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Infineon Technologies CY7C1565V18-400BZC

Part No.:
CY7C1565V18-400BZC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1565V18-400BZC.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,039

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Product details

Overview

CY7C1565V18 from Cypress Semiconductor is a 72-Mbit QDR-II+ SRAM with 2M × 36 organization, 4-word burst architecture, 2.5-cycle read latency, and dual DDR interfaces operating at 400 MHz (800 MT/s effective data rate). It features separate read/write ports, echo clocks (CQ/CQ), QVLD data-valid indicator, and HSTL I/O for high-speed networking and packet buffering applications.

For engineers reviewing the CY7C1565V18 datasheet, CY7C1565V18 pinout, CY7C1565V18 application, or CY7C1565V18 equivalent, key selection criteria include 2M × 36 depth-width configuration, 165-ball FBGA package, 1.8V core / 1.4–1.8V I/O supply range, DLL-enabled timing alignment, and JTAG 1149.1 test access support.

Technical Context

This device implements QDR-II+ architecture with fully independent synchronous read and write ports sharing a multiplexed address bus. Address latching occurs on alternating rising edges of K and K clocks, enabling concurrent access without bus turnaround. The internal Delay Lock Loop (DLL) aligns CQ/CQ echo clocks to K/K for precise DDR data capture.

All data transfers occur on both rising edges of K and K - four 36-bit words per read/write burst - delivering sustained 28.8 GB/s bandwidth. Write operations use on-chip self-timed circuitry, while byte write selects (BWS[3:0]) enable granular 9-bit byte-level updates without disturbing adjacent data.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density72 Mbit (2M × 36 organization)
Maximum Clock Frequency400 MHz - enables 800 MT/s DDR data transfer on both ports
Read Latency2.5 clock cycles - deterministic timing for pipeline-synchronized systems
Core Supply Voltage1.8 V ± 0.1 V - matches low-voltage ASIC/FPGA I/O domains
I/O Supply Range1.4 V to 1.8 V - supports HSTL Class I/II compatibility and impedance tuning via ZQ
Burst Length4-word - reduces address bus toggling frequency by 4× vs. single-word access
Package165-ball FBGA (15 × 17 × 1.4 mm) - optimized for high-density routing in telecom line cards

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free option available.

Pin/TerminalCircuit RoleDesign Meaning
D[35:0]Synchronous write data inputs36-bit parallel input sampled on rising edges of K/K; supports full-word or byte-selectable writes via BWS[3:0]
Q[35:0]Synchronous read data outputs36-bit DDR output driven on both K/K rising edges; tri-stated when RPS is deasserted
RPS / WPSActive-low port select controlsIndependent gating of read/write paths; enables depth expansion using multiple devices
BWS[3:0]Byte write select inputsFour independent active-low signals controlling 9-bit byte lanes - allows partial-word updates without read-modify-write
CQ / CQDDR echo clocksFree-running output clocks synchronized to K/K; simplify timing closure for FPGA-based data capture logic
QVLDData validity indicatorEdge-aligned with CQ/CQ; asserts one cycle before first valid Q[35:0] word, enabling reliable latch enable generation
ZQOutput impedance calibration inputConnects to external 240 Ω resistor to ground to tune CQ/CQ/Q[35:0] drive strength to match 50 Ω system trace impedance
DOFFDLL disable controlPulling low disables DLL, reverting device to QDR-I mode (max 167 MHz); used for fallback timing or power reduction

Key Features

FeatureDesign Value
Separate read/write data portsEliminates data bus turnaround delay and contention - essential for full-duplex packet buffering in switches/routers
4-word burst + DDR interfaceDelivers 28.8 GB/s sustained bandwidth at 400 MHz - meets line-rate requirements for 100 GbE and OTU4 interfaces
On-chip DLL with echo clocksEnables zero-skew data capture at 800 MT/s without external phase alignment circuitry
HSTL Class I/II I/O with ZQ calibrationEnsures signal integrity across 15+ inch PCB traces at >400 MHz; supports JEDEC-compliant memory subsystems
JTAG 1149.1 test access portEnables boundary-scan testing and in-system debug of high-speed memory interconnects

Applications

High-Speed Packet BufferingNetwork Switch Fabric Memory

Use Scenario: Storing ingress/egress packet headers and payloads in multi-terabit Ethernet switches.

IC Role / Device Role / Timing Role: Dedicated QDR-II+ SRAM serving as shared buffer pool with simultaneous read (forwarding engine) and write (ingress parser) access.

Use Value: 2.5-cycle latency and 4-word burst reduce header lookup overhead; separate ports prevent contention during cut-through forwarding.

Use Scenario: Implementing distributed queue management in modular chassis-based routers with distributed forwarding ASICs.

IC Role / Device Role / Timing Role: Local fabric memory node providing low-latency, deterministic access to scheduling and congestion control metadata.

Use Value: 72-Mbit density in compact FBGA supports 16+ queues per port; DLL-aligned echo clocks simplify timing closure across backplane traces.

Optical Transport Network (OTN) Framer BuffersHigh-Performance Computing Interconnect Cache

Use Scenario: Buffering OTU3/OTU4 frame alignment words and FEC parity bytes in DWDM line cards.

IC Role / Device Role / Timing Role: Synchronous burst SRAM interfacing directly with SerDes PHYs and framer ASICs via HSTL buses.

Use Value: 1.4–1.8V VDDQ range matches framer I/O voltage; QVLD signal enables precise alignment of OTN frame boundaries.

Use Scenario: Serving as low-latency cache tag directory in GPU-to-GPU interconnects (e.g., NVLink-compatible topologies).

IC Role / Device Role / Timing Role: High-bandwidth, pipelined memory holding coherence state bits and address translation metadata.

Use Value: 2M × 36 organization maps efficiently to 64-byte cache line metadata; 400 MHz clock synchronizes with GPU memory controller pipelines.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1563V184M × 18 organization (72 Mbit), same QDR-II+ architecture, 20-bit address busRequires wider data bus (18-bit vs. 36-bit) and different byte-write select mapping (BWS[1:0])Select when system uses 18-bit datapath or requires higher depth over width
AS7C3256A-15JCINAsynchronous 32K × 8 SRAM, no DDR, no DLL, 15 ns access time, SOJ-32 packageLacks burst, echo clocks, QVLD, and concurrent port capability - unsuitable for QDR-II+ timing-critical systemsOnly for legacy designs requiring pin-compatible drop-in replacement with relaxed timing constraints

Compared with CY7C1563V18 and AS7C3256A-15JCIN, CY7C1565V18 delivers double the per-cycle data width (36-bit vs. 18/8-bit), integrated DLL timing control, and true concurrent read/write - making it uniquely suited for modern packet processing where bandwidth and determinism are co-constrained.

Availability

CY7C1565V18 is available at Aetrix Electronics and suitable for high-speed packet buffering, network switch fabric memory, optical transport framer buffers, and HPC interconnect cache applications requiring stable component supply and long-term industrial availability.

Supply support for CY7C1565V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable analog/digital ICs for communications, industrial, and automotive markets.

CY7C1565V18 belongs to the QDR-II+ SRAM product line, designed specifically for deterministic, high-bandwidth memory interfacing in networking and telecom infrastructure where concurrent read/write, low latency, and DDR timing precision are mandatory.

FAQ

What is the function of the ZQ pin on CY7C1565V18?

The ZQ pin calibrates the output driver impedance of Q[35:0], CQ, and CQ signals to match the system's data bus characteristic impedance. It must be connected to a 240 Ω resistor to ground; alternatively, tying it to VDDQ enables minimum-impedance mode. Direct connection to GND or leaving it unconnected violates specification and risks signal integrity failure.

Can CY7C1565V18 operate without the DLL enabled?

Yes - asserting DOFF low disables the DLL, reverting the device to QDR-I timing mode with maximum 167 MHz operation. In this mode, echo clocks (CQ/CQ) remain functional but lose DLL alignment, and read latency increases to 3 cycles. This mode is intended for fallback timing validation or reduced-power operation, not full QDR-II+ performance.

How does the BWS[3:0] signal map to the 36-bit data bus?

BWS[3:0] controls four independent 9-bit byte lanes: BWS0 → D[8:0], BWS1 → D[17:9], BWS2 → D[26:18], BWS3 → D[35:27]. Each active-low signal enables writing to its corresponding 9-bit segment; deselected lanes retain prior data. This enables atomic partial-word updates without read-modify-write cycles.

Is CY7C1565V18 compatible with standard HSTL-18 I/O standards?

Yes - CY7C1565V18 implements HSTL Class I and II compliant drivers and receivers, supporting VDDQ = 1.4 V to 1.8 V. Its VREF input sets the switching threshold at 0.5 × VDDQ, and ZQ calibration ensures output impedance matches 50 Ω transmission lines - meeting JEDEC HSTL-18 specifications for point-to-point and multidrop configurations.

CY7C1565V18-400BZC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
400 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1565V18-400BZC FAQ

1.How can I place an order for CY7C1565V18-400BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1565V18-400BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1565V18-400BZC reliable?

The price and inventory of CY7C1565V18-400BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1565V18-400BZC is usually 5 days.

3.What payment methods are accepted for CY7C1565V18-400BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1565V18-400BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1565V18-400BZC?

CY7C1565V18-400BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1565V18-400BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1565V18-400BZC?

For technical support, including CY7C1565V18-400BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1565V18-400BZC requirements.

6.How does Aetrix verify that CY7C1565V18-400BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1565V18-400BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1565V18-400BZC meets industry standards.

7.What is the process for return or replacement of CY7C1565V18-400BZC?

All CY7C1565V18-400BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1565V18-400BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1565V18-400BZC part is unused and in its original packaging.

Return procedure for CY7C1565V18-400BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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