Infineon Technologies CY7C1565KV18-500BZC
- Part No.:
- CY7C1565KV18-500BZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1565KV18-500BZC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1565KV18-500BZC from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with 2M × 36 organization, four-word burst architecture, and 2.5-cycle read latency at 500 MHz. It features separate read/write ports, DDR interfaces on both ports (1000 Mbps effective data rate), 1.8-V core supply, and 1.4–1.8-V I/O supply. Used in high-bandwidth packet buffering for network switches and routers.
For engineers reviewing the CY7C1565KV18-500BZC datasheet, CY7C1565KV18-500BZC pinout, CY7C1565KV18-500BZC application, or CY7C1565KV18-500BZC equivalent, key selection criteria include concurrent read/write capability, echo clock timing support (CQ/CQ), QVLD data validity signaling, and PLL-enabled 2.5-cycle latency mode for deterministic high-speed memory access.
Technical Context
The CY7C1565KV18-500BZC implements a true dual-port synchronous SRAM architecture with physically independent read and write data paths-no bus turnaround required. Its QDR II+ core uses two input clocks (K and K) for precise DDR edge alignment and embeds a PLL to enable accurate data placement at 500 MHz.
Each transaction delivers four sequential 36-bit words per port, latched on alternating rising edges of K/K. The device supports depth expansion via RPS/WPS and byte-level write control via BWS[3:0], ensuring full data coherency and deterministic latency regardless of concurrent operation state.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 configuration) |
| Max Clock Frequency | 500 MHz - defines maximum sustained burst throughput of 4 × 36-bit words per 2 clock cycles |
| Read Latency | 2.5 cycles - fixed pipeline delay from RPS assertion to first valid Q[35:0] word, enabled when DOFF = HIGH |
| Core Supply Voltage | 1.8 V ± 0.1 V - powers internal logic and array; requires tight regulation for timing stability |
| I/O Supply Range | 1.4 V to 1.8 V - supports HSTL-compatible signaling and interoperability with 1.5-V or 1.8-V system buses |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - enables high-pin-count routing with controlled impedance for >500-MHz DDR interfaces |
| Data Valid Indicator | QVLD output - edge-aligned with CQ/CQ, provides unambiguous strobe for capturing valid Q[35:0] data |
Pinout & Package
Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, with 0.8-mm ball pitch and standard HSTL-compatible I/O layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K / K | Input clocks (positive/negative) | Rising edges sample all synchronous inputs (A, D[35:0], RPS, WPS, BWS[3:0]) and drive Q[35:0] outputs; define DDR timing reference |
| CQ / CQ | Echo clock outputs | Free-running, phase-aligned copies of K/K; simplify high-speed data capture by eliminating clock skew compensation in FPGA/ASIC receivers |
| Q[35:0] | Read data outputs | 36-bit DDR outputs driven on rising edges of K/K; tri-stated automatically when RPS is deasserted |
| D[35:0] | Write data inputs | 36-bit DDR inputs sampled on rising edges of K/K; ignored unless WPS is asserted |
| RPS / WPS | Read/write port selects | Active-low enables for independent port activation; allow depth expansion and concurrent transaction arbitration |
| BWS[3:0] | Byte write selects | Four independent active-low controls for 9-bit byte groups (D[8:0] to D[35:27]); enable partial writes without read-modify-write overhead |
| QVLD | Data validity indicator | Output pulse aligned with first valid Q[35:0] word in burst; eliminates need for fixed delay-based sampling windows |
| DOFF | PLL disable input | When LOW, disables internal PLL and reverts to QDR I mode (1-cycle latency, ≤167 MHz); used for fallback or low-power test modes |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data ports | Eliminates bus turnaround delays and contention, enabling true concurrent access without arbitration logic |
| Four-word burst architecture | Reduces address bus frequency by 4× versus single-word access-critical for minimizing PCB trace count in high-density switch fabrics |
| Integrated PLL with echo clocks (CQ/CQ) | Enables source-synchronous data capture at 500 MHz with sub-100-ps skew tolerance across wide temperature ranges |
| Programmable output impedance (ZQ pin) | Allows dynamic tuning of Q[35:0]/CQ/CQ driver strength to match PCB trace impedance (typically 50 Ω), reducing signal reflections |
| Synchronous self-timed writes | Internal write timing control ensures consistent setup/hold margins across voltage/temperature, removing external timing constraints |
Applications
| Network Packet Buffering | High-Speed Test Equipment Memory |
|---|---|
|
Use Scenario: Line-rate buffering of 10G/40G Ethernet frames in Layer 2/3 switching ASICs. IC Role / Device Role / Timing Role: Dual-port SRAM acting as ingress/egress FIFO with zero-turnaround latency between parser and scheduler engines. Use Value: 2.5-cycle read latency and concurrent R/W enable real-time frame queuing without pipeline stalls at 500 MHz clock. |
Use Scenario: Real-time waveform capture and pattern generation in automated test equipment (ATE) for SoC validation. IC Role / Device Role / Timing Role: High-throughput memory buffer interfacing directly with FPGA-based pattern generators and comparators. Use Value: QVLD and echo clocks eliminate timing closure challenges in multi-GHz digital I/O channels, improving test repeatability. |
| Telecom Baseband Processing | Defense Radar Signal Processing |
|
Use Scenario: Inter-stage buffering between FFT and channel estimation blocks in 5G massive MIMO baseband units. IC Role / Device Role / Timing Role: Burst-access memory providing deterministic latency for time-critical DSP pipelines. Use Value: Four-word burst transfers align precisely with 128-bit SIMD register widths, maximizing data throughput per clock cycle. |
Use Scenario: Pulse-Doppler radar front-end data buffering where deterministic latency and radiation-tolerant timing are critical. IC Role / Device Role / Timing Role: Synchronous SRAM serving as coherent memory for real-time beamforming coefficient updates. Use Value: Full data coherency and PLL-stabilized timing ensure reliable operation under thermal stress and voltage transients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T36120L10BG | 72-Mbit QDR II, 1000 MHz interface (500 MHz clock), no integrated PLL; relies on external clock management | Lacks echo clocks and QVLD; requires tighter board-level timing margin control | Preferred where system already includes precision clock distribution and lower power is prioritized over ease of timing closure |
| ISSI IS61WV102436B | 36-Mbit sync SRAM, single-port, 200 MHz max, no burst or DDR interface | Cannot support concurrent R/W; limited to simpler buffering or control-plane storage | Only suitable for cost-sensitive, non-real-time applications where bandwidth < 1 Gbps suffices |
Compared with IDT72T36120L10BG and IS61WV102436B, CY7C1565KV18-500BZC uniquely delivers guaranteed 2.5-cycle latency with integrated PLL, echo clocks, and QVLD-reducing FPGA logic overhead and PCB routing complexity in high-speed networking designs.
Availability
CY7C1565KV18-500BZC is available at Aetrix Electronics and suitable for network switch fabric design, high-speed test instrumentation, and telecom baseband processing requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for CY7C1565KV18-500BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications systems, with focus on reliability, speed, and integration.
CY7C1565KV18 belongs to Cypress's QDR II+ SRAM product line, engineered specifically for deterministic, low-latency, high-throughput memory interfacing in packet-switched infrastructure and real-time signal processing platforms.
FAQ
What is the function of the DOFF pin, and how does it affect timing?
The DOFF pin disables the internal PLL when pulled LOW, reverting the device to QDR I mode with 1-cycle read latency and a maximum operating frequency of 167 MHz. When HIGH, the PLL enables 2.5-cycle latency operation at up to 500 MHz. This pin allows runtime mode switching between high-speed and low-power configurations without changing external clock sources.
How does the ZQ pin configure output drive strength?
The ZQ pin connects to an external resistor (RQ) tied to ground, enabling automatic calibration of Q[35:0], CQ, and CQ output impedance to 0.2 × RQ. For example, a 250-Ω resistor sets output impedance to 50 Ω. Alternatively, tying ZQ to VDDQ enables minimum impedance mode-useful for short-trace, low-capacitance interconnects where stronger drive is needed.
Can CY7C1565KV18-500BZC support depth expansion, and how is it implemented?
Yes-depth expansion is supported using RPS and WPS signals. Multiple devices can be stacked vertically by connecting shared address, clock, and data buses while assigning unique RPS/WPS lines per device. Each RPS/WPS pair enables independent read/write activation, allowing seamless extension beyond 2M × 36 without external multiplexing logic.
What is the role of QVLD, and why is it critical for system timing?
QVLD is an edge-aligned output that pulses high only during valid Q[35:0] data periods within a burst. Unlike fixed-delay sampling, QVLD eliminates setup/hold uncertainty in high-speed receivers-especially in FPGAs-by providing a hardware-synchronized strobe. This reduces timing margin requirements and improves robustness across voltage/temperature variations.
CY7C1565KV18-500BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 500 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1565KV18-500BZC FAQ
1.How can I place an order for CY7C1565KV18-500BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1565KV18-500BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1565KV18-500BZC reliable?
The price and inventory of CY7C1565KV18-500BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1565KV18-500BZC is usually 5 days.
3.What payment methods are accepted for CY7C1565KV18-500BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1565KV18-500BZC transactions.
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CY7C1565KV18-500BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1565KV18-500BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1565KV18-500BZC?
For technical support, including CY7C1565KV18-500BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1565KV18-500BZC requirements.
6.How does Aetrix verify that CY7C1565KV18-500BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1565KV18-500BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1565KV18-500BZC meets industry standards.
7.What is the process for return or replacement of CY7C1565KV18-500BZC?
All CY7C1565KV18-500BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1565KV18-500BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1565KV18-500BZC part is unused and in its original packaging.
Return procedure for CY7C1565KV18-500BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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