Infineon Technologies CY7C1565V18-400BZXC

Overview

CY7C1565V18 from Cypress Semiconductor is a 72-Mbit QDR-II+ SRAM with 2M × 36 organization, 4-word burst architecture, 2.5-cycle read latency, and DDR interfaces on independent read/write ports operating at 400 MHz (800 MT/s effective). It delivers concurrent high-bandwidth memory access for network packet buffering in 10G/40G line cards and FPGA-based protocol accelerators.

For engineers reviewing the CY7C1565V18 datasheet, CY7C1565V18 pinout, CY7C1565V18 application, or CY7C1565V18 equivalent, key selection criteria include its 165-ball FBGA package, HSTL I/O compatibility, DLL-controlled timing alignment, QVLD data-valid signaling, and support for depth expansion via BWS[3:0] and port-select controls.

Technical Context

This device implements a synchronous pipelined QDR-II+ architecture with physically separate read and write data paths, eliminating bus turnaround overhead. It uses dual input clocks (K and K) - both rising edges drive DDR transfers - and echo clocks (CQ/CQ) synchronized to K for precise data capture at 800 MT/s.

Internally organized as four 512K × 36 arrays, it latches multiplexed address inputs on alternating K edges and supports synchronous self-timed writes. The DLL aligns output data to CQ/CQ edges, while ZQ enables impedance tuning of Q[35:0], CQ, and CQ outputs to match system trace impedance.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth burst SRAM applications.

Compared with CY7C1565V18, CY7C1563V18 offers identical density and speed but halves the data width-increasing interconnect count and power per bit-while AS7C3256B-15JCIN lacks all QDR-II+ timing features required for deterministic high-speed packet buffering.

Availability

CY7C1565V18 is available at Aetrix Electronics and suitable for network infrastructure, FPGA co-processing, telecom baseband, and high-speed test equipment requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1565V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding real-time systems, with expertise in SRAM, Flash, and PSoC architectures.

CY7C1565V18 belongs to the QDR-II+ SRAM product line, engineered specifically for deterministic, low-latency, concurrent memory access in packet-switched and signal-processing applications where DDR SDRAM timing uncertainty is unacceptable.

FAQ

What is the minimum VDDQ voltage supported by CY7C1565V18?

The device supports VDDQ from 1.4 V to 1.8 V, exceeding the QDR Consortium's 1.5 V ± 0.1 V specification. At 1.4 V, HSTL output drive strength is reduced but remains compliant with Class I HSTL receiver thresholds, enabling lower-power operation in thermally constrained systems.

How does the DOFF pin affect timing behavior?

When DOFF is pulled low, the internal DLL is disabled and the device operates in QDR-I mode with maximum clock frequency reduced to 167 MHz. All timing parameters shift to QDR-I specifications - notably longer tAA and tHZ - and echo clocks lose DLL alignment, requiring redesign of capture logic.

Can CY7C1565V18 be used with non-HSTL controllers?

No - its inputs require HSTL-compatible voltage thresholds (VIH = 0.75 × VDDQ, VIL = 0.25 × VDDQ), and outputs drive HSTL levels. Direct interfacing with LVCMOS or SSTL controllers requires level-shifting buffers or FPGA I/O banks configured for HSTL Class I/II standards.

What is the function of the ZQ pin, and how must it be connected?

ZQ calibrates output driver impedance to match the system data bus. It must be connected to a 240 Ω resistor tied to ground to set Q[35:0], CQ, and CQ output impedance to 48 Ω (0.2 × 240 Ω). Leaving ZQ unconnected or tying it to VSS causes undefined output strength and signal integrity failure.