Infineon Technologies CY7C1565KV18-550BZXC
- Part No.:
- CY7C1565KV18-550BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1565KV18-550BZXC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1565KV18-550BZXC from Cypress Semiconductor is a 72-Mbit QDR® II+ SRAM with 2M × 36 organization, 550-MHz clock frequency, 2.5-cycle read latency, and separate read/write DDR ports. It delivers 1100-MHz data transfer on both ports using K/K input clocks and echo clocks CQ/CQ, enabling concurrent high-bandwidth memory access in network packet buffers and switch fabric controllers.
For engineers reviewing the CY7C1565KV18-550BZXC datasheet, CY7C1565KV18-550BZXC pinout, CY7C1565KV18-550BZXC application, or CY7C1565KV18-550BZXC equivalent, key selection criteria include its 1.8-V core / 1.4–1.8-V I/O supply range, JTAG 1149.1 compliance, PLL-based timing control, and DOFF-pin-selectable QDR I (1-cycle) vs. QDR II+ (2.5-cycle) latency modes.
Technical Context
The CY7C1565KV18-550BZXC implements a true quad data rate architecture with physically independent read and write data paths-no bus turnaround required. Its four-word burst transfers 144 bits per access cycle across two rising edges of K and K, achieving full data coherency via synchronous pipelined addressing and self-timed writes.
Internal operation relies on dual-edge-synchronized registers: all inputs (D[35:0], RPS, WPS, BWS[3:0], A[18:0]) are latched on K/K rising edges; all outputs (Q[35:0], QVLD, CQ, CQ) are edge-aligned to those same clocks. The integrated PLL ensures precise data placement, while ZQ enables dynamic output impedance tuning to match system trace impedance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36), supporting 144-bit-wide burst transfers per access |
| Max Clock Frequency | 550 MHz - enables 1100 MT/s DDR throughput on both read and write ports |
| Read Latency | 2.5 cycles (DOFF = HIGH); reduces to 1 cycle (QDR I mode) when DOFF = LOW |
| Supply Voltages | VDD = 1.8 V ±0.1 V; VDDQ = 1.4 V to 1.8 V - supports mixed-voltage system interfacing |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - fine-pitch layout optimized for high-speed signal integrity |
| I/O Standard | HSTL Class I inputs / variable-drive HSTL outputs - meets JEDEC SSTL-18 compatibility requirements |
| Timing Control | Integrated PLL + echo clocks (CQ/CQ) - eliminates external timing compensation circuitry |
Pinout & Package
Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, with 0.8-mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K / K | Input clocks | Rising edges latch all synchronous inputs and time Q[35:0] output transitions; K drives read port, K drives write port |
| CQ / CQ | Echo clocks | Free-running, phase-aligned copies of K/K - simplify high-speed data capture at FPGA/ASIC receivers |
| RPS / WPS | Port select controls | Active-LOW signals enabling independent read/write port activation without bus contention |
| BWS[3:0] | Byte write selects | Four independent active-LOW signals controlling 9-bit byte lanes (D[8:0] to D[35:27]) for partial-word writes |
| QVLD | Data validity indicator | Edge-aligned with CQ/CQ - asserts one cycle before first valid Q[35:0] word, enabling reliable DDR sampling |
| DOFF | PLL disable input | Active-LOW pin switching between QDR II+ (2.5-cycle latency, up to 550 MHz) and QDR I (1-cycle latency, ≤167 MHz) |
| ZQ | Impedance calibration | Connects to external resistor to ground to tune CQ/CQ/Q[35:0] output drive strength to 0.2 × RQ |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write DDR ports | Eliminates data bus turnaround delays and contention, enabling deterministic full-duplex memory access |
| Four-word burst architecture | Reduces address bus toggling by 75% versus single-word access - lowers EMI and routing complexity |
| Synchronous self-timed writes | Removes external write-strobe timing constraints; internal logic guarantees write completion within fixed clock cycles |
| JTAG 1149.1 test access port | Enables boundary scan testing, in-system programming, and production-level fault isolation without additional test hardware |
| Programmable output impedance (ZQ) | Allows real-time matching to PCB trace impedance - improves signal integrity without board-level termination resistors |
Applications
| Network Packet Buffering | Switch Fabric Controller Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet switches. IC Role / Device Role / Timing Role: High-throughput, low-latency shared memory buffer with simultaneous read (forwarding decision) and write (packet arrival) operations. Use Value: 1100-MT/s DDR bandwidth and 2.5-cycle latency enable line-rate processing of 10G/25G packets without pipeline stalls. |
Use Scenario: Holding forwarding tables and queue state in modular chassis-based routers. IC Role / Device Role / Timing Role: Dual-port SRAM acting as central lookup engine memory with deterministic access timing for parallel table searches. Use Value: Independent RPS/WPS control allows concurrent table updates and lookups, sustaining >90% memory utilization under bursty traffic loads. |
| Telecom Baseband Processing | High-Speed Test Equipment FIFO |
|
Use Scenario: Interfacing between DSP cores and RF front-end in 4G/LTE base stations. IC Role / Device Role / Timing Role: Synchronization buffer decoupling variable-rate processing stages while preserving sample timing integrity. Use Value: Echo clocks CQ/CQ provide receiver-side timing references aligned to source clock edges - eliminating skew-induced bit errors. |
Use Scenario: Capturing high-speed digital waveforms in automated test systems with real-time pattern analysis. IC Role / Device Role / Timing Role: Deep, low-latency capture memory supporting continuous streaming at >500 MHz effective sample rate. Use Value: DOFF-pin-selectable latency mode allows trade-off between maximum speed (2.5-cycle) and minimal jitter (1-cycle QDR I) during calibration phases. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T36150L10BG | 72-Mbit QDR II+, 1000 MHz interface (500 MHz clock), 2.5-cycle latency, 1.5-V VDDQ only | Lacks DOFF-selectable QDR I mode; requires stricter 1.5-V I/O supply; no ZQ impedance tuning | Preferred where higher interface speed is critical and system I/O voltage is fixed at 1.5 V |
| AS7C362000B-15PCCN | 72-Mbit sync SRAM, single-port, 15 ns access, 3.3-V core/I/O, no DDR or echo clocks | No concurrent read/write; no burst mode; no PLL or timing assist features | Suitable only for cost-sensitive, non-real-time buffering where bandwidth < 200 MB/s suffices |
Compared with IDT72T36150L10BG and AS7C362000B-15PCCN, CY7C1565KV18-550BZXC uniquely supports flexible I/O voltage (1.4–1.8 V), on-die impedance tuning (ZQ), and runtime latency mode switching (via DOFF), making it optimal for adaptive, high-integrity telecom and test equipment designs.
Availability
CY7C1565KV18-550BZXC is available at Aetrix Electronics and suitable for network packet buffering, switch fabric controller memory, and telecom baseband processing requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for CY7C1565KV18-550BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and system-level timing robustness.
The CY7C1565KV18 belongs to Cypress's QDR® II+ SRAM product line, engineered specifically for deterministic, full-duplex memory access in multi-gigabit packet processing and real-time signal conditioning systems.
FAQ
What is the function of the DOFF pin on CY7C1565KV18-550BZXC?
The DOFF pin is an active-LOW PLL disable input. When pulled LOW, it disables the internal PLL and forces the device into QDR I mode with 1-cycle read latency and maximum operating frequency of 167 MHz. When held HIGH (typically via 10-kΩ pull-up), the device operates in QDR II+ mode at up to 550 MHz with 2.5-cycle latency. This pin enables runtime mode selection without changing clocking infrastructure.
How does the ZQ pin affect signal integrity in high-speed designs?
The ZQ pin connects to an external resistor to ground (RQ) to calibrate the output driver impedance of Q[35:0], CQ, and CQ pins to 0.2 × RQ. This dynamic impedance matching minimizes reflections on high-speed data and echo clock lines, reducing eye closure and jitter without requiring discrete series termination resistors on the PCB.
Can CY7C1565KV18-550BZXC support partial-word writes, and how is this implemented?
Yes - it supports byte-level writes via four active-LOW byte write select signals: BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18], and BWS3 controls D[35:27]. Each BWS signal gates its corresponding 9-bit lane during write operations; deselected bytes retain prior values, enabling efficient update of metadata or control fields without full-word overwrites.
What role do CQ and CQ echo clocks play in system timing design?
CQ and CQ are free-running, phase-aligned copies of the K and K input clocks, respectively. They provide receiver-side timing references that track source-clock jitter and skew, allowing FPGA or ASIC capture logic to sample Q[35:0] data with relaxed setup/hold margins. Their presence eliminates need for complex delay-locked loops or manual deskew circuitry in high-speed interfaces.
CY7C1565KV18-550BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 550 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1565KV18-550BZXC FAQ
1.How can I place an order for CY7C1565KV18-550BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1565KV18-550BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1565KV18-550BZXC reliable?
The price and inventory of CY7C1565KV18-550BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1565KV18-550BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1565KV18-550BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1565KV18-550BZXC transactions.
Note: Certain payment methods may incur a processing fee.
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CY7C1565KV18-550BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1565KV18-550BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1565KV18-550BZXC?
For technical support, including CY7C1565KV18-550BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1565KV18-550BZXC requirements.
6.How does Aetrix verify that CY7C1565KV18-550BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1565KV18-550BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1565KV18-550BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1565KV18-550BZXC?
All CY7C1565KV18-550BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1565KV18-550BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1565KV18-550BZXC part is unused and in its original packaging.
Return procedure for CY7C1565KV18-550BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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