Infineon Technologies CY7C1565KV18-450BZXC
- Part No.:
- CY7C1565KV18-450BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1565KV18-450BZXC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,205
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1565KV18-450BZXC from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with 2M × 36 organization, 450 MHz maximum clock frequency, 2.5-cycle read latency (DOFF = HIGH), and 165-ball FBGA (13 × 15 × 1.4 mm) package. It features separate read/write ports, DDR interfaces on both ports (2.2 Gbps effective data rate), and HSTL I/O with VDDQ = 1.4–1.8 V. Used in high-bandwidth packet buffering for network line cards and telecom switching fabric.
For engineers reviewing the CY7C1565KV18-450BZXC datasheet, CY7C1565KV18-450BZXC pinout, CY7C1565KV18-450BZXC application, or CY7C1565KV18-450BZXC equivalent, key selection criteria include burst depth (4-word), PLL-enabled timing control (K/K, CQ/CQ), QVLD data validity signaling, and byte-write select (BWS[3:0]) granularity for partial writes in multi-protocol memory systems.
Technical Context
The device implements true quad data rate architecture via independent read/write ports with fully pipelined, synchronous operation. All inputs (A[18:0], D[35:0], RPS, WPS, BWS[3:0]) are registered on rising edges of K or K clocks, and all outputs (Q[35:0], QVLD, CQ, CQ) are edge-aligned to those clocks. The internal 512K × 36 × 4 array enables four sequential 36-bit word bursts per access.
PLL-based clock synthesis ensures precise data placement relative to echo clocks (CQ/CQ), supporting reliable capture at 1100 MT/s. DOFF pin selects between QDR II+ mode (2.5-cycle latency, up to 450 MHz) and legacy QDR I mode (1-cycle latency, ≤167 MHz). ZQ pin enables programmable output impedance matching to system bus termination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36), enabling 9 MB frame buffers for 10G Ethernet line-rate traffic shaping |
| Max Clock Frequency | 450 MHz - supports 900 MT/s DDR interface, delivering 32.4 GB/s aggregate bandwidth (36-bit × 2 × 450 MHz) |
| Read Latency | 2.5 cycles (DOFF = HIGH) - deterministic timing for pipeline-synchronized switch fabric lookups |
| VDD / VDDQ | Core VDD = 1.8 V ±0.1 V; I/O VDDQ = 1.4–1.8 V - allows interoperability with 1.5 V or 1.8 V HSTL-18/15 systems |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - industry-standard footprint compatible with automated optical inspection and thermal reflow profiles |
| Interface Standard | HSTL Class I inputs / variable-drive HSTL outputs - meets JEDEC JESD8-15A for signal integrity at >500 MHz |
| JTAG Support | IEEE 1149.1 compliant TAP controller - enables boundary scan testing without external test fixtures |
Pinout & Package
165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free option available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K / K | Input clocks (positive/negative) | Rising edges sample all synchronous inputs (A, D, RPS, WPS, BWS); define Q[35:0] output timing and burst sequencing |
| CQ / CQ | Echo clocks (output) | Free-running, phase-aligned copies of K/K used by external logic to latch Q[35:0] with zero setup/hold margin |
| Q[35:0] | Read data outputs | 36-bit DDR outputs driven on both K and K rising edges; tri-stated when RPS is deasserted |
| D[35:0] | Write data inputs | 36-bit DDR inputs sampled on K/K rising edges during active write cycles; ignored if WPS inactive |
| RPS / WPS | Port select controls | Active-low enables read/write port independently; allows concurrent read/write to different addresses |
| BWS[3:0] | Byte write selects | Four independent active-low signals controlling 9-bit byte lanes (D[8:0] to D[35:27]); enables partial-word updates without read-modify-write |
| QVLD | Data validity indicator | Asserted coincident with first valid Q[35:0] word in burst; synchronized to CQ/CQ for safe capture |
| ZQ | Impedance calibration input | Connects to external 240 Ω resistor to ground to calibrate output driver strength to match 50 Ω trace impedance |
| DOFF | PLL disable control | Pull LOW to bypass PLL and operate in QDR I mode (1-cycle latency, max 167 MHz); pull HIGH for full QDR II+ performance |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Eliminates data bus turnaround delays - enables simultaneous 100% read + write throughput in packet forwarding engines |
| Four-word burst architecture | Reduces address bus toggling by 75% vs. single-word access - lowers EMI and simplifies routing in dense switch ASIC interconnects |
| Programmable output impedance (ZQ) | Calibrates Q[35:0] drive strength to match PCB trace impedance - improves signal integrity without external series resistors |
| QVLD synchronization | Edge-aligned with CQ/CQ - removes need for external delay chains or dynamic deskew logic in high-speed SerDes buffer designs |
| Depth expansion support | RPS/WPS enable stacking multiple devices with independent port control - scales memory width without adding address demux logic |
Applications
| Network Packet Buffering | Telecom Switch Fabric |
|---|---|
|
Use Scenario: Storing ingress/egress packets in 10G/25G line cards with strict latency budgets. IC Role / Device Role / Timing Role: High-throughput, low-latency SRAM acting as dual-port FIFO with deterministic 2.5-cycle read response. Use Value: Concurrent read/write avoids head-of-line blocking; QVLD eliminates timing uncertainty in packet header extraction pipelines. |
Use Scenario: Interconnecting distributed switch ASICs in modular chassis-based routers. IC Role / Device Role / Timing Role: Shared memory buffer for crossbar arbitration tables and queue state tracking. Use Value: Four-word burst reduces address bus congestion across backplane traces; HSTL I/O ensures clean signal integrity over 15 cm FR4 runs. |
| Baseband Processing Memory | Test Equipment Pattern Memory |
|
Use Scenario: Holding channel estimation coefficients and FFT output buffers in LTE/5G massive MIMO baseband units. IC Role / Device Role / Timing Role: Synchronous burst memory interfacing directly to FPGA-based DSP cores with K/K clock domain crossing. Use Value: Independent RPS/WPS allows parallel coefficient loading and real-time lookup; DOFF pin enables fallback to QDR I mode during debug. |
Use Scenario: Storing high-speed digital stimulus/response patterns in ATE systems requiring >500 MHz pattern rates. IC Role / Device Role / Timing Role: Deterministic-access memory with echo clocks (CQ/CQ) for sub-100 ps capture window alignment. Use Value: ZQ calibration ensures consistent edge placement across 165 pins; BWS[3:0] enables selective update of test vectors without full reload. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T36150L10BG | 72-Mbit QDR II+ (2M × 36), 1000 Mbps DDR, but uses SSTL-18 I/O and requires 1.8 V VDDQ only | Lacks ZQ calibration and QVLD; relies on fixed output drive strength and external timing margining | Select when migrating from IDT-based platforms with existing SSTL-18 infrastructure and no need for impedance tuning |
| ISSI IS61WV102436B | 128-Mbit QDR II (2M × 64), 350 MHz max, no PLL - fixed 1-cycle latency, no DOFF mode switching | Higher density but lower speed; lacks echo clocks and QVLD - requires external capture logic for reliable data sampling | Select when bandwidth demand is lower (<25 GB/s) and board space permits larger 225-ball FBGA; avoid for <5 ns timing-critical paths |
Compared with IDT72T36150L10BG and IS61WV102436B, CY7C1565KV18-450BZXC provides unique combination of programmable impedance (ZQ), data validity signaling (QVLD), and dual-mode latency (DOFF-selectable), making it optimal for next-generation telecom and test equipment where signal integrity and timing determinism are non-negotiable.
Availability
CY7C1565KV18-450BZXC is available at Aetrix Electronics and suitable for network packet buffering, telecom switch fabric, and baseband processing applications requiring stable component supply, long-lifecycle support, and guaranteed Pb-free compliance.
Supply support for CY7C1565KV18-450BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, with emphasis on signal integrity and timing precision.
CY7C1565KV18 belongs to the QDR® II+ SRAM product line, engineered specifically for deterministic, high-bandwidth memory access in packet-switched infrastructure where concurrent read/write and sub-nanosecond timing control are critical.
FAQ
What is the function of the DOFF pin on CY7C1565KV18-450BZXC?
The DOFF pin controls the internal PLL: when pulled HIGH, the device operates in QDR II+ mode with 2.5-cycle read latency and supports up to 450 MHz clock frequency; when pulled LOW, the PLL is disabled and the device reverts to QDR I timing with 1-cycle latency and a maximum clock rate of 167 MHz. This dual-mode capability allows hardware-level performance scaling and debug flexibility without changing firmware or PCB layout.
How does the ZQ pin affect signal integrity in high-speed designs?
The ZQ pin connects to an external 240 Ω resistor to ground to calibrate the output driver impedance of Q[35:0], CQ, and CQ pins to precisely 50 Ω (0.2 × RQ). This eliminates reflections and ensures consistent edge rates across all 36 data lines and two echo clocks, reducing bit error rates in systems operating above 400 MHz without requiring discrete series termination resistors.
Can CY7C1565KV18-450BZXC perform simultaneous read and write operations to the same address?
No - while the device supports concurrent read and write operations to *different* addresses (due to independent RPS/WPS control), writing to an address currently being read from results in undefined data on Q[35:0] for that burst. The architecture guarantees coherency only for non-overlapping accesses; overlapping reads/writes to identical locations are not supported and must be managed by external arbitration logic.
What is the purpose of the QVLD signal, and how is it timed relative to data?
QVLD is a synchronous output that asserts coincident with the first valid 36-bit word of each four-word read burst and remains asserted for all subsequent words in that burst. It is edge-aligned to both CQ and CQ clocks, providing a zero-jitter, zero-skew timing reference for external latches - eliminating the need for manual delay tuning or adaptive deskew circuits in high-speed capture logic.
CY7C1565KV18-450BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 450 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1565KV18-450BZXC FAQ
1.How can I place an order for CY7C1565KV18-450BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1565KV18-450BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1565KV18-450BZXC reliable?
The price and inventory of CY7C1565KV18-450BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1565KV18-450BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1565KV18-450BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1565KV18-450BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1565KV18-450BZXC?
CY7C1565KV18-450BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1565KV18-450BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1565KV18-450BZXC?
For technical support, including CY7C1565KV18-450BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1565KV18-450BZXC requirements.
6.How does Aetrix verify that CY7C1565KV18-450BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1565KV18-450BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1565KV18-450BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1565KV18-450BZXC?
All CY7C1565KV18-450BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1565KV18-450BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1565KV18-450BZXC part is unused and in its original packaging.
Return procedure for CY7C1565KV18-450BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1565KV18-450BZXC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

