Infineon Technologies CY7C1565KV18-500BZXC
- Part No.:
- CY7C1565KV18-500BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1565KV18-500BZXC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1565KV18-500BZXC from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with 2M × 36 organization, 500 MHz maximum clock frequency, 2.5-cycle read latency (DOFF = HIGH), and dual DDR interfaces on independent read/write ports. It delivers 1100 MT/s data transfer rate, operates at 1.8 V core / 1.4–1.8 V I/O, and is packaged in a 165-ball FBGA (13 × 15 × 1.4 mm) for high-bandwidth networking buffer applications.
For engineers reviewing the CY7C1565KV18-500BZXC datasheet, CY7C1565KV18-500BZXC pinout, CY7C1565KV18-500BZXC application, or CY7C1565KV18-500BZXC equivalent, key selection criteria include burst depth (four 36-bit words), echo clock support (CQ/CQ), QVLD timing indicator, PLL-based data alignment, and byte-write select (BWS[3:0]) granularity for partial writes.
Technical Context
The CY7C1565KV18-500BZXC implements a true quad data rate architecture with physically separate read and write data paths-eliminating bus turnaround overhead. Its internal 512K × 36 × 4 array structure enables concurrent read/write operations on the same address bus, latched alternately on rising edges of K and K clocks.
It integrates a phase-locked loop (PLL) for precise output data placement relative to echo clocks CQ/CQ, supports programmable output impedance via ZQ calibration, and provides synchronous self-timed writes with full data coherency. The DOFF pin selects between QDR II+ (2.5-cycle latency, up to 550 MHz) and QDR I (1-cycle latency, ≤167 MHz) operation modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36) |
| Max Clock Frequency | 500 MHz - defines system bandwidth ceiling and timing margin constraints |
| Read Latency | 2.5 cycles (DOFF = HIGH) - determines minimum pipeline depth for read-response synchronization |
| Data Rate | 1100 MT/s - achieved via DDR on both ports, enabling 8.8 Gbps aggregate throughput |
| Supply Voltages | VDD = 1.8 V ±0.1 V; VDDQ = 1.4–1.8 V - supports mixed-voltage interface design with HSTL-compatible I/O |
| Burst Length | Four 36-bit words per access - reduces address bus toggling and simplifies controller address sequencing |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - matches high-density PCB layouts for switch/router line cards |
Pinout & Package
Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, with 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K, K | Input clocks | Rising edges control all synchronous inputs/outputs; K drives read port, K drives write port |
| CQ, CQ | Echo clocks | Free-running, edge-aligned outputs synchronized to K/K - simplify high-speed data capture in FPGA/ASIC receivers |
| Q[35:0] | Read data outputs | DDR outputs driven on K/K rising edges; tri-stated when RPS is deasserted |
| D[35:0] | Write data inputs | DDR inputs sampled on K/K rising edges; ignored unless WPS is active |
| RPS, WPS | Port selects | Active-low synchronous enables - allow independent depth expansion without external gating logic |
| BWS[3:0] | Byte write selects | Per-byte write enable (BWS0=D[8:0], BWS1=D[17:9], etc.) - enables partial-word updates without read-modify-write |
| QVLD | Valid data indicator | Edge-aligned with CQ/CQ - signals valid Q[35:0] data for reliable latch timing in receiver logic |
| ZQ | Impedance calibration | Connects to external resistor to ground - tunes CQ/CQ/Q[35:0] output drive strength to match 50 Ω trace impedance |
| DOFF | PLL disable | Active-low mode selector - disables PLL to enter QDR I mode (1-cycle latency, lower max frequency) |
Key Features
| Feature | Design Value |
|---|---|
| Independent read/write ports | Eliminates data bus turnaround delay and contention - enables deterministic full-duplex memory access in packet buffering |
| Four-word burst architecture | Reduces address bus frequency by 4× versus single-word access - lowers controller pin count and routing complexity |
| Synchronous self-timed writes | Guarantees write completion within fixed clock cycles - removes need for external write acknowledge handshake |
| HSTL I/O with variable drive | Supports 1.4 V or 1.8 V VDDQ and impedance tuning via ZQ - ensures signal integrity across varied board stackups and trace lengths |
| JTAG 1149.1 test access | Enables boundary scan testing of interconnects in dense FBGA layouts - critical for production test coverage in telecom modules |
Applications
| High-Speed Packet Buffering | Network Switch Fabric Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 switches before forwarding decisions. IC Role / Device Role / Timing Role: Dual-port SRAM acting as a non-blocking, low-latency first-in-first-out (FIFO) buffer with concurrent read/write capability. Use Value: 2.5-cycle read latency and 1100 MT/s throughput enable sub-10 ns average access time for 64-byte packets, supporting 100 Gbps line-rate processing. | Use Scenario: Serving as distributed lookup table memory in multi-stage switch fabrics requiring simultaneous address translation and statistics update. IC Role / Device Role / Timing Role: Synchronous pipelined memory providing atomic read-modify-write for TCAM assist functions and counter updates. Use Value: Independent RPS/WPS and BWS[3:0] allow concurrent header lookup (read) and counter increment (write) without bus arbitration delay. |
| Telecom Line Card Buffering | Baseband Processing Memory |
Use Scenario: Temporarily storing framed TDM or CPRI data streams between framer and DSP subsystems in wireless base stations. IC Role / Device Role / Timing Role: Burst-mode SRAM interfacing directly with SerDes PHYs via echo-clocked (CQ/CQ) data capture. Use Value: CQ/CQ alignment and QVLD signaling eliminate setup/hold uncertainty - enabling reliable sampling at 500 MHz clock rates without dynamic deskew. | Use Scenario: Acting as shared instruction/data memory between multiple DSP cores in LTE/5G baseband units. IC Role / Device Role / Timing Role: High-bandwidth, low-latency memory node supporting parallel fetch-execution pipelines with deterministic latency. Use Value: Four-word burst and DDR I/O deliver 8.8 Gbps bandwidth - sufficient to feed dual 256-bit SIMD engines operating at 2 GHz without stalling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II+ SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L5PF | 550 MHz max clock; 2M × 36; no DOFF pin - fixed 2.5-cycle latency only; lacks ZQ calibration | Requires external impedance matching; less flexible for mixed-voltage designs | Preferred where highest speed is mandatory and board-level termination is already optimized |
| ISSI IS61WV102436B | 100 MHz max clock; asynchronous interface; no echo clocks or QVLD; 1M × 36 density | Lacks concurrent read/write; unsuitable for real-time packet buffering | Only viable for cost-sensitive, low-bandwidth control-plane memory where latency is non-critical |
Compared with IDT72T3615L5PF and IS61WV102436B, the CY7C1565KV18-500BZXC uniquely balances 500 MHz operation, programmable latency (via DOFF), and on-die impedance tuning - making it the only option among the three that supports both high-speed data plane buffering and robust signal integrity across varying PCB environments.
Availability
CY7C1565KV18-500BZXC is available at Aetrix Electronics and suitable for high-speed packet buffering, network switch fabric memory, and telecom line card buffering requiring stable component supply and long-term industrial availability.
Supply support for CY7C1565KV18-500BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
The CY7C1565KV18 belongs to Cypress's QDR® II+ SRAM product line, engineered specifically for deterministic, low-latency, full-duplex memory access in packet-switched infrastructure - targeting wireline and wireless base station applications demanding >10 Gbps sustained throughput.
FAQ
What is the function of the DOFF pin on CY7C1565KV18-500BZXC?
The DOFF pin controls the internal PLL: when asserted LOW, it disables the PLL and forces the device into QDR I mode with 1-cycle read latency and reduced maximum frequency (≤167 MHz). When tied HIGH (e.g., via 10 kΩ pull-up), the PLL is active, enabling QDR II+ mode with 2.5-cycle latency and full 500 MHz operation. This pin allows hardware-selectable latency/performance trade-offs without firmware changes.
How does the ZQ pin affect signal integrity in high-speed designs?
The ZQ pin connects to an external precision resistor (typically 50 Ω to ground) to calibrate the output driver impedance of Q[35:0], CQ, and CQ pins to 0.2 × RQ (i.e., ~10 Ω). This matches standard 50 Ω transmission lines, minimizing reflections and ensuring clean eye diagrams at 500 MHz. Leaving ZQ unconnected or tying it to GND violates specifications and causes unpredictable drive strength.
Can CY7C1565KV18-500BZXC perform simultaneous read and write to the same memory location?
Yes - the device guarantees full data coherency during concurrent access: if a write to an address occurs in the same cycle as a read from that same address, the read returns the newly written data. This behavior is ensured by internal pipelining and synchronous self-timed write circuitry, eliminating the need for external arbitration logic in applications like real-time statistics counters.
What is the role of the QVLD signal in system timing validation?
QVLD is a synchronous, edge-aligned output that pulses high exactly when valid data appears on Q[35:0], synchronized to CQ/CQ edges. It serves as a hardware-valid strobe for FPGA/ASIC input registers - replacing complex timing margin calculations with a deterministic capture enable, especially critical when operating near the 500 MHz limit where setup/hold margins shrink below 100 ps.
CY7C1565KV18-500BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 500 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1565KV18-500BZXC FAQ
1.How can I place an order for CY7C1565KV18-500BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1565KV18-500BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1565KV18-500BZXC reliable?
The price and inventory of CY7C1565KV18-500BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1565KV18-500BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1565KV18-500BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1565KV18-500BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1565KV18-500BZXC?
CY7C1565KV18-500BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1565KV18-500BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1565KV18-500BZXC?
For technical support, including CY7C1565KV18-500BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1565KV18-500BZXC requirements.
6.How does Aetrix verify that CY7C1565KV18-500BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1565KV18-500BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1565KV18-500BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1565KV18-500BZXC?
All CY7C1565KV18-500BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1565KV18-500BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1565KV18-500BZXC part is unused and in its original packaging.
Return procedure for CY7C1565KV18-500BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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