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Infineon Technologies CY7C1565XV18-633BZXC

Part No.:
CY7C1565XV18-633BZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1565XV18-633BZXC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,733

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Product details

Overview

CY7C1565XV18 from Infineon Technologies (formerly Cypress) is a 2M × 36, 72-Mbit QDR® II+ Xtreme SRAM with separate read/write ports, 633 MHz clock support, 2.5-cycle read latency, DDR interfaces on both ports (1266 MT/s effective), and HSTL I/O compatible with 1.5 V supply. It serves as high-bandwidth buffer memory in network packet processors and telecom line cards requiring concurrent access and deterministic timing.

For engineers reviewing the CY7C1565XV18 datasheet, CY7C1565XV18 pinout, CY7C1565XV18 application, or CY7C1565XV18 equivalent, key selection criteria include its 2.5-cycle latency mode, DOFF-controlled PLL bypass, echo clock (CQ/CQ) timing alignment, and 165-ball FBGA package compatibility with high-speed PCB layout constraints.

Technical Context

The device implements a synchronous pipelined architecture with independent read and write ports sharing a multiplexed address bus. Address latching occurs on alternating rising edges of K and K clocks, enabling four-word burst transfers per access without bus turnaround.

It integrates a phase-locked loop (PLL) for precise data placement and supports two operational modes: QDR II+ mode (2.5-cycle latency, up to 633 MHz) when DOFF is HIGH, and QDR I mode (1-cycle latency, ≤167 MHz) when DOFF is LOW. Echo clocks CQ and CQ are free-running and synchronized to K/K for simplified high-speed data capture.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 organization)
Max Clock Frequency 633 MHz - enables 1266 MT/s DDR throughput on both ports
Read Latency 2.5 cycles - deterministic timing for pipeline-aligned read responses
I/O Voltage VDDQ = 1.4–1.6 V - supports 1.5 V HSTL-compatible signaling
Core Voltage VDD = 1.8 V ± 0.1 V - low-power 1.8 V core with separate I/O rail
Package 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-density routing
Burst Length Four-word burst - reduces address bus toggling frequency by 4× vs. single-word access

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, Pb-free.

Pin/Terminal Circuit Role Design Meaning
D[35:0] Synchronous write data input 36-bit wide data bus sampled on rising edges of K/K; supports byte-selectable writes via BWS[3:0]
Q[35:0] Synchronous read data output 36-bit wide output driven on rising edges of K/K; tristated automatically when RPS is deasserted
RPS Read port select Active-low signal sampled on K rising edge; initiates 4-word burst read sequence
WPS Write port select Active-low signal sampled on K rising edge; enables write operation and data acceptance
BWS[3:0] Byte write select Four active-low signals controlling 9-bit byte lanes; allows partial-word writes without read-modify-write
K / K Differential clock inputs Single-ended clock pair (not true differential); rising edges control all synchronous operations and DDR data transfer
CQ / CQ Echo clock outputs Free-running clocks synchronized to K/K; used for source-synchronous data capture at receiver
QVLD Valid data indicator Output pulse edge-aligned with CQ/CQ; signals validity of Q[35:0] during read bursts
DOFF PLL disable control Active-low pin; disables internal PLL to revert to QDR I timing (≤167 MHz, 1-cycle latency)
ZQ Impedance calibration reference Connects to external resistor to ground to calibrate output driver impedance (0.2 × RQ) for signal integrity

Key Features

Feature Design Value
Separate read/write ports Enables true concurrent transactions-no bus turnaround required between reads and writes
Four-word burst architecture Reduces address bus switching frequency by 75%, lowering EMI and routing complexity
Integrated PLL with DOFF control Allows dynamic selection between high-performance QDR II+ mode (633 MHz) and legacy QDR I mode (167 MHz)
HSTL I/O with variable drive Ensures signal integrity on long traces; supports impedance matching via ZQ pin and 1.5 V VDDQ
JTAG 1149.1 test access port Enables boundary scan testing and in-system diagnostics without additional test fixtures

Applications

Network Packet Processing Telecom Line Cards

Use Scenario: High-speed buffering of ingress/egress packet headers and metadata in 10G/25G Ethernet switch ASICs.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared memory between parser and scheduler engines with zero-latency port arbitration.

Use Value: 2.5-cycle read latency and concurrent read/write enable real-time header inspection and forwarding decision within one clock cycle budget.

Use Scenario: Frame buffering in OTN/framer subsystems handling OC-192/STM-64 traffic.

IC Role / Device Role / Timing Role: Burst-access memory providing deterministic latency for time-critical cell assembly/disassembly logic.

Use Value: Four-word burst and echo clocks (CQ/CQ) simplify timing closure at 633 MHz, reducing FPGA interface logic overhead.

Baseband Processing High-Frequency Trading Systems

Use Scenario: Real-time channel estimation and precoding coefficient storage in massive MIMO base stations.

IC Role / Device Role / Timing Role: Low-latency scratchpad memory accessed simultaneously by multiple DSP cores via dedicated ports.

Use Value: Independent RPS/WPS controls allow overlapping computation and memory update without contention or arbitration delay.

Use Scenario: Ultra-low-latency order book caching in FPGA-accelerated trading engines.

IC Role / Device Role / Timing Role: Deterministic-access memory serving as hot data store for market depth updates and execution triggers.

Use Value: 1266 MT/s effective bandwidth and QVLD-stamped output ensure sub-5 ns round-trip latency for critical price-change detection.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T36150 36-bit, 4M × 36, 500 MHz max, QDR II, no DOFF mode or echo clocks Lacks PLL bypass and CQ/CQ timing aids; requires tighter board-level skew control Preferred where QDR II timing suffices and cost sensitivity outweighs 2.5-cycle latency advantage
ISSI IS61WV102436B 36-bit, 1M × 36, 200 MHz async SRAM, no DDR or burst capability No concurrent ports, no clocked interface; limited to lower-throughput control-plane buffers Only suitable for non-real-time metadata storage where deterministic latency is not required

Compared with IDT72T36150 and IS61WV102436B, CY7C1565XV18 delivers 26% higher bandwidth and hardware-supported latency flexibility via DOFF, making it uniquely suited for next-generation packet processing where timing predictability and interface simplification are critical.

Availability

CY7C1565XV18 is available at Aetrix Electronics and suitable for network packet processing, telecom line cards, baseband processing, and high-frequency trading systems requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for CY7C1565XV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns and supports the full QDR® SRAM portfolio, including legacy Cypress designs like the CY7C1565XV18.

This device belongs to Infineon's QDR® II+ Xtreme SRAM product line, engineered specifically for deterministic, high-throughput memory interfacing in networking, telecom, and high-performance computing infrastructure.

FAQ

What is the function of the DOFF pin?

The DOFF (PLL Turn Off) pin is an active-low control that disables the internal phase-locked loop. When pulled LOW, the device reverts to QDR I timing mode with 1-cycle read latency and maximum operating frequency of 167 MHz. In normal operation, DOFF must be pulled HIGH via ≤10 kΩ resistor to enable QDR II+ mode at up to 633 MHz.

How does the ZQ pin affect signal integrity?

The ZQ pin connects to an external resistor to ground (typically 240 Ω) to calibrate the output driver impedance of Q[35:0], CQ, and CQ pins to 0.2 × RQ (≈48 Ω). This ensures consistent HSTL-compatible termination across process/voltage/temperature, minimizing reflections and improving timing margin on high-speed traces.

Can CY7C1565XV18 operate with only one clock input?

No. The device requires both K and K clock inputs. Although they are single-ended (not true differential), both signals are essential: K captures address, control, and write data; K captures read data and controls read output timing. Omitting either clock violates the timing architecture and prevents functional operation.

What is the role of QVLD in system timing?

QVLD is an edge-aligned valid-data strobe synchronized to CQ and CQ. It asserts one cycle before valid data appears on Q[35:0], indicating precisely when output data meets setup/hold requirements at the receiving device. This eliminates need for fixed delay assumptions and enables robust source-synchronous capture in FPGA or ASIC receivers.

CY7C1565XV18-633BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Last Time Buy
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
633 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1565XV18-633BZXC FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1565XV18-633BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1565XV18-633BZXC reliable?

The price and inventory of CY7C1565XV18-633BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1565XV18-633BZXC is usually 5 days.

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6.How does Aetrix verify that CY7C1565XV18-633BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1565XV18-633BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1565XV18-633BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1565XV18-633BZXC?

All CY7C1565XV18-633BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1565XV18-633BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1565XV18-633BZXC part is unused and in its original packaging.

Return procedure for CY7C1565XV18-633BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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