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Infineon Technologies CY7C1568KV18-400BZXCT

Part No.:
CY7C1568KV18-400BZXCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1568KV18-400BZXCT.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,473

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Product details

Overview

CY7C1568KV18-400BZXCT from Cypress Semiconductor is a 72-Mbit (4M × 18) DDR II+ synchronous SRAM with two-word burst architecture, 2.5-cycle read latency, and 400 MHz maximum clock frequency. It operates with core VDD = 1.8 V ± 0.1 V and I/O VDDQ = 1.4 V to 1.8 V, features HSTL-compatible I/O, and uses dual input clocks (K/K) and echo clocks (CQ/CQ) for precise DDR timing in high-speed memory subsystems.

For engineers reviewing the CY7C1568KV18-400BZXCT datasheet, CY7C1568KV18-400BZXCT pinout, CY7C1568KV18-400BZXCT application, or CY7C1568KV18-400BZXCT equivalent, this device supports deterministic low-latency burst reads/writes in networking packet buffers, FPGA co-processor caches, and real-time signal processing pipelines where synchronized DDR timing and QVLD-driven data capture are critical.

Technical Context

The CY7C1568KV18 implements a pipelined synchronous architecture where all address, control, and data signals are registered on rising edges of K and K clocks. Read data is driven on both K and K edges, with QVLD edge-aligned to CQ/CQ for reliable capture without external strobes.

Its DDR II+ mode (DOFF = HIGH) delivers 2.5-cycle read latency at up to 400 MHz, while DOFF = LOW enables DDR I mode (1-cycle latency, ≤167 MHz). The integrated PLL ensures accurate data placement, and ZQ pin enables programmable output impedance matching to system bus termination.

Key Specifications

Parameter Value and Actual Design Meaning
Memory density 72 Mbit (4M × 18 organization), enabling compact high-bandwidth buffer storage
Max clock frequency 400 MHz - defines maximum sustained burst throughput of 1.6 GB/s (2 × 18-bit × 400 MHz)
Read latency 2.5 clock cycles (DDR II+ mode) - determines minimum read-to-read turnaround and pipeline depth
VDD / VDDQ Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4 V to 1.8 V - supports mixed-voltage system integration and low-power operation
Interface standard HSTL Class I inputs / variable-drive HSTL outputs - ensures signal integrity at >400 MHz with controlled slew and termination
Package 165-ball FBGA (13 × 15 × 1.4 mm) - provides fine-pitch routing for high-speed DDR layout with thermal and electrical optimization
Special features QVLD output and echo clocks CQ/CQ - eliminate need for external data capture logic in multi-SRAM systems

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FBGA), 13 mm × 15 mm × 1.4 mm, RoHS-compliant (Pb-free).

Pin/Terminal Circuit Role Design Meaning
DQ[17:0] Synchronous bidirectional data bus 18-bit DDR data path; sampled on K/K rising edges during writes, driven on K/K rising edges during reads with QVLD alignment
K / K Differential clock inputs Rising edges control all synchronous registers; K initiates transactions, K and K jointly time data transfers
CQ / CQ Output echo clocks Free-running, K-synchronized clocks aligned to Q[17:0] transitions - used directly for data capture in FPGA/ASIC receivers
QVLD Valid data indicator Asserted synchronously with CQ/CQ rising edges to signal valid DQ[17:0] - eliminates setup/hold uncertainty in high-speed interfaces
DOFF PLL disable control Active-low pin that switches device between DDR II+ (2.5-cycle latency, 400 MHz) and DDR I (1-cycle latency, ≤167 MHz) modes
ZQ Impedance calibration reference Connects to external resistor to ground to calibrate output driver strength (0.2 × RQ) for optimal signal integrity
LD Load command input Sampled on K rising edge to latch address and R/W state - initiates each burst transaction (2 words per LD assertion)
BWS[1:0] Byte write select Active-low controls DQ[8:0] (BWS0) and DQ[17:9] (BWS1); enables partial-word writes without read-modify-write overhead

Key Features

Feature Design Value
Two-word burst architecture Reduces address bus toggling by 50% versus single-word SRAMs - lowers EMI and simplifies controller address generation
QVLD + echo clock synchronization Enables zero-setup/zero-hold data capture in FPGA fabric - removes need for dynamic phase alignment or delay chains
Programmable output impedance (ZQ) Matches system trace impedance without external series resistors - improves signal fidelity and reduces BOM count
DOFF-selectable latency mode Hardware-switchable between 2.5-cycle (high-speed) and 1-cycle (legacy compatibility) read latency - supports design reuse across speed grades
JTAG 1149.1 boundary scan Supports IEEE-compliant test access for production ICT and board-level diagnostics - no additional test logic required

Applications

Networking Packet Buffer FPGA Co-Processor Cache

Use Scenario: Storing ingress/egress packet headers and metadata in 10G/25G Ethernet line cards with strict latency budgets.

IC Role / Device Role / Timing Role: High-throughput, low-latency burst-access SRAM serving as first-level packet buffer between MAC and traffic manager.

Use Value: 2.5-cycle read latency and QVLD-aligned echo clocks enable deterministic sub-2.5 ns data valid window - meeting tight inter-packet gap timing constraints.

Use Scenario: Providing scratchpad memory for FPGA-based digital signal processors executing real-time FFT or filtering algorithms.

IC Role / Device Role / Timing Role: Synchronous DDR II+ SRAM interfaced directly to FPGA I/O banks with HSTL support and calibrated drive strength.

Use Value: ZQ-calibrated outputs and CQ/CQ echo clocks eliminate timing closure challenges in 400 MHz memory interfaces - reducing FPGA timing iteration cycles.

Real-Time Video Frame Buffer Industrial Motion Control FIFO

Use Scenario: Holding uncompressed 4K video lines during pixel-rate scaling and color-space conversion in broadcast encoders.

IC Role / Device Role / Timing Role: Dual-port-capable burst SRAM acting as line buffer with simultaneous read/write bursts via independent K/K timing.

Use Value: Two-word burst transfers match common video macroblock widths - minimizing bus arbitration and maximizing pixel throughput at 400 MHz clock rate.

Use Scenario: Buffering position commands and encoder feedback in servo drives requiring jitter-free motion profile execution.

IC Role / Device Role / Timing Role: Deterministic-latency SRAM providing glitch-free command FIFO between motion controller and PWM generator.

Use Value: DOFF pin allows runtime switching to 1-cycle DDR I mode during safety-critical phases - guaranteeing worst-case 2.4 ns read response (at 167 MHz).

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C35128PFS-15TIN 512 K × 18 async SRAM; no DDR interface, no echo clocks, no QVLD; 15 ns access time Lacks burst architecture and DDR timing - suitable only for non-pipelined, lower-bandwidth control-plane buffering Select when deterministic nanosecond access (not GHz bandwidth) is prioritized over throughput and when controller lacks DDR clock management.
IS61WV102418BLL-10TLI 1M × 18 sync SRAM; single-data-rate, 10 ns cycle time, no PLL or echo clocks No burst or DDR capability - requires full address re-latching per word; incompatible with DDR II+ timing protocols Choose for cost-sensitive industrial controllers where 100 MHz max clock and simple control logic outweigh bandwidth needs.

Compared with AS7C35128PFS-15TIN and IS61WV102418BLL-10TLI, the CY7C1568KV18-400BZXCT uniquely delivers DDR II+ burst throughput at 400 MHz with hardware-synchronized data capture - making it irreplaceable in applications demanding >1 GB/s sustained memory bandwidth with sub-3 ns timing predictability.

Availability

CY7C1568KV18-400BZXCT is available at Aetrix Electronics and suitable for networking packet buffers, FPGA co-processor caches, real-time video frame buffers, and industrial motion control FIFOs requiring stable component supply across extended product lifecycles.

Supply support for CY7C1568KV18-400BZXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications systems.

This device belongs to Cypress's QDR II+/DDR II+ SRAM product line, engineered specifically for deterministic, high-bandwidth memory interfacing in networking, telecom, and real-time processing applications where DDR timing precision and burst efficiency are mandatory.

FAQ

What is the function of the DOFF pin on CY7C1568KV18-400BZXCT?

The DOFF pin is an active-low PLL disable control. When asserted LOW, it disables the internal PLL and forces the device into DDR I mode with 1-cycle read latency and a maximum operating frequency of 167 MHz. When held HIGH (typically via 10 kΩ pull-up), the device operates in DDR II+ mode at up to 400 MHz with 2.5-cycle latency. This pin enables hardware-selectable performance modes without firmware changes.

How does the QVLD signal improve system timing margin?

QVLD is edge-aligned with the rising edges of the echo clocks CQ and CQ, directly indicating when DQ[17:0] data is valid. This eliminates the need for complex PCB trace length matching or FPGA-based dynamic phase adjustment, as receivers can use QVLD as a ready strobe. In practice, this yields ≥0.45 ns guaranteed data valid window referenced to CQ/CQ - significantly easing timing closure at 400 MHz.

Can CY7C1568KV18-400BZXCT operate with VDDQ = 1.5 V?

Yes. The device supports VDDQ from 1.4 V to VDD (1.8 V), explicitly including 1.5 V operation. This is confirmed in the "DC Electrical Characteristics" section of the datasheet (Document 001-15880 Rev. *R), where parameters like VIH and VIL are specified across the full 1.4–1.8 V range. Using 1.5 V VDDQ is valid for interfacing with 1.5 V FPGA I/O banks while maintaining full timing compliance.

What is the purpose of the ZQ pin and how must it be connected?

ZQ is an impedance calibration reference input. It must be connected to a precision resistor (RQ) tied to ground - typically 240 Ω - to set output driver strength to 0.2 × RQ (e.g., 48 Ω). Alternatively, connecting ZQ directly to VDDQ enables minimum-impedance mode. It must never be left floating or tied to GND, as improper connection causes undefined output drive strength and signal integrity failure.

CY7C1568KV18-400BZXCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II+
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
400 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1568KV18-400BZXCT FAQ

1.How can I place an order for CY7C1568KV18-400BZXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1568KV18-400BZXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1568KV18-400BZXCT reliable?

The price and inventory of CY7C1568KV18-400BZXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1568KV18-400BZXCT is usually 5 days.

3.What payment methods are accepted for CY7C1568KV18-400BZXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1568KV18-400BZXCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1568KV18-400BZXCT?

CY7C1568KV18-400BZXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1568KV18-400BZXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1568KV18-400BZXCT?

For technical support, including CY7C1568KV18-400BZXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1568KV18-400BZXCT requirements.

6.How does Aetrix verify that CY7C1568KV18-400BZXCT is sourced from the original manufacturer or authorized distributors?

All CY7C1568KV18-400BZXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1568KV18-400BZXCT meets industry standards.

7.What is the process for return or replacement of CY7C1568KV18-400BZXCT?

All CY7C1568KV18-400BZXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1568KV18-400BZXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1568KV18-400BZXCT part is unused and in its original packaging.

Return procedure for CY7C1568KV18-400BZXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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