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1565KV18-400BZXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1565KV18-400BZXI?

CY7C1565KV18-400BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1565KV18-400BZXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1565KV18-400BZXI?

For technical support, including CY7C1565KV18-400BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1565KV18-400BZXI requirements.

6.How does Aetrix verify that CY7C1565KV18-400BZXI is sourced from the original manufacturer or authorized distributors?

All CY7C1565KV18-400BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1565KV18-400BZXI meets industry standards.

7.What is the process for return or replacement of CY7C1565KV18-400BZXI?

All CY7C1565KV18-400BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1565KV18-400BZXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1565KV18-400BZXI part is unused and in its original packaging.

Return procedure for CY7C1565KV18-400BZXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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