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Infineon Technologies CY7C1565XV18-600BZXC

Part No.:
CY7C1565XV18-600BZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1565XV18-600BZXC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,753

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Product details

Overview

CY7C1565XV18 from Infineon Technologies (formerly Cypress) is a 2M × 36, 72-Mbit QDR® II+ Xtreme SRAM with separate read/write ports, 600 MHz clock operation (1200 MT/s DDR), 2.5-cycle read latency, and HSTL I/O interfaces. It delivers high-bandwidth memory for network packet buffering in telecom line cards and FPGA co-processor caches requiring deterministic low-latency access.

For engineers reviewing the CY7C1565XV18 datasheet, CY7C1565XV18 pinout, CY7C1565XV18 application, or CY7C1565XV18 equivalent, key selection criteria include burst depth (4-word), DOFF-configurable latency mode (QDR I vs. QDR II+), echo clock timing (CQ/CQ), QVLD data validity signaling, and 165-ball FBGA package compatibility with high-speed PCB layout constraints.

Technical Context

This SRAM implements true dual-port synchronous architecture: independent K and K clocks drive read and write operations on shared address bus A[18:0], enabling concurrent transactions without bus turnaround. The internal PLL synchronizes CQ/CQ echo clocks to K/K for precise DDR data capture at system level.

It supports byte-selectable writes via BWS[3:0] (CY7C1565XV18), full data coherency across bursts, and programmable output impedance via ZQ pin tied to external resistor. Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4–1.6 V enables 1.5 V interface compatibility.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 organization)
Max Clock Frequency 600 MHz - determines maximum sustained bandwidth of 43.2 GB/s (36-bit × 1200 MT/s)
Read Latency 2.5 cycles (with DOFF HIGH) - enables predictable timing for pipeline-constrained systems like switch fabric controllers
I/O Interface HSTL Class I inputs / variable-drive HSTL outputs - ensures signal integrity at >600 MHz with controlled slew and termination
Package 165-ball FBGA (13 × 15 × 1.4 mm) - supports fine-pitch routing and thermal dissipation in dense telecom modules
Supply Voltages VDD = 1.8 V ± 0.1 V (core); VDDQ = 1.4–1.6 V (I/O) - allows interoperability with 1.5 V logic while maintaining core efficiency
JTAG Support IEEE 1149.1 compliant TAP - enables boundary-scan test and debug in assembled systems without physical probe access

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free finish.

Pin/Terminal Circuit Role Design Meaning
D[35:0] Synchronous write data input 36-bit parallel data sampled on rising edges of K/K; supports byte-write masking via BWS[3:0]
Q[35:0] Synchronous read data output 36-bit parallel output aligned to CQ/CQ; tristated automatically when RPS is deasserted
RPS Read port select (active LOW) Enables read burst of four sequential words; sampled on rising edge of K clock
WPS Write port select (active LOW) Initiates write burst; sampled on rising edge of K clock; ignores D[35:0] when deasserted
BWS[3:0] Byte write select (active LOW) Four independent 9-bit byte enables: BWS0→D[8:0], BWS1→D[17:9], BWS2→D[26:18], BWS3→D[35:27]
A[18:0] Multiplexed address input 19-bit address latched on alternating K/K edges for read/write; supports full 2M-depth addressing
K / K Dual differential clock inputs Rising edges control all synchronous operations; K used for read port, K for write port
CQ / CQ Echo clock outputs Free-running, phase-aligned copies of K/K; simplify high-speed data capture in FPGA/ASIC receivers
QVLD Data validity indicator Asserted coincident with valid Q[35:0]; edge-aligned to CQ/CQ for reliable strobing
DOFF PLL disable control LOW disables internal PLL, reverting device to QDR I mode (≤167 MHz, 1-cycle latency)
ZQ Output impedance calibration Connects to external resistor to ground to set CQ/Q[35:0] output impedance to 0.2 × RQ
TCK/TMS/TDI/TDO JTAG test access port Supports IEEE 1149.1 boundary scan for production test and field diagnostics

Key Features

Feature Design Value
Separate read/write data ports Eliminates bus turnaround delays - enables simultaneous read and write in same clock cycle for full-duplex throughput
Four-word burst architecture Reduces effective address bus frequency by 4× - lowers routing complexity and timing margin pressure on FPGA/ASIC address paths
2.5-cycle read latency (DOFF HIGH) Provides deterministic, low-jitter response for real-time packet processing pipelines where latency predictability outweighs absolute minimum delay
Programmable output drive via ZQ Enables dynamic impedance matching to PCB trace characteristics - improves signal integrity without fixed external termination resistors
QVLD synchronized to CQ/CQ Delivers unambiguous data-valid timing reference - removes need for receiver-side delay-locked loops or manual deskew calibration

Applications

Network Packet Buffering FPGA Co-Processor Cache

Use Scenario: Line card in 100G Ethernet switch buffers ingress/egress packets before classification and forwarding.

IC Role / Device Role / Timing Role: High-throughput, low-latency shared memory between MAC layer and traffic manager ASIC.

Use Value: Concurrent read/write ports sustain 43.2 GB/s bidirectional bandwidth; 2.5-cycle latency ensures sub-5 ns jitter in time-critical scheduling decisions.

Use Scenario: Off-chip cache for Xilinx UltraScale+ FPGA performing real-time video analytics with streaming frame buffers.

IC Role / Device Role / Timing Role: Burst-access scratchpad memory interfaced directly to AXI4-Stream master ports via custom PHY.

Use Value: Four-word burst reduces AXI address rate by 75%; echo clocks (CQ/CQ) align with FPGA IDELAYCTRL for zero-skew capture at 600 MHz.

Telecom Baseband Processing High-Speed Test Equipment Memory

Use Scenario: Digital pre-distortion (DPD) engine in 5G massive MIMO radio unit stores coefficient lookup tables and real-time error samples.

IC Role / Device Role / Timing Role: Deterministic latency memory for closed-loop feedback path between ADC/DAC and DSP cores.

Use Value: DOFF pin allows runtime switching to QDR I mode (1-cycle latency) during calibration phases; HSTL I/O ensures clean sampling at RF sampling rates.

Use Scenario: Pattern memory in automated test equipment (ATE) generating multi-GHz digital stimulus waveforms.

IC Role / Device Role / Timing Role: High-reliability waveform storage with guaranteed data coherency across burst reads/writes.

Use Value: Full data coherency guarantees most-current sample availability; JTAG boundary scan validates interconnect integrity post-assembly.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615L10BG 36-bit QDR II+, 1000 MHz (2 Gbps), 2.5-cycle latency, 165-ball FBGA - higher speed but requires 1.5 V VDDQ only; no DOFF mode Targeted at newer 100G+ switch designs needing >48 GB/s bandwidth; lacks QDR I fallback mode Select when system clock exceeds 600 MHz and DOFF flexibility is unnecessary; verify VDDQ tolerance matches board supply
ISSI IS61QW25636A-600BQI 256K × 36 QDR II+, 600 MHz, 2.5-cycle latency, 165-ball FBGA - identical timing but lower density (9 Mbit vs. 72 Mbit); no JTAG Suitable for cost-sensitive, space-constrained embedded controllers where full 72 Mbit not required Choose for footprint-compatible drop-in where memory depth can be partitioned across multiple devices; omit if JTAG test is mandatory

Compared with IDT72T3615L10BG and IS61QW25636A-600BQI, CY7C1565XV18 uniquely combines 72-Mbit density, DOFF-configurable latency mode, and integrated JTAG - making it optimal for legacy-compatible telecom upgrades requiring both performance headroom and debug flexibility.

Availability

CY7C1565XV18 is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor caching, and telecom baseband processing requiring stable component supply across extended product lifecycles.

Supply support for CY7C1565XV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensor, and memory solutions for industrial, automotive, and communications markets.

CY7C1565XV18 belongs to the QDR® II+ Xtreme SRAM product line, designed specifically for high-speed networking infrastructure where deterministic latency, concurrent access, and signal integrity at multi-GHz data rates are critical.

FAQ

What is the function of the DOFF pin, and how does it affect timing?

The DOFF pin disables the internal PLL when asserted LOW, forcing the device into QDR I mode with 1-cycle read latency and maximum clock frequency of 167 MHz. In normal operation (DOFF HIGH), the PLL enables 2.5-cycle latency at up to 600 MHz. Timing parameters differ significantly between modes - QDR I mode uses different setup/hold windows and eliminates echo clock generation.

How does the ZQ pin calibrate output impedance, and what resistor value is required?

ZQ connects to an external resistor (RQ) tied to ground; the device measures RQ and sets CQ, CQ, and Q[35:0] output impedance to 0.2 × RQ. For standard 50 Ω trace matching, use RQ = 250 Ω. Alternatively, tying ZQ to VDDQ enables minimum output drive strength - useful for short traces or reduced EMI requirements.

Can CY7C1565XV18 be used in depth-expanded configurations, and how is port selection handled?

Yes - depth expansion is supported using RPS and WPS signals. Each device in a stack uses unique RPS/WPS assertions to enable its read/write ports independently. Address bus A[18:0] remains common; higher-order bits are decoded externally. This allows building larger memory arrays (e.g., 4M × 36) while preserving per-device burst timing and latency.

What is the role of QVLD, and how does it relate to CQ and CQ timing?

QVLD is a synchronous output that asserts coincident with valid data on Q[35:0]. It is edge-aligned to both CQ and CQ echo clocks - meaning its rising/falling edges occur simultaneously with those clocks' transitions. This provides a hardware-strobed validity signal that eliminates receiver-side timing uncertainty when capturing DDR data at 600 MHz.

CY7C1565XV18-600BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
600 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1565XV18-600BZXC FAQ

1.How can I place an order for CY7C1565XV18-600BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1565XV18-600BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1565XV18-600BZXC reliable?

The price and inventory of CY7C1565XV18-600BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1565XV18-600BZXC is usually 5 days.

3.What payment methods are accepted for CY7C1565XV18-600BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1565XV18-600BZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1565XV18-600BZXC?

CY7C1565XV18-600BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1565XV18-600BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1565XV18-600BZXC?

For technical support, including CY7C1565XV18-600BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1565XV18-600BZXC requirements.

6.How does Aetrix verify that CY7C1565XV18-600BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1565XV18-600BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1565XV18-600BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1565XV18-600BZXC?

All CY7C1565XV18-600BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1565XV18-600BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1565XV18-600BZXC part is unused and in its original packaging.

Return procedure for CY7C1565XV18-600BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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