Infineon Technologies CY7C1565XV18-633BZXC
- Part No.:
- CY7C1565XV18-633BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1565XV18-633BZXC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1565XV18 from Infineon Technologies (formerly Cypress) is a 2M × 36, 72-Mbit QDR® II+ Xtreme SRAM with separate read/write ports, 633 MHz clock support, 2.5-cycle read latency, DDR interfaces on both ports (1266 MT/s effective), and HSTL I/O compatible with 1.5 V supply. It serves as high-bandwidth buffer memory in network packet processors and telecom line cards requiring concurrent access and deterministic timing.
For engineers reviewing the CY7C1565XV18 datasheet, CY7C1565XV18 pinout, CY7C1565XV18 application, or CY7C1565XV18 equivalent, key selection criteria include its 2.5-cycle latency mode, DOFF-controlled PLL bypass, echo clock (CQ/CQ) timing alignment, and 165-ball FBGA package compatibility with high-speed PCB layout constraints.
Technical Context
The device implements a synchronous pipelined architecture with independent read and write ports sharing a multiplexed address bus. Address latching occurs on alternating rising edges of K and K clocks, enabling four-word burst transfers per access without bus turnaround.
It integrates a phase-locked loop (PLL) for precise data placement and supports two operational modes: QDR II+ mode (2.5-cycle latency, up to 633 MHz) when DOFF is HIGH, and QDR I mode (1-cycle latency, ≤167 MHz) when DOFF is LOW. Echo clocks CQ and CQ are free-running and synchronized to K/K for simplified high-speed data capture.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization) |
| Max Clock Frequency | 633 MHz - enables 1266 MT/s DDR throughput on both ports |
| Read Latency | 2.5 cycles - deterministic timing for pipeline-aligned read responses |
| I/O Voltage | VDDQ = 1.4–1.6 V - supports 1.5 V HSTL-compatible signaling |
| Core Voltage | VDD = 1.8 V ± 0.1 V - low-power 1.8 V core with separate I/O rail |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-density routing |
| Burst Length | Four-word burst - reduces address bus toggling frequency by 4× vs. single-word access |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data input | 36-bit wide data bus sampled on rising edges of K/K; supports byte-selectable writes via BWS[3:0] |
| Q[35:0] | Synchronous read data output | 36-bit wide output driven on rising edges of K/K; tristated automatically when RPS is deasserted |
| RPS | Read port select | Active-low signal sampled on K rising edge; initiates 4-word burst read sequence |
| WPS | Write port select | Active-low signal sampled on K rising edge; enables write operation and data acceptance |
| BWS[3:0] | Byte write select | Four active-low signals controlling 9-bit byte lanes; allows partial-word writes without read-modify-write |
| K / K | Differential clock inputs | Single-ended clock pair (not true differential); rising edges control all synchronous operations and DDR data transfer |
| CQ / CQ | Echo clock outputs | Free-running clocks synchronized to K/K; used for source-synchronous data capture at receiver |
| QVLD | Valid data indicator | Output pulse edge-aligned with CQ/CQ; signals validity of Q[35:0] during read bursts |
| DOFF | PLL disable control | Active-low pin; disables internal PLL to revert to QDR I timing (≤167 MHz, 1-cycle latency) |
| ZQ | Impedance calibration reference | Connects to external resistor to ground to calibrate output driver impedance (0.2 × RQ) for signal integrity |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Enables true concurrent transactions-no bus turnaround required between reads and writes |
| Four-word burst architecture | Reduces address bus switching frequency by 75%, lowering EMI and routing complexity |
| Integrated PLL with DOFF control | Allows dynamic selection between high-performance QDR II+ mode (633 MHz) and legacy QDR I mode (167 MHz) |
| HSTL I/O with variable drive | Ensures signal integrity on long traces; supports impedance matching via ZQ pin and 1.5 V VDDQ |
| JTAG 1149.1 test access port | Enables boundary scan testing and in-system diagnostics without additional test fixtures |
Applications
| Network Packet Processing | Telecom Line Cards |
|---|---|
|
Use Scenario: High-speed buffering of ingress/egress packet headers and metadata in 10G/25G Ethernet switch ASICs. IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared memory between parser and scheduler engines with zero-latency port arbitration. Use Value: 2.5-cycle read latency and concurrent read/write enable real-time header inspection and forwarding decision within one clock cycle budget. |
Use Scenario: Frame buffering in OTN/framer subsystems handling OC-192/STM-64 traffic. IC Role / Device Role / Timing Role: Burst-access memory providing deterministic latency for time-critical cell assembly/disassembly logic. Use Value: Four-word burst and echo clocks (CQ/CQ) simplify timing closure at 633 MHz, reducing FPGA interface logic overhead. |
| Baseband Processing | High-Frequency Trading Systems |
|
Use Scenario: Real-time channel estimation and precoding coefficient storage in massive MIMO base stations. IC Role / Device Role / Timing Role: Low-latency scratchpad memory accessed simultaneously by multiple DSP cores via dedicated ports. Use Value: Independent RPS/WPS controls allow overlapping computation and memory update without contention or arbitration delay. |
Use Scenario: Ultra-low-latency order book caching in FPGA-accelerated trading engines. IC Role / Device Role / Timing Role: Deterministic-access memory serving as hot data store for market depth updates and execution triggers. Use Value: 1266 MT/s effective bandwidth and QVLD-stamped output ensure sub-5 ns round-trip latency for critical price-change detection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T36150 | 36-bit, 4M × 36, 500 MHz max, QDR II, no DOFF mode or echo clocks | Lacks PLL bypass and CQ/CQ timing aids; requires tighter board-level skew control | Preferred where QDR II timing suffices and cost sensitivity outweighs 2.5-cycle latency advantage |
| ISSI IS61WV102436B | 36-bit, 1M × 36, 200 MHz async SRAM, no DDR or burst capability | No concurrent ports, no clocked interface; limited to lower-throughput control-plane buffers | Only suitable for non-real-time metadata storage where deterministic latency is not required |
Compared with IDT72T36150 and IS61WV102436B, CY7C1565XV18 delivers 26% higher bandwidth and hardware-supported latency flexibility via DOFF, making it uniquely suited for next-generation packet processing where timing predictability and interface simplification are critical.
Availability
CY7C1565XV18 is available at Aetrix Electronics and suitable for network packet processing, telecom line cards, baseband processing, and high-frequency trading systems requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for CY7C1565XV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns and supports the full QDR® SRAM portfolio, including legacy Cypress designs like the CY7C1565XV18.
This device belongs to Infineon's QDR® II+ Xtreme SRAM product line, engineered specifically for deterministic, high-throughput memory interfacing in networking, telecom, and high-performance computing infrastructure.
FAQ
What is the function of the DOFF pin?
The DOFF (PLL Turn Off) pin is an active-low control that disables the internal phase-locked loop. When pulled LOW, the device reverts to QDR I timing mode with 1-cycle read latency and maximum operating frequency of 167 MHz. In normal operation, DOFF must be pulled HIGH via ≤10 kΩ resistor to enable QDR II+ mode at up to 633 MHz.
How does the ZQ pin affect signal integrity?
The ZQ pin connects to an external resistor to ground (typically 240 Ω) to calibrate the output driver impedance of Q[35:0], CQ, and CQ pins to 0.2 × RQ (≈48 Ω). This ensures consistent HSTL-compatible termination across process/voltage/temperature, minimizing reflections and improving timing margin on high-speed traces.
Can CY7C1565XV18 operate with only one clock input?
No. The device requires both K and K clock inputs. Although they are single-ended (not true differential), both signals are essential: K captures address, control, and write data; K captures read data and controls read output timing. Omitting either clock violates the timing architecture and prevents functional operation.
What is the role of QVLD in system timing?
QVLD is an edge-aligned valid-data strobe synchronized to CQ and CQ. It asserts one cycle before valid data appears on Q[35:0], indicating precisely when output data meets setup/hold requirements at the receiving device. This eliminates need for fixed delay assumptions and enables robust source-synchronous capture in FPGA or ASIC receivers.
CY7C1565XV18-633BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 633 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1565XV18-633BZXC FAQ
1.How can I place an order for CY7C1565XV18-633BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1565XV18-633BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1565XV18-633BZXC reliable?
The price and inventory of CY7C1565XV18-633BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1565XV18-633BZXC is usually 5 days.
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Once your CY7C1565XV18-633BZXC order is processed, you will receive an email with the shipment details and tracking number.
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5.How can I obtain technical support or documentation for CY7C1565XV18-633BZXC?
For technical support, including CY7C1565XV18-633BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1565XV18-633BZXC requirements.
6.How does Aetrix verify that CY7C1565XV18-633BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1565XV18-633BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1565XV18-633BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1565XV18-633BZXC?
All CY7C1565XV18-633BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1565XV18-633BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1565XV18-633BZXC part is unused and in its original packaging.
Return procedure for CY7C1565XV18-633BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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